fi324
Abstract: I-226
Text: Specifications *six4 # Model $ Carbon film variable resistor i3P4ilfBf% Customer Specification Number : @P4i#*si$5 Customer Part Name Wk3a"af% Customer Yart Number %+i85$5 TOCOS Part Name wines% TOCOS Specification Number RY -7 7 2 1 ! S ED #I Siened bv
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ABljifiB91c
07kFt
TP96NOON
fi324
I-226
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RC0402
Abstract: No abstract text available
Text: Product Specification - Feb. 13, 2003 V.04 Supersedes Date of Jan. 15, 2003 DATA SHEET CHIP RESISTORS RC0402 5%; 1% 2 Chip Resistor Surface Mount RC 7 0402 SERIES SCOPE This specification describes RC 0402 series chip resistors made by thick film process.
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RC0402
RC0402
HBK073
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RC0402
Abstract: No abstract text available
Text: Product Specification - Jan. 15, 2003 V.03 Supersedes Date of Jul. 04, 2002 DATA SHEET CHIP RESISTORS RC0402 5%; 1% 2 Chip Resistor Surface Mount RC 7 0402 SERIES SCOPE This specification describes RC 0402 series chip resistors made by thick film process.
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RC0402
RC0402
HBK073
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Untitled
Abstract: No abstract text available
Text: Product Specification - Nov. 28, 2002 V.03 Supersedes Date of Jul. 04, 2002 DATA SHEET CHIP RESISTORS RC0603 5%; 1% 2 Chip Resistor Surface Mount RC 7 0603 SERIES SCOPE This specification describes RC 0603 series chip resistors made by thick film process.
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RC0603
RC0603
ynsc001
ynsc002
HBK073
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Untitled
Abstract: No abstract text available
Text: Product Specification - Jul. 07, 2003 V.05 Supersedes Date of Feb. 13, 2003 DATA SHEET CHIP RESISTORS RC0603 5%; 1% 2 Chip Resistor Surface Mount RC 7 0603 SERIES SCOPE This specification describes RC 0603 series chip resistors made by thick film process.
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RC0603
RC0603
ynsc001
ynsc002
HBK073
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Untitled
Abstract: No abstract text available
Text: Product Specification - Feb. 13, 2003 V.04 Supersedes Date of Nov. 28, 2002 DATA SHEET CHIP RESISTORS RC0603 5%; 1% 2 Chip Resistor Surface Mount RC 7 0603 SERIES SCOPE This specification describes RC 0603 series chip resistors made by thick film process.
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RC0603
RC0603
ynsc001
ynsc002
HBK073
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Untitled
Abstract: No abstract text available
Text: Product Specification - Feb. 13, 2003 V.04 Supersedes Date of Jan. 15, 2003 DATA SHEET CHIP RESISTORS RC0402 5%; 1% 2 Chip Resistor Surface Mount RC 7 0402 SERIES SCOPE This specification describes RC 0402 series chip resistors made by thick film process.
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RC0402
RC0402
meta18
HBK073
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Untitled
Abstract: No abstract text available
Text: Product Specification – Sep 19, 2003 V.6 Supersedes Date of Jul. 07, 2003 DATA SHEET CHIP RESISTORS RC0603 5%; 1% 2 Chip Resistor Surface Mount RC 7 0603 SERIES SCOPE This specification describes RC 0603 series chip resistors made by thick film process.
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RC0603
RC0603
ynsc001
ynsc002
HBK073
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philips resistor metal film RMF
Abstract: No abstract text available
Text: Philips Components Product specification RMW03/05/07/10 RMF03/05/07/10 Radial mounted power resistors FEATURES DESCRIPTION • High power dissipation in small volume RMW: The resistor element is a resistive wire which is wound in a single layer on a fibre glass core.
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RMF03:
RMF05:
RMF07:
RMF10:
10-6/K
philips resistor metal film RMF
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RMW07
Abstract: No abstract text available
Text: • High power dissipation in small volume RMW: The resistor element is a resistive wire which is wound in a single layer on a fibre glass core. • Low solder spot temperature • Very stable mounting. APPLICATIONS • These resistors have been designed to
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co5/20
RMF03:
RMF05:
RMF07:
RMF10:
10-6/K
RMW07
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YAGEO RC0402
Abstract: RC0402 RC0402 yageo rc0402 packing
Text: Product Specification – Jan. 08, 2004 V.6 Supersedes Date of Sep. 30, 2003 DATA SHEET CHIP RESISTORS RC0402 5%; 1% 2 Chip Resistor Surface Mount RC 7 0402 SERIES SCOPE This specification describes RC 0402 series chip resistors made by thick film process.
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RC0402
RC0402
HBK073
YAGEO RC0402
RC0402 yageo
rc0402 packing
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Untitled
Abstract: No abstract text available
Text: Product Specification – Sep. 04, 2003 V.4 Supersedes Date of Dec 20, 2002 DATA SHEET CHIP RESISTORS ARRAY YC124 8Pin/4R 5%; 1% 2 Chip Resistor Surface Mount YC SERIES 6 124 SCOPE This specification describes YC124 series chip resistors made by thick film process.
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YC124
YC124
ynsc009
HBK073
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yc164
Abstract: No abstract text available
Text: Product Specification – Sep. 30, 2003 V.4 Supersedes Date of Dec. 20, 2002 DATA SHEET CHIP RESISTORS ARRAY YC164 8Pin/4R 5%; 1% 2 Chip Resistor Surface Mount YC SERIES 6 164 SCOPE This specification describes YC164 series chip resistors made by thick film process.
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YC164
YC164
ynsc009
HBK073
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ali m3812
Abstract: ali m3812 CPU IC BA 3812 M3812 M38127M8-XXXFP M38123M6 M38123M6-XXXSP M38122M2XXXFP D0806 m38127m8-xxxsp
Text: MITSUBISHI MICROCOMPUTERS 3812 Group SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER The various microcomputers in the 3812 group include variations of internal memory size and packaging. For de tails, refer to the section on part numbering. • • • Clock X |N-X 0 u t . Internal feedback resistor
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P52/SClk
P2o-P23,
ali m3812
ali m3812 CPU
IC BA 3812
M3812
M38127M8-XXXFP
M38123M6
M38123M6-XXXSP
M38122M2XXXFP
D0806
m38127m8-xxxsp
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bd 3806 fs
Abstract: TDA 3806 Y21T 38063M
Text: MITSUBISHI MICROCOMPUTERS 3806 Group S IN G L E -C H IP 8 -B IT C M O S M IC R O C O M P U T E R DESCRIPTION •C lo c k generating c ir c u it . Internal feedback resistor T he 3806 group is 8 -b it m icro co m p u te r based on the 740 fa m ily
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H-DF047-C
KI-9609
3806GRQUP
bd 3806 fs
TDA 3806
Y21T
38063M
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equivalent of 662K
Abstract: MICRON POWER RESISTOR MLS micron fuse resistors mps 0851 MICRON POWER RESISTOR 24W 662k MPR 55 F resistor ceramic MDS-1212 ML10L meg05n
Text: Micron Power Resistors Part Numbering System M N S Type MP - Pin terminal MH - Lug terminal MN - Vertical lead terminal MNS 0 5 Rated power 02 - 2W 10 - 10W 15 - 15W Element G-wire -wound type ceramic core S-Wire -wound type. (glass fiber core) R-Metal Oxide Film
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adc0809 INTERFACe with microprocessor
Abstract: No abstract text available
Text: ADC0816/ ADC0817 NATL SEMICON]} LINEAR SflE d • b S G H E 4 □073021 7 ^ MNSCS ADC0816/ADC0817 8-Bit jllP Compatible A /D Converters with 16-Channel Multiplexer G eneral Description Features The ADC0816, ADC0817 data acquisition component is a monolithic CMOS device with an 8-bit anaiog-to-digital con
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ADC0816/
ADC0817
ADC0816/ADC0817
16-Channel
ADC0816,
ADC0817
16-single-ended
AD4-A015)
adc0809 INTERFACe with microprocessor
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RESISTOR AXIAL
Abstract: AIR FLOW DETECTOR CIRCUIT DIAGRAM pcb layout wiring diagram for triac to potentiometer OM5428 Phase control circuit soft start triac 1M resistor soft start phase control SCHEMATIC DIAGRAM OF MOTOR DIMMER AND PCB BOARD metal detector circuit with pcb metal detector diagram PI
Text: Engineering Sample Information MODULE ASSEMBLY 2007 Feb 08 HM211 OM5428 Demonstration Board INTEGRATED ELECTRONIC SOLUTIONS 1BUTLER D RIVE HENDON SA 5014 AUSTRALIA Integrated Electronic Solutions, Hendon, South Australia Engineering Sample Information OM5428 Demonstration Board
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HM211
OM5428
HM211
RESISTOR AXIAL
AIR FLOW DETECTOR CIRCUIT DIAGRAM pcb layout
wiring diagram for triac to potentiometer
Phase control circuit soft start triac
1M resistor
soft start phase control
SCHEMATIC DIAGRAM OF MOTOR DIMMER AND PCB BOARD
metal detector circuit with pcb
metal detector diagram PI
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26BH
Abstract: STP03 STK 4144 application circuit SI002
Text: MICROELECTRONICS \_ J * Ê £re*//*nc* XL24E410 iflE* 4-Bit Microcontroller Emulator KEY FEATURES OVERVIEW • Low voltage, single power source V d d - 2.3 -5.5V ■ Memory — E2PROM for program (max.): 8192 x 8 bits — General-purpose RAM : 256 x 4 bits
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XL24E410
XL24E410DS
26BH
STP03
STK 4144 application circuit
SI002
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MPC2710
Abstract: poly silicon resistor TA-295 trasistor mpc2710b trasistor power H1L-STD-883 UPC2710B uPC2710 X1011
Text: CORP. N.A . E , D.D. WED 09.21’94 11:15/ST. 1 1 : 1 2 / NO. 3301512-173 P, GET- Q ualification Test Results o n S i MMI C ( u s e N E S A T 3 P r o c e s s ) ^ ¿ 2 7 /o r Prepared on : September 8,1994 Prepared by : Taizo Kato Engineer Assistant Manager
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15/ST.
19/ST,
20/ST,
21/ST.
MPC2710
poly silicon resistor
TA-295
trasistor
mpc2710b
trasistor power
H1L-STD-883
UPC2710B
uPC2710
X1011
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RMW20
Abstract: RMW05 RMF07 907W RMF10 RMW07
Text: 1998 Aug 28 1 >2000 V ∆R/R max.: ±2% + 0.1 Ω short time overload Insulation voltage ∆R/R max.: ±1% + 0.1 Ω climatic tests IEC 60115-1 25/155/56 7W − 1 k to 100 kΩ RMF07 275 °C 1.6 Ω to 7.5 kΩ 0.68 to 1.5 Ω RMW07 ∆R/R max.: ±5% + 0.1 Ω
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RMW03
RMF07
RMW07
RMF05
RMW05
RMF10
RMW10
RMW15
RMW20
rectan-25/20
RMW20
RMW05
RMF07
907W
RMF10
RMW07
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rold RCE
Abstract: 4288A
Text: MITSUBISHI DIGITAL ASSP M66512P/FP LASER-DIODE DRIVER DESCRIPTION The M66512 is a semiconductor laser-diode driver for driving a specific type' of semiconductor laser, in which the anode of a semiconductor laser diode is connected in stem structure to the cathode of a monitoring photodiode.
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M66512P/FP
M66512
10Mbit/s
50ns/div)
20Mbit/s
20ns/div)
25Mbit/s
40Mbit/s
rold RCE
4288A
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VR68
Abstract: 2322 244 202E UL1676
Text: Philips Components Product specification High ohmic/high voltage resistors FEATURES • These resistors meet the safety requirements of: “UL1676” range 510 kΩ to 11 MΩ ”EN60065” “BS60065” (U.K.) “NFC 92-130” (France) “VDE 0860” (Germany)
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UL1676"
EN60065"
BS60065"
10-6/K)
VR68
2322 244
202E
UL1676
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uPB1509B
Abstract: poly silicon resistor mmic j
Text: 1, Introduction In the fields of comm unication systems and consumer electronics e.g.CATV receivers, SHF broadcasting reseivers and BS/CS tuners , analog and degital ICs from UHF to microwave frequency range are widely used. These analog and degital ICs are required for compactness, economy
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uPB1509B
PB15O9B
poly silicon resistor
mmic j
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