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    REFLOW HOT AIR BGA Search Results

    REFLOW HOT AIR BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D1U54T-M-2500-12-HB4C Murata Manufacturing Co Ltd 2.5KW 54MM AC/DC 12V WITH 12VDC STBY BACK TO FRONT AIR Visit Murata Manufacturing Co Ltd
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    REFLOW HOT AIR BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    reballing

    Abstract: Alpha WS609 solder reflow hot air BGA solder paste alpha WS609 WS609 Lead Free reflow soldering profile BGA BGA PROFILING BGA Ball Crack Alpha WS609 reball
    Text: BGA REBALLING INSTRUCTIONS Notice Mention of third-party products is for informational purposes only and constitutes neither an endorsement nor a recommendation. Emulation Techology assumes no responsibility with regard to the performance of these products.


    Original     		PDF

    spst reed relay

    Abstract: Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile
    Text: BGA Series BGA SERIES MEDER electronic CRF Series High Frequency Reed Relays CRR Series SPST Reed Relays RM Series 4pol Relay Module RM Series 6pol Relay Module 2 bga.p65 www.meder.com Europa # +49- 0 7733-94870, USA # 800-870-5385 2 22.09.2004, 14:59 MEDER electronic


    Original     		PDF CH-8197 F-91971 CZ-10400 spst reed relay Lead Free reflow soldering profile BGA 5B31-02 78234 relay spst reflow hot air BGA fine BGA thermal profile

    Intel reflow soldering profile BGA

    Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
    Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.


    Original     		PDF conductivi49-58. Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment

    all ic data

    Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
    Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as


    Original     		PDF CH09WIP all ic data Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208

    IPC-7525

    Abstract: ipc 7525 IPC-9502 AN-9036 IPC9502 FDMS8660S JESD22-102D Soldering guidelines pin in paste JESD22-102 FDMS8660AS
    Text: AN-9036 Guidelines for Using Fairchild's Power56 Dennis Lang, Staff Engineer Introduction The Power56 minimizes both Printed Wiring Board PWB space and RDS(ON) in a convenient, familiar SO-8 sized footprint, with the addition of a large drain tab for improving thermal


    Original     		PDF AN-9036 Power56 Power56 FDMS8460, FDMS8660AS, FDMS8660S, FDMS8662, FDMS8670AS, IPC-7525 ipc 7525 IPC-9502 AN-9036 IPC9502 FDMS8660S JESD22-102D Soldering guidelines pin in paste JESD22-102 FDMS8660AS

    heller 1700

    Abstract: BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse
    Text: APPLICATION NOTE Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide April 1998 Order Number: 243759-001 Mobile Pentium ® II Processor Mini-Cartridge 240-Pin BGA Connector Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any


    Original     		PDF 240-Pin heller 1700 BGA reflow guide reflow hot air BGA BGA PACKAGE thermal profile pcb warpage after reflow BGA Solder Ball collapse

    TSOP infrared

    Abstract: proof hot air bga reflow hot air BGA "Humidity Indicator Card" Hitachi DSA0015 baking
    Text: ASSEMBLY 7-1 Soldering Methods for Various Surface Mount Packages QFP SOP TQFP TSSOP QFJ LQFP SSOP TSOP HQFP SOJ HSOP Soldering Methods Partial Heating Methods QFI HSOI G-QFP G-QFJ QFN LDPAK S Other discrete BGA HQFI packages not FBGA (CSP) listed to the left


    Original     		PDF

    IPC-7525

    Abstract: IPC-9502 IPC9502 IPC7525 FDS7066N7 defect analysis to-220 Solder paste stencil life FDS7066N3 J-STD-020B 96SC
    Text: www.fairchildsemi.com Application Note 7006 Guidelines for Using Fairchild’s SO-8 FLMP Dennis Lang, Applications Engineer Introduction Board Layout The Flip chip in Leaded Molded Package FLMP SO-8 minimizes both Printed Circuit Board (PCB) space and RDS(ON) in a convenient, familiar SO-8 sized package,


    Original     		PDF

    WELLER EC 2001

    Abstract: WELLER LR 20 TIP weller WECP-80 weller soldering ecp weller soldering tip TCP weller wecp 20 weller wecp 50 DS801 WELLER "5 10 201 99" WELLER 5 24 110 99
    Text: S o l d e r i n g , D e s o l d e r i n g , R e w o r k / R e p a i r To o l s a n d To r c h e s Weller Contents Temtronic / SL-Series 77 - 97 Stations Options Soldering Tips Exin-5 IC-Extractor SFA / SFC 78 80 84 92 94 96 - 79 83 91 93 95 97 Magnastat


    Original     		PDF

    M9627

    Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
    Text: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in


    Original     		PDF C10535EJ8V0IF00 M9627 uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire

    marking code SMD Transistor 2ak

    Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


    Original     		PDF 25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles

    Application Note SO8 Exposed

    Abstract: hot air bga FDS7066N3 FDS7066N7 J-STD-020B AN-705
    Text: November 2002 Application Note 7005 Mounting Techniques for BottomlessTM SO-8 Dennis Lang, Applications Engineer Introduction The Bottomless SO-8 minimizes both Printed Circuit Board PCB space and RD S ( O N ) in a convenient SO-8 sized package. The Bottomless SO-8 employs a breakthrough in packaging


    Original     		PDF AN7055 Application Note SO8 Exposed hot air bga FDS7066N3 FDS7066N7 J-STD-020B AN-705

    GE4F

    Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00

    M02142

    Abstract: CSOP-48 BGA672 CS36 J-STD-020A ultrasonic full bridge cleaning S02-1 FD-FBGA-60 FBGA-304 tsop-48 flash
    Text: Package Mounting Methods Mounting Methods/Reliability/Storage 1. Mounting Methods 2. Surface Mounted Plastic Package Reliability 3. Storage DB81-10004-2E 1 Package Mounting Methods (Mounting Methods/Reliability/Storage) 1. Mounting Methods PACKAGE 1. Mounting Methods


    Original     		PDF DB81-10004-2E M02142 CSOP-48 BGA672 CS36 J-STD-020A ultrasonic full bridge cleaning S02-1 FD-FBGA-60 FBGA-304 tsop-48 flash

    underfill

    Abstract: rework reflow hot air BGA Loctite PCB design for very fine pitch csp package thick bga die size Loctite 3567 Intel BGA Solder FDZ202P Fairchild, BGA fbga Substrate design guidelines
    Text: Application Note 7001 March 2004 Guidelines for Using Fairchild’s BGA Packages Dennis Lang, Applications Engineer Introduction The development of MOSFETs in Chip Scale Package BGA packages was a technology breakthrough, producing a device that combined excellent thermal transfer characteristics, high-current handling


    Original     		PDF

    AN10896

    Abstract: finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader
    Text: AN10896 Mounting and Soldering of RF transistors Rev. 01 — 17 May 2010 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages


    Original     		PDF AN10896 AN10896 finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader

    AN10896

    Abstract: No abstract text available
    Text: AN10896 Mounting and Soldering of RF transistors Rev. 2 — 13 Nov 2012 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages


    Original     		PDF AN10896 AN10896

    AN10365

    Abstract: ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3
    Text: AN10365 Surface mount reflow soldering description Rev. 04 — 13 August 2009 Application note Document information Info Content Keywords surface mount, reflow soldering, component handling Abstract This application note provides guidelines for the board mounting and


    Original     		PDF AN10365 AN10365 ipc 610D Cu3Sn JEDEC J-STD-033b.1 SSOP20 LAND PATTERN JEDEC J-STD-033b J-STD-033b.1 Cu6Sn5 ipc 610 non-wetting Solder Paste, Indium, Type 3

    WS609

    Abstract: BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152
    Text: Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages XAPP426 v1.3 March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx high-performance FPGA products. Unlike traditional packaging in which the die is attached to the substrate face up and the connection is


    Original     		PDF XAPP426 200-210oC 2050215oC. WS609 BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152

    Cu3Sn

    Abstract: HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3 AN10365
    Text: AN10365 Surface mount reflow soldering description Rev. 03 — 22 April 2008 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		PDF AN10365 AN10365 Cu3Sn HVQFN48 J-STD-020D SSOP20 Cu6Sn5 Solder Paste, Indium 5.1, Type 3

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    Lead Free reflow soldering profile BGA

    Abstract: AN10365 HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products
    Text: AN10365 Surface mount reflow soldering description Rev. 01 — 24 May 2005 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		PDF AN10365 AN10365 Lead Free reflow soldering profile BGA HVQFN48 SSOP20 Solder Paste, Indium, Type 3 Cu3Sn philips pb-free products

    Cu3Sn

    Abstract: Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN
    Text: AN10365 Surface mount reflow soldering description Rev. 02 — 26 July 2006 Application note Document information Info Content Keywords surface mount reflow soldering Abstract This application note provides guidelines for the board mounting of IC packages.


    Original     		PDF AN10365 AN10365 Cu3Sn Solder Paste, Indium, Type 3 SSOP20 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3 HVQFN48 SSOP20 philips pb-free products SOT266-1 LAND PATTERN