PPA100 Search Results

Contextual Info: AVANTEK O INC a v a MME n t e D • , . k llMl^bb 2 BIAVA UTO/UTC/PPA1007 Series thln-Film Cascadable Amplifier' 5 to 1000 MHz - 'Î- IM - C 'V C ! FEATURES APPLICATIONS • • • • • IF/RF Amplification • 5 Volt Systems • Surface Mount Assembly

Contextual Info: AVANTEK INC 4ME D ' Hi llM lH b b QGGfiDBS T BIAVA UTO/UTC/PPA1006 Series Thin-Film Cascadable Amplifier 5 to 1000 MHz ' •• • . -f-^ -O 'V O i . FEATURES APPLICATIONS • • • • • • • IF/RF Amplification • Surface Mount Assembly Frequency Range: 5 to 1000 MHz

PPA-20

Contextual Info: SERIES PPA ATTENUATORS RoHS High Power – DC-4GHz The Aeroflex/KDI PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 watts of R.F. power. The PPA series must be thermally bonded to a heat sink, using the mounting

Contextual Info: SERIES PPA ATTENUATORS High Power – DC-4 GHz The Aeroflex/Inmet PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 Watts of RF power. The PPA series must be thermally bonded to a heat sink, using the mounting

PPA-441

Abstract: PPF-030 pp25 24 5 PPA-3031 ppd-6002 1272 hybrid PPA-2123
Contextual Info: What H E W L E T T A "ftM P A C K A R D Avantek Products PlanarPak Surface Mount Series Selection Guide PPA S eries PPD S eries PPF S eries PPL S eries D escription HP supplies a wide selection of high perform ance thin-film hybrid products in the PlanarPak surface

PPA100

Contextual Info: SERIES PPA ATTENUATORS RoHS High Power – DC-4GHz The Aeroflex/KDI PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 watts of R.F. power. The PPA series must be thermally bonded to a heat sink, using the mounting

PPA-441

Abstract: 28z2 ppa 45 PPA-520
Contextual Info: Q PlanarPak Surface Mount Products Selection Guide avan tek PRODUCT DESCRIPTION A v a n te k su p p lie s a w id e se le ctio n o f h ig h p e rfo rm a n ce th in film h yb rid p ro d u cts in th e P la n a rP a k su rfa ce m o u n t p acka g e co v e rin g th e fre q u e n c y o f D C to 18 G H z. A su rfa ce m o u n t

Aeroflex KDI Resistor

Abstract: ppt 0020 A PPT Series 003-001
Contextual Info: A3RS91.1 High Power Chip Termination 100 Watts When properly mounted on an appropriate heat sink, this chip device provides high power dissipation capabilities. Ideal for ferrite isolator applications, the improved thin film design technology and laser trimming provide proven RF power

Contextual Info: SERIES PPA ATTENUATORS High Power – DC-4GHz The Aeroflex/KDI PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 watts of R.F. power. The PPA series must be thermally bonded to a heat sink, using the mounting

Contextual Info: SERIES PPA ATTENUATORS High Power – DC-4GHz The Aeroflex/KDI PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 watts of R.F. power. The PPA series must be thermally bonded to a heat sink, using the mounting

Contextual Info: A3RS91.1 High Power Chip Termination 100 Watts When properly mounted on an appropriate heat sink, this chip device provides high power dissipation capabilities. Ideal for ferrite isolator applications, the improved thin film design technology and laser trimming provide proven RF power

triangle KDI PPA

Contextual Info: HIGH POWER SER IES PPA, PAC ATTENUATORS DC-12.4 GHz, UP TO 200 WATTS I FEATURES: • Flange Mounted or Chip • 10 to 200 Watts • 1 to 20 dB GENERAL INFORMATION: The KDI/Triangle PPA Series of attenuators utilize a Beryllium oxide chip and thin film technology to provide devices which can dissipate up to 200

Contextual Info: SERIES PPA ATTENUATORS High Power – DC-4 GHz The Aeroflex/Inmet PPA Series of attenuators utilize a Beryllium Oxide chip and thin film technology to provide devices which can dissipate up to 100 Watts of RF power. The PPA series must be thermally bonded to a heat sink, using the mounting