Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    PLASTIC PIN GRID ARRAY PACKAGING Search Results

    PLASTIC PIN GRID ARRAY PACKAGING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    PLASTIC PIN GRID ARRAY PACKAGING Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		PDF

    88 lead cpga

    Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
    Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING PDF

    n03n

    Abstract: DSP56002 ti31 58af S-8675 S-7641 TXC 40MHz xtal S7504 TXC 40MHz oscillator Nippon capacitors
    Text: Order this document by DSP56002/D MOTOROLA - SEMICONDUCTOR TECHNICAL DATA Advance Information 24-Bit General Purpose Digital Signal Processor DSP56002 Pin Grid Array PGA Available in a 132 pin ceramic throughhoie package. Plastic Quad Flat Pack (PQFP) Available in a 132 pin, small footprint,


    OCR Scan     		DSP56002/D DSP56002 24-Bit DSP56002 DSP56001 n03n ti31 58af S-8675 S-7641 TXC 40MHz xtal S7504 TXC 40MHz oscillator Nippon capacitors PDF

    outline of the heat slug for JEDEC

    Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    ppga package

    Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    Matthey

    Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, Matthey sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap PDF

    tucker

    Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, tucker CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1 PDF

    Robinson Nugent pga

    Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, Robinson Nugent pga burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa PDF

    trays

    Abstract: QFN Shipping Trays PEAK TRAY bga
    Text: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad


    Original     		PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    CERAMIC QUAD FLATPACK CQFP 14 pin

    Abstract: CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208
    Text: pASIC DEVICE Packaging Specifications HIGHLIGHTS For plastic packages, QuickLogic offers surface-mount packaging in PLCC Plastic Leaded Chip Carrier and PQFP packages. The PQFP (Plastic Quad Flatpack) comes in two categories, TQFP (Thin Quad Flatpack) and PQFP.


    Original     		CF160 PQ208 CQ208 PB256 CERAMIC QUAD FLATPACK CQFP 14 pin CF160 CERAMIC PIN GRID ARRAY CPGA CERAMIC QUAD FLATPACK CQFP CQ208 CF100 PF100 PF144 PL84 PQ208 PDF

    BGA PACKAGE thermal profile

    Abstract: 225-pin BGA X3365 fine BGA thermal profile XC73108 TEXTOOL zif capacitance in BGA package
    Text: Ball Grid Array Packaging The Cost Effective, High Density EPLD Solution  November 1993 White Paper Introduction profile than conventional PQFPs 1.9 mm versus 3.7 mm which makes the package ideal for high pin count portable applications. The ball grid array (BGA) package is the latest in a series


    Original     		XC73108. BGA PACKAGE thermal profile 225-pin BGA X3365 fine BGA thermal profile XC73108 TEXTOOL zif capacitance in BGA package PDF

    80C51

    Abstract: TMS320C50 scl* by national TMS320C50 architecture
    Text: N Customizable Solutions – ASIC N Customizable Solutions – ASIC Table of Contents National Semiconductor offers customizable “systems-on-a-chip” solutions to all process flows and extensive packaging options. A unique competency-based alliance with Cadence Design Systems and Aspec Technology


    Original     		PDF

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545 PDF

    ZHX1203

    Abstract: ZHX1223 ZHX1403 ZHX1423 ZHX1810 ZHX1820 ZHX2022 52855 za9l MC 1200 Motor Control Board
    Text: Packaging Product Specification PS007225-0607 Copyright 2007 by ZiLOG, Inc. All rights reserved. www.zilog.com Warning: DO NOT USE IN LIFE SUPPORT LIFE SUPPORT POLICY ZiLOG'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF


    Original     		PS007225-0607 componeMKT71C1191-00 MKT71C1187-00 MKT71C1153-00 MKT71C1188-00 MKT71C1190-00 MKT71C1189-00 MKT71C0002-00 MKT71C1172-00 ZHX1203 ZHX1223 ZHX1403 ZHX1423 ZHX1810 ZHX1820 ZHX2022 52855 za9l MC 1200 Motor Control Board PDF

    0555B

    Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
    Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7


    Original     		44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238 PDF

    hp laptop MOTHERBOARD pcb CIRCUIT diagram

    Abstract: hp laptop battery pack pinout SCBD002C hp laptop battery pinout sn74154 SN74LVC1G373 SDFD001B 4052 IC circuit diagram lg crt monitor circuit diagram PLL CD 4046
    Text: LOGIC OVERVIEW 1 PRODUCT INDEX 2 FUNCTIONAL CROSS−REFERENCE 3 DEVICE SELECTION GUIDE 4 PACKAGING AND MARKING INFORMATION A LOGIC PURCHASING TOOL/ALTERNATE SOURCES B LOGIC SELECTION GUIDE SECOND HALF 2004 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,


    Original     		PDF

    35x35 bga

    Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
    Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169


    Original     		PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877 PDF

    PLL WITH VCO 4046 appli note philips

    Abstract: CD74HC4050 marking microstar ms 4011 CI 40106 8952 microcontroller ic 4017 decade counter datasheet ic HC 4066 AG GK 7002 7 SEGMENT DISPLAY LT 543 PIN CONFIGURATION LA 4508 as af power amplifier
    Text: LOGIC OVERVIEW 1 PRODUCT INDEX 2 FUNCTIONAL CROSS−REFERENCE 3 DEVICE SELECTION GUIDE 4 PACKAGING AND MARKING INFORMATION A LOGIC PURCHASING TOOL/ALTERNATE SOURCES B LOGIC SELECTION GUIDE FIRST HALF 2004 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,


    Original     		PDF

    74LS series logic gates 3 input or gate

    Abstract: sn74 series TTL logic gates list 4017 counter IC datasheet data sheet ic 4017 IC CD 4033 pin configuration CMOS Data Book Texas Instruments Incorporated 74LS series logic gates hp 4514 TEXAS INSTRUMENTS SN7400 SERIES ic 4026 down counter
    Text: LOGIC OVERVIEW 1 FOCUS ON THE IDEAL LITTLE LOGIC SOLUTION 2 FUNCTIONAL INDEX 3 FUNCTIONAL CROSSĆREFERENCE 4 DEVICE SELECTION GUIDE 5 PACKAGING AND MARKING INFORMATION A LOGIC PURCHASING TOOL/ALTERNATE SOURCES B LOGIC SELECTION GUIDE FIRST HALF 2002 IMPORTANT NOTICE


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: PARADIGM Module Packaging Advanced Packaging Advances in packaging techniques permit a wide variety of solutions to board space problems. M odules are comprised of individual semiconductor devises with other support devises, such as decoders and capacitors


    OCR Scan     		100-mil PDF