200B
Abstract: AN598 DK-2750 RG41 popcorn defect analysis to-220
Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of
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AN598
200B
AN598
DK-2750
RG41
popcorn
defect analysis to-220
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Moisture Sensitivity Levels MICROCHIP PIC Package
Abstract: 78610 delamination leadframe barber excursion AN598
Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of
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AN598
Moisture Sensitivity Levels MICROCHIP PIC Package
78610
delamination leadframe
barber excursion
AN598
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tm 1628 smd
Abstract: AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN
Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of
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AN598
DS00599B-page
tm 1628 smd
AN598
78610
3002 ic equivalent
cte table epoxy
IC 3004
200B
hear
HEINEMANN
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1n4733 smd
Abstract: moisture during operation triac scr schematic AN599 capacitors coefficient of thermal expansion soft solder die bonding TP2222A triac triggering ic DS00598A-page Triac soft turn on
Text: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of
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AN598
DS00599B-page
1n4733 smd
moisture during operation
triac scr schematic
AN599
capacitors coefficient of thermal expansion
soft solder die bonding
TP2222A
triac triggering ic
DS00598A-page
Triac soft turn on
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MT-092
Abstract: MT092 TVS marking ED VISHAY 7506 Analog devices TOP marking Information IEC1000 IEC1000-4 IEC1000-4-1 IEC1000-4-2 IEC1000-4-3
Text: MT-092 TUTORIAL Electrostatic Discharge ESD OUT-OF-CIRCUIT OVERVOLTAGE PROTECTION FROM ESD Linear ICs such as op amps, in-amps, and data converters be protected prior to the time that they are mounted to a printed circuit board. That is an out-of-circuit state. In such a condition, ICs are
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MT-092
MT-092
MT092
TVS marking ED VISHAY
7506
Analog devices TOP marking Information
IEC1000
IEC1000-4
IEC1000-4-1
IEC1000-4-2
IEC1000-4-3
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SN62 PB36 ag2
Abstract: powerflex TO220 land pattern land pattern for tvSOP powerflex ktp r-psfm-g2 TO-220 package thermal resistance JESD51-2 IPC-SM-782 SCBA009 kte 132
Text: PowerFLEX Surface-Mount Alternative for Through-Hole Power Packages SZZA015 April 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest
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SZZA015
SN62 PB36 ag2
powerflex
TO220 land pattern
land pattern for tvSOP
powerflex ktp r-psfm-g2
TO-220 package thermal resistance
JESD51-2
IPC-SM-782
SCBA009
kte 132
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822 smd
Abstract: MIL-STD-81705 MIL-B-81705 cap intel 815 reflow profile manufacturing process calcium chloride molecular sieve A5753-01 Cu6Sn5 A5760 MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs
Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the
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SMD codes databook
Abstract: SMD CODE databook 822 smd EQUIVALENCE datasheet for all smd components moisture sensitive handling and packaging MIL-B-81705 cap manufacturing process calcium chloride ic shelf life MIL-STD-38510 QFP Shipping Trays
Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the
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intel packaging handbook 240800
Abstract: Ultrasonic cleaner circuit diagram moisture sensitive handling and packaging MIL-B-81705 intel 815 reflow profile INTEL PLCC 68 dimensions tape LEAD FRAME SURFACE MOUNT Intel Packaging Handbook 240800 solder PQFP die size PQFP moisture sensitive handling and packaging
Text: 2 8 Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 1/22/97 10:19 AM CH08WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 8 MOISTURE SENSITIVITY/DESICCANT PACKAGING/HANDLING OF PSMCS 8.1. INTRODUCTION This chapter of the Packaging Handbook examines surface mount assembly processes and
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CH08WIP
intel packaging handbook 240800
Ultrasonic cleaner circuit diagram
moisture sensitive handling and packaging
MIL-B-81705
intel 815 reflow profile
INTEL PLCC 68 dimensions tape
LEAD FRAME SURFACE MOUNT
Intel Packaging Handbook 240800 solder
PQFP die size
PQFP moisture sensitive handling and packaging
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J-STD-020 MSL Rating
Abstract: mil J-STD-020
Text: KEMET Surface Mount Ceramic Revision D, 03 November 2006 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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2002/95/EC,
2005/618/EC.
J-STD-020 MSL Rating
mil J-STD-020
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Untitled
Abstract: No abstract text available
Text: KEMET Surface Mount Ceramic Revision H, 9 June 2010 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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2002/95/EC,
2005/618/EC
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90Sn10
Abstract: No abstract text available
Text: KEMET Surface Mount Ceramic Revision Nil, 01 November 2005 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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2002/95/EC,
2005/618/EC.
90Sn10
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Plastic Packaging and the Effects of Surface Mount
Abstract: No abstract text available
Text: UMA5817, UMA5818, and UMA5819 ULTRAMITE SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS SCOTTSDALE DIVISION The UMA5817 thru UMA5819 UltraMite™ series offers small efficient surface mount packaging with the same electrical features as the popular 1N5817, 1N5818, and 1N5819 Schottky rectifiers. It provides the same
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UMA5817,
UMA5818,
UMA5819
UMA5817
UMA5819
1N5817,
1N5818,
1N5819
DO-214AC
microse002
Plastic Packaging and the Effects of Surface Mount
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8700 CJ
Abstract: 1N5817 1N5818 1N5819 UMA5817 UMA5818 UMA5819 FOOTPRINT MELF BA 5818
Text: UMA5817, UMA5818, and UMA5819 ULTRAMITE SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS SCOTTSDALE DIVISION APPEARANCE The UMA5817 thru UMA5819 UltraMite™ series offers small efficient surface mount packaging with the same electrical features as the popular
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UMA5817,
UMA5818,
UMA5819
UMA5817
UMA5819
1N5817,
1N5818,
1N5819
DO-214AC
8700 CJ
1N5817
1N5818
UMA5818
FOOTPRINT MELF
BA 5818
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IC51-0562-1514
Abstract: Yamaichi IC51-0644-807 footprint IC51-0562 socket tqfp 56 socket Yamaichi TQFP IC51-0804-808 IC51-0644-807
Text: FIFO Memories: Fine-Pitch Surface-Mount Manufacturability First-In, First-Out Technology SCZA003A March 1996 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest
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SCZA003A
IC51-0562-1514
Yamaichi IC51-0644-807 footprint
IC51-0562 socket
tqfp 56 socket
Yamaichi TQFP
IC51-0804-808
IC51-0644-807
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Yamaichi IC51-0644-807 footprint
Abstract: IC51-0562-1514 IC51-0804-808 IC51-0562 socket TQFP 80 PACKAGE footprint Yamaichi IC51-0804-808 footprint ssop 0.635 IC51-0562 IC51-0644-807 TQFP 256 PACKAGE footprint
Text: FIFO Memories: Fine-Pitch Surface-Mount Manufacturability First-In, First-Out Technology Tom Jackson Advanced System Logic – Semiconductor Group SCZA003A 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor
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SCZA003A
Yamaichi IC51-0644-807 footprint
IC51-0562-1514
IC51-0804-808
IC51-0562 socket
TQFP 80 PACKAGE footprint
Yamaichi IC51-0804-808
footprint ssop 0.635
IC51-0562
IC51-0644-807
TQFP 256 PACKAGE footprint
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mar 618
Abstract: MAR 618 transistor
Text: KEMET Surface Mount Ceramic Array Revision C, 12 Mar 2007 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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2005/618/EC
mar 618
MAR 618 transistor
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JESD22a121
Abstract: JESD201 JESD201 B
Text: KEMET Surface Mount Ceramic Revision A, 1 Novembert 2011 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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2005/618/EC
JESD22a121
JESD201
JESD201 B
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tungsten slug glass diode
Abstract: CERAMIC PIN GRID ARRAY wire lead frame 28F001BX 28F010 28F020 a5637 a5609 PERFORMANCE CHARACTERISTICS OF IC PACKAGES
Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which
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UPS840e3
Abstract: EIA-481-2
Text: UPS840e3 POWERMITE 3 SURFACE MOUNT 8 AMP 40 V SCHOTTKY RECTIFIER SCOTTSDALE DIVISION APPEARANCE The UPS840e3 offers a small and powerful surface mount package that is RoHS compliant for a 40 Volt 8 Amp rated Schottky. These ratings are found only in much larger packages. They are ideal for surface mount applications
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UPS840e3
UPS840e3
EIA-481-2
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do-214ac footprint
Abstract: pc f817 JANTX 1N5817 8700 CJ 1N5818 1N5819 UMAF5817 UMAF5818 UMAF5819 1N5817
Text: UMAF5817, UMAF5818, and UMAF5819 ULTRAMITE SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS SCOTTSDALE DIVISION ENVIRONMENTALLY LEAD-FREE APPEARANCE The UMAF5817 thru UMAF5819 UltraMite™ series offers a Lead-Free construction both internally and externally in a small efficient surface
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UMAF5817,
UMAF5818,
UMAF5819
UMAF5817
UMAF5819
1N5817,
1N5818,
1N5819
DO-214AC
do-214ac footprint
pc f817
JANTX 1N5817
8700 CJ
1N5818
UMAF5818
1N5817
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SN63 PB37 alpha
Abstract: No abstract text available
Text: ^EDI Ceramic SOJ Electronic D#rign*lnc. Military Surface Mount Advances in the density ol Static SRAM and Dynamic Surface Mount Packages (DRAM) memory devices have resulted in increased die size Packaging of active devices for surface mount has been and elevated power requirements. With these issues, the
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MIL-R-55342
Abstract: MIL-R-55342/07
Text: SURFACE MOUNT _QJBC THE RESISTOR PEOPLE TANFILM PRECISION CHIP RESISTORS PFC SERIES • • • • • • • • Ultra stable Tantalum Nitride resistor film system Qualified to MIL-R-55342 Passivated TaNFilm element Wrap around termination Performance exceeds MIL-R-55342 characteristic E
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MIL-R-55342
MIL-R-55342
---------W1206
MIL-R-55342/07
W0805
MIL-R-55342/06
RM1206
RM0705
MIL-R-55342/07
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EIA-469
Abstract: JESD22a121 JESD22-A121 MIL-PRF-55581 EIA-459 kemet COTS X5R 0402cog NC0402C
Text: KEMET Surface Mount Ceramic Revision I, 22 Sept 2010 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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MIL-PRF-55581
L-PRF-55581
EIA459
EIA-469:
2002/95/EC,
2005/618/EC
P/NC0402C
7S07PP
EIA-469
JESD22a121
JESD22-A121
EIA-459
kemet COTS X5R
0402cog
NC0402C
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