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Amphenol FCi PGA-209H009B5-1725F IC SOCKET, PGA209, 209 CONTACT(S), 2.54MM TERM PITCH, 0.1INCH ROW SPACING, SOLDER
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Quest Components	PGA-209H009B5-1725F		114			1 - 10 - 100 - 1000 - 10000 -	Buy Now
Amphenol FCi PGA209H862S-1725R IC SOCKET
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Quest Components	PGA209H862S-1725R		84			1 - 10 - 100 - 1000 - 10000 -	Buy Now
McKenzie Technology PGA209H164B1-1725F IC SOCKET, PGA209, 209 CONTACT(S), 2.54MM TERM PITCH, 0.1INCH ROW SPACING, SOLDER
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Quest Components	PGA209H164B1-1725F		61			1 - 10 - 100 - 1000 - 10000 -	Buy Now
McKenzie Technology PGA-209H003B1-1725R IC SOCKET, PGA209, 209 CONTACT(S), 2.54MM TERM PITCH, 0.1INCH ROW SPACING, SOLDER
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Quest Components	PGA-209H003B1-1725R		57			1 - 10 - 100 - 1000 - 10000 -	Buy Now
Amphenol FCi PGA209H003B1-1725R IC SOCKET
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Quest Components	PGA209H003B1-1725R		32			1 - 10 - 100 - 1000 - 10000 -	Buy Now

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PGA209 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
PGA209-C-S17U-2 Abstract: No abstract text available Text: 209S8 Metal seal 209pin PGA EIAJ Package Code PGA209-C-S17U-2.54 JEDEC Code – 44.45±0.4 Weight g 24.75 4.55MAX 3.8±0.5 40.64±0.3 2.54TYP U T 40.64±0.3 R P N M L K J H G F E D C B A φ1.0TYP 44.45±0.4 φ0.46±0.05 2.54TYP 17 16 15 14 13 12 11 10 9 8	Original	PDF	209S8 209pin PGA209-C-S17U-2 55MAX 54TYP
PGA209-C-S17U-2 Abstract: No abstract text available Text: 44.70 ± 0.50 PGA209-C-S17U-2.54 1 4.70±0.45 INDEX MARK 5 0.46±0.05 0.25 M 3.30±0.40 2.54 1.20±0.30 SEATING PLANE	Original	PDF	PGA209-C-S17U-2
n14 167 Abstract: PA-PGA209-01 Text: PA-PGA209-01 Map Rev B, 8/2/94 189,168 106,85 22,1 147,126 64,43 1,22 209,188 125,105 42,21 167,146 84,63 Bottom View-Base PGA A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 B1 Base 3 24 22 43 45 66 91 85 87 108 112 126 128 149 191 169 170 4 PGA	Original	PDF	PA-PGA209-01 n14 167
PGA-208c-a02 Abstract: PGA209-C-S17U-1 Text: PIN GRID ARRAY PACKAGE 208 PIN CERAMIC PGA-208C-A02 EIAJ code : ∗PGA209-C-S17U-1 208-pin ceramic PGA Number of pins 209 pins includes extra index pin Lead pitch 100mil Pin matrix 17 Sealing method Metal seal (PGA-208C-A02) 208-pin ceramic PGA (PGA-208C-A02)	Original	PDF	PGA-208C-A02 PGA209-C-S17U-1 100mil 208-pin PGA-208C-A02) R208002SC-2-2 PGA-208c-a02 PGA209-C-S17U-1
PGA-208C-A02 Abstract: PGA209-C-S17U-1 PGA-208 Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC To Top / Package Lineup / Package Index PGA-208C-A02 EIAJ code :∗PGA209-C-S17U-1 208-pin ceramic PGA Number of pins 209 pins includes extra index pin Lead pitch 100 mil Pin matrix	Original	PDF	PGA-208C-A02 PGA209-C-S17U-1 208-pin PGA-208C-A02) R208002SC-2-2 PGA-208C-A02 PGA209-C-S17U-1 PGA-208
LGA 1156 PIN OUT diagram Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)	Original	PDF	DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
MQFPL160 Abstract: UD02 UD09 LCC100 QuickLogic Military FPGA Introduction UD10 atmel 336 20RA10 XC7000 PGA68 Text: Digital Integration Design done by Customer and TEMIC MATRA MHS Digital Integration Introduction When integrating the digital part of modern electronic system, various technical and financial criteria are considered. Over 10 years of ASIC experience have shown	Original	PDF
425M Abstract: DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240 Text: 2. 外形寸法図 2. 外形寸法図 2 2-1. パッケージ外形寸法 - 2 2-1-1. パッケージ寸法表示記号 - 2 2-1-2. リード位置許容値について - 3	Original	PDF	P-LFBGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA420-3535-1 P-BGA560-3535-1 P-TFLGA32-0806-0 425M DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240
amd 29050 Abstract: VHDL CODE FOR PID CONTROLLERS 20630 Xilinx XC2000 LCC100 UD09 LCC84 UD10 8251 uart vhdl MCT8 Text: Digital Integration Introduction When integrating the digital part of modern electronic systems, various technical and financial criteria must be considered. Over 10 years of ASIC experience have shown that no one methodology can meet all requirements at the same time.	Original	PDF	10-May-96 amd 29050 VHDL CODE FOR PID CONTROLLERS 20630 Xilinx XC2000 LCC100 UD09 LCC84 UD10 8251 uart vhdl MCT8
PGA-208C-A02 Abstract: PGA209-C-S17U-1 Text: PIN GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 208 PIN CERAMIC PGA-208C-A02 EIAJ code :∗PGA209-C-S17U-1 208-pin ceramic PGA Number of pins 209 pins includes extra index pin Lead pitch 100 mil Pin matrix 17 Sealing method Metal seal (PGA-208C-A02)	Original	PDF	PGA-208C-A02 PGA209-C-S17U-1 208-pin PGA-208C-A02) R208002SC-2-2 PGA-208C-A02 PGA209-C-S17U-1
TRANSISTOR B737 Abstract: MD80C31 smd TRANSISTOR code marking 8K 67202FV PGA300 5962-8506401MQA ERC32SIM marking code RAD SMD Transistor npn ISO DIMENSIONAL certificate formats 67205E Text: Integrated Circuits for Aerospace and Defense Short Form 1998 16 June 1998 Publisher: TEMIC Semiconductors La Chantrerie BP 70602 44306 Nantes Cedex 03 FRANCE Fax: +33 2 40 18 19 60 E:mail nantes.marcom@temic.fr World Wide Web: http://www.temic.de 16 June 1998	Original	PDF
sac 326 Abstract: tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance Text: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要	Original	PDF	PC114 G4296 513ja 144pin 44pin 100pin G3896 21x24 29x29 P-BGA144-1313-0 sac 326 tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance
QFP160-P-2828-0 Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE	Original	PDF
SMD IC 2025 bl Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20 Text: J2T0011-38-60 まえがき平素は「沖半導体製品」を御愛用いただき厚く御礼申し上げます。エレクトロニクス分野におきましては半導体製品の応用はますます広がりをみせており、その性能機	Original	PDF	J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20

HD68HCOOOY12 Abstract: HD64400 ad 7137 CY7C9101 8207 siemens MOTOROLA 68012 Text: SOCKETS S E M I-C O N D U C T O R CRO SS REFERENCE AMD Device P/N AM29030 AM29117 AM29325 AM29331 AM 29334 3500 SERIES AM80186 AM80286 A9850 AM95C60 AM 29000 AM29050 RN P/N PGA-146CH3-S PGA-068CH3-S PGA-145AH3-5 PGA-120BH3-S PGA-120BH3-S PGA-169BH3-S PGA-068CH3-S	OCR Scan	PDF	AM29030 AM29117 AM29325 AM29331 AM80186 AM80286 A9850 AM95C60 AM29050 PGA-146CH3-S HD68HCOOOY12 HD64400 ad 7137 CY7C9101 8207 siemens MOTOROLA 68012