PADK Search Results

BS80xB

Abstract: sensor
Contextual Info: BS80xB Application Note BS80xB Application Note 請參考圖 1，KREF 連接到 PADKREF。 • PADKREF 與 PAD1~PADx 具備同樣的感度，PAD 大小和材質都一樣 PADKREF 大小可以比 其他 PAD 大 20% 。  PADKREF 在設計上必須避免被人體碰觸，必須隱藏在機構內部不易被碰觸到的地方，同

Contextual Info: E2G1059-18-74 O K I Semiconductor This version: Jul. 1998 MSM5716C50/M SM 5718C50/ M D5764802 16M/18Mb 2M x 8/9 & 64Mb (8M x 8) Concurrent RDRAM DESCRIPTION The 1 6 /1 8 /64-M egabit C oncurrent Ram bus DRAMs (RDRAM ) are extrem ely hi'ghVspeed CMOS DRAMs organized as 2M or 8 M w ords by 8 or 9 bits. They are capable of bursting- linlimi ted

Contextual Info: JUL 09 '93 09:ISAM MICROCHIP SEP 0 7 199? S s ^A M A / M TA4111Q ic r o c h ip PC Mouse and TVackball Controller IC FEATURES DESCRIPTION • Single chip two button mouse or trad<bail controller The MTA41110 is tite heartof a simple. low cost mouse or trackball solution. It can be configured »operate as

TAS5412

Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
Contextual Info: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

TMDSEZS2812

Abstract: TMDSPDK6727 TMS320 C2000 Development kits block diagrams TMDSDSK6416-T TMS320C6455 DSP Starter Kit DSK TMDXEVM6452 DSP TMS320F2812 JTAG DATA simple programs using C in TMS320C6713 DSK TMS320C5509 TMS320C6416 DSK
Contextual Info: eXpressDSP Digital Signal Processing Software and Development Tools Selection Guide 1Q 2009 ii Table of Contents ➔ Table of Contents eXpressDSP™ Software and Development Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

TMS320C6727

Contextual Info: TMS320C6727, TMS320C6726, TMS320C6722 Floating-Point Digital Signal Processors www.ti.com SPRS268C – MAY 2005 – REVISED NOVEMBER 2005 1 TMS320C6727, TMS320C6726, TMS320C6722 DSPs 1.1 • • • • • • Features C672x: 32-/64-Bit 300-MHz Floating-Point DSPs

tms 320 code generation tools getting started guide

Abstract: DSP320C
Contextual Info: SM320C6701ĆEP, SM320C6701MECHĆEP FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR SGUS042A − MAY 1998 − REVISED APRIL 2004 D Controlled Baseline D D D D D D D D 1M-Bit On-Chip SRAM − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance up to

JESD51-9

Abstract: JEP140 JEP-140 JESD51-10 JEDEC JESD51-8 conductivity meter circuit Reliability Test Methods for Packaged Devices thermal resistance standards JESD51-1 JESD51-3
Contextual Info: Thermal Characterization of Packaged Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller, faster, and higher power devices, thermal management is becoming increasingly important. After all, higher device

Contextual Info: THIS DRAWI NG IS UNPUBLISHED. COPYRIGHT - RE L E A S E D FOR P U B L I C A T I O N ALL BY - RIGHTS LOC DI S T H R E SE RV ED. REVISIONS P LTR U1 U2 DE SCRI PTI ON DATE REVISED PER EC0-11-005027 DIM "A" MAX ADDED IN TOP VIEW DWN APVD 23MAR2011 RK HMR 21 -0 7 - 1 1

SS71

Abstract: KV1502 KV1401 KV1702 1251150 KV1402 KV1403 KV1501 KV1601 KV1602
Contextual Info: LORAL/FREÖUENCY/SEfllCOND Tb D • 557^1 GOGOfllfl 0 ■ HF HYPERABRUPT-TUNING VARACTORS DESCRIPTION FEATURES H F Diodes: These hyperabrupt V V C 's are for tuning L C reson­ ant circuits from audio frequencies up to 100 M H z with frequency ratios as high as 4 to 1; also for wide deviation

nrzi

Abstract: HD6417727 PDIUSBP11 SH7727
Contextual Info: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

ct82

Contextual Info: PRELIMINARY S • P D T S W NJG1507R I T C H General Description NJG1506R is a GaAs MM IC switch designed for mainly T/R switch of PHS in Japan.This switch can oparete from 100MHZ to 3GHz.lt features very low insertion loss, high isolation and low voltage operation.

Contextual Info: • L ■. .n o r i> o u CMOS 512K 64K x 8 Pseudo-Static RAM FEATURES DESCRIPTION • 65,536 x 8 bit oiganization The LH5F06O is a 512K-bit Pseudo-Static RAM or­ ganized as 65,536 x 8 bits. It is fabricated using sNicorv-gate CMOS process technology* With its built-in

Contextual Info: TMS320C6727, TMS320C6726, TMS320C6722 Floating-Point Digital Signal Processors www.ti.com SPRS268C – MAY 2005 – REVISED NOVEMBER 2005 1 TMS320C6727, TMS320C6726, TMS320C6722 DSPs 1.1 • • • • • • Features C672x: 32-/64-Bit 300-MHz Floating-Point DSPs

Contextual Info: LH54817 LH5491 FEATURES • • Fastest 64 x 8/9 Cascadeable FIFO 35/25/15 MHz Expandable in Word Width & FIFO Depth Cascadeable 64 x 8 FIFO Cascadeable 64 x 9 FIFO high speed makes these FIFOs ideal for high perfor­ mance communication and controller applications.

PT740 AB

Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

TMSDC6727BGDHA250

Abstract: SPRU187N TMS320C6727BZDH275 TMS320C672x
Contextual Info: www.ti.com TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720 Floating-Point Digital Signal Processors SPRS370B – SEPTEMBER 2006 – REVISED JANUARY 2007 1 TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720 DSPs 1.1 Features • • • • • •

320C6711

Contextual Info: SM320C6711ĆEP, SM320C6711BĆEP, SM320C6711CĆEP, SM320C6711DĆEP FLOATINGĆPOINT DIGITAL SIGNAL PROCESSORS SGUS054A − AUGUST 2004 − REVISED SEPTEMBER 2005 D Controlled Baseline D D D D D D D D L1/L2 Memory Architecture − One Assembly/Test Site, One Fabrication

mpc5517

Abstract: MPC5516E MPC5516 MPC5514 MPC5517E MAC MTA E200 MPC5515 FlexCAN MPC5510RM mpc5517 datasheet
Contextual Info: MPC5510 Microcontroller Family Reference Manual Devices Supported: MPC5517G/E/S MPC5516G/E/S MPC5515S MPC5514G/E Document Number: MPC5510RM Rev. 1 06/2008 PRELIMINARY How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support

5nbb

Abstract: HI-201HS
Contextual Info: I9 0 H 7 rtn v I. 1 1/9-1 Æ / I X I Æ I High-Speed, CMOS, Quad, SPST Analog Sw itch _Features ♦ QuarantMKl Slng *-Supply Opwstlpn: +12V to +20V Maxim's new high-voltage silicon-gate technology in­ creases the maximum supply-voltage rating to 44V. This

L0607

Contextual Info: LH540215/25 FEATURES PRELIMINARY 512 x 1 8 /1 0 2 4 x 18 Synchronous FIFO • May be Cascaded for Increased Depth, or Paralleled for Increased Width • Fast Cycle Times: 20/25/35 ns • Pin-Compatible Drop-In Replacements for IDT72215B/25B FIFOs • Choice of IDT-Compatible or Enhanced Operating

PT740 AB

Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
Contextual Info: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher

ISP1362

Abstract: philips ISP1362 FAT16 PXA250 API 662
Contextual Info: UM10012_2 ISP1362 Linux Stack July 2003 User’s Guide Rev. 1.2 Revision History: Version Date 1.2 Jun 2003 1.1 Nov 2002 1.0 Oct 2002 Description • Additions for Accelent IDP platform Rev 04 • Additions for Aaccelent IDP platform • First release. We welcome your feedback. Send it to wired.support@philips.com.

FETAL HEART RATE MONITOR

Abstract: TMS320C6713 DSK image processing kit diagram Blood Oxygen Pulse Oximetry experiments kit USB docking station F28335 ECG NTE semiconductor manual msp430 DC motor control PID electronic stethoscope circuit diagram MSP430F2013 touchpad ecg semiconductor replacement guide TMS320f2812 pwm eQEP code c
Contextual Info: Embedded Processing Selection Guide ii  Table of Contents Introduction to TI Embedded Processing Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Processor Find and Fit Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2