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    PACKING TRAYS Search Results

    PACKING TRAYS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74741-184PLF Amphenol Communications Solutions Board Connectors, Backplane Connectors 5 Row Signal Header, Straight, 1 Mod, Solder to Board in tray packing Visit Amphenol Communications Solutions
    10127819-02211PLF Amphenol Communications Solutions Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 100u\\ Bright Tin plating, Natural Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs. Visit Amphenol Communications Solutions
    10127819-14211PLF Amphenol Communications Solutions Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 100u\\ Bright Tin plating, Natural Color, 14 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs. Visit Amphenol Communications Solutions
    10127819-12211PLF Amphenol Communications Solutions Minitek® Pwr 4.2, Dual Row, Right Angle Through Hole Header, 100u\\ Bright Tin plating, Natural Color, 12 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs. Visit Amphenol Communications Solutions
    10127820-1622LPLF Amphenol Communications Solutions Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, LCP, GW Compatible, Tray Packing, With Pegs. Visit Amphenol Communications Solutions

    PACKING TRAYS Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    56mm carrier tape

    Abstract: 28 pin ic TM 1628
    Text: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03


    Original     		3027b 56mm carrier tape 28 pin ic TM 1628 PDF

    WNF008

    Abstract: code res pack 8 SO3016 UNE008 spansion tray
    Text: ‹ Chapter 10 Packing Methods and Labels CHAPTER 10 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Box Labeling Packages and Packing Methodologies Handbook 1 March 2008 10-1 ‹ Chapter 10 Packing Methods and Labels


    Original     		PDF

    fee 210

    Abstract: FBC048
    Text: ‹ Chapter 4 Summary of Packing Quantities CHAPTER 4 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Methodologies Handbook 17 Oct 2008 4-1 ‹ Chapter 4 Summary of Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package ball/lead count. The data is sorted


    Original     		Ree10 fee 210 FBC048 PDF

    poly aluminum chloride

    Abstract: rubidium radioactive
    Text: ‹ Chapter 11 Chemical Content of Product Carriers and Packing Materials CHAPTER 11 CHEMICAL CONTENT OF PRODUCT CARRIERS AND PACKING MATERIALS Introduction Packing Materials Content Recyclability of Packing Materials and Product Carriers Summary of Hazardous Chemicals Not Present in Packing Materials


    Original     		PDF

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


    Original     		PDF

    CCGA

    Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
    Text: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:


    Original     		PDF

    JEDEC J-STD-033

    Abstract: J-STD-033 MIL-I-18835 JSTD-033 ASTM 1249 MIL-PRF-81705D molecular sieve F-1249 D-3464 D-3464D
    Text: ‹ Chapter 9 Dry Packing CHAPTER 9 DRY PACKING Introduction Testing for Moisture Sensitivity Dry Packing Process and Materials Handling Dry Packed Products Storing Dry Packed Products Packages and Packing Methodologies Handbook 1 March 2008 9-1 ‹ Chapter 9 Dry Packing


    Original     		PDF

    K660

    Abstract: material content amd AMD chemical content 9002-86-2
    Text: u Chapter 14 Chemical Content of Product Carriers and Packing Materials CHAPTER 14 CHEMICAL CONTENT OF PRODUCT CARRIERS AND PACKING MATERIALS Introduction Packing Materials Content Tray Recycling Program Recyclability of Packing Materials and Product Carriers


    Original     		PDF

    a1770

    Abstract: EVD30 a3x2g7 E41871 B66298 corrugated B66298V1012T1 250 B 340 smd Transistor u cores Wound Toroids Coil
    Text: Ferrites and accessories Packing Date: September 2006 Data Sheet  EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the information contained therein without EPCOS’ prior express consent is prohibited. Packing Packing Survey of packing modes


    Original     		FAL0697-T FAL0677-E a1770 EVD30 a3x2g7 E41871 B66298 corrugated B66298V1012T1 250 B 340 smd Transistor u cores Wound Toroids Coil PDF

    B 315 D

    Abstract: SOT89 pq SOT494 SOD89 SOT233 SOT89 Package pq TRANSISTOR SMD CODE PACKAGE SOT89 TRANSISTOR SMD CODE PACKAGE SOT89 4 250 B 340 smd Transistor msc377
    Text: CHAPTER 6 PACKING METHODS page Introduction 6-2 Glossary of terms 6-2 Packing methods in exploded view 6-3 Packing quantities, box dimensions and carrier shapes 6 - 13 Philips Semiconductors Discrete Semiconductor Packages Packing Methods Chapter 6 INTRODUCTION


    Original     		OT195 OT223 MSC078 B 315 D SOT89 pq SOT494 SOD89 SOT233 SOT89 Package pq TRANSISTOR SMD CODE PACKAGE SOT89 TRANSISTOR SMD CODE PACKAGE SOT89 4 250 B 340 smd Transistor msc377 PDF

    SIMM 72

    Abstract: No abstract text available
    Text: SIEMENS Packing Information Packing Information DRAM Modules Type Packing Modules per Box 72 pin SIMM Boxes with Trays 80 72 pin Small Outline DIMM Boxes with Trays 80 168 pin DIMM Boxes with Trays 40 Semiconductor Group 25


    OCR Scan     		PDF

    EPX10

    Abstract: corrugated cardboard EPCOS LABEL
    Text: Packing Packing Survey of packing modes Ferrites Type Packing Para. RM cores RM 4 to RM 10 RM 12, RM 14 Blister tapes Standard trays 3.2 2.2.1 170 168 PM cores PM 50/39 to PM 114/93 Standard trays 2.2.1 168 P cores all P cores P 9 x 5 to P 22 × 13 Standard trays


    Original     		PDF

    JEDEC J-STD-033A

    Abstract: AMD Package moisture LBA399 F-1249 J-STD-033A J-STD-020B J-STD-033 ASTM 1249 MIL-PRF-81705D MIL-I-18835
    Text: u Chapter 12 Dry Packing CHAPTER 12 DRY PACKING Introduction Testing for Moisture Sensitivity Dry Packing Process and Materials Handling Dry Packed Products Storing Dry Packed Products AMD’s Moisture Sensitive Products by Package Type Packages and Packing Publication


    Original     		PDF

    ATMEL 234

    Abstract: ATMEL Packing Methods and Quantities ATMEL 210 atmel tape and reel ATMEL shipping label ATMEL Tape and Reel code ATMEL SOIC tape and reel ATMEL JEDEC SOIC atmel tape and reel JEDEC SOIC ATMEL Packing information JEDEC SOIC
    Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer's needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three


    Original     		0637B 10/98/xM ATMEL 234 ATMEL Packing Methods and Quantities ATMEL 210 atmel tape and reel ATMEL shipping label ATMEL Tape and Reel code ATMEL SOIC tape and reel ATMEL JEDEC SOIC atmel tape and reel JEDEC SOIC ATMEL Packing information JEDEC SOIC PDF

    28 TSSOP JEDEC Thin Matrix Tray outlines

    Abstract: tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x
    Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three


    Original     		0637D 09/99/xM 28 TSSOP JEDEC Thin Matrix Tray outlines tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x PDF

    1895 ic

    Abstract: tfp 370 TFP-32D 2620D 40DA IC 404
    Text: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed


    Original     		TTP-48D CP-32D CP-32DB CP-40D CP-40DA CP-42D CP-44D TTP-28/24D TTP-28D TTP-28DA 1895 ic tfp 370 TFP-32D 2620D 40DA IC 404 PDF

    tfp 370

    Abstract: No abstract text available
    Text: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed


    OCR Scan     		TFP-32D TFP-32DR TTP-32D TTP-32DR TTP-32DB TTP-50/44DC TTP-50D TTP-50DA TTP-28/24D TTP-28D tfp 370 PDF

    tqfp 10x10 tray

    Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
    Text: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.


    Original     		PDF

    IC 404

    Abstract: No abstract text available
    Text: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed


    OCR Scan     		TFP-32D TFP-32DR TTP-32D TTP-32DR TTP-32DB TTP-50/44DC TTP-50D TTP-50DA TTP-28/24D TTP-28D IC 404 PDF

    antistatic epe foam

    Abstract: mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220
    Text: The Operation Instruction of Packing Materials PURPOSE Warehouse and Subcontractors according to the instruction for purchaseing and incoming inspection, formulate the Operation Instruction of Packing Materials. SCOPE Related all packing materials in warehouse.


    Original     		200mm 150mm 118MIL 150MIL 300MIL antistatic epe foam mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220 PDF

    Untitled

    Abstract: No abstract text available
    Text: Packing Specifications 1. Forms of Package Packing The forms o f IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed


    OCR Scan     		PDF

    MD300-10A

    Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
    Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP


    Original     		S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA PDF

    tsop tray matrix outline

    Abstract: tsop Shipping Trays JEDEC Matrix Tray outlines Atmel 918 EIA-481-x ATMEL Packing Methods and Quantities JEDEC Matrix Tray outlines soic ATMEL Tape and Reel PLCC JEDEC tray Shipping Trays
    Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also


    Original     		PDF

    JEDEC Matrix Tray outlines

    Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
    Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also


    Original     		EIA-481-x, JEDEC Matrix Tray outlines ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label PDF