PACKAGING COMPONENTS Search Results

mems

Abstract: mems pacemaker MEMS ic silicon mems microphone glass frit bolometer mems microphone structure MEMS IC Introduction to accelerometers bolometer sensor
Contextual Info: MEMS and Microsystem Packaging NMI at INNOS June 2005 CONFIDENTIAL Introduction ƒ Background to MEMS and Microsystem Packaging ƒ Types of Packaging – “Zero level” packaging – Primary packaging – Secondary packaging [Page 1] CONFIDENTIAL Silicon IC Systems

973057-2

Abstract: datasheet fr 107 carton box
Contextual Info: 1. GENERAL 1.1 PURPOSE This packaging specification covers the packaging material, packaging method & packaging quantities for E3.2 Bushless Header Assy. 1.2 SCOPE This specification is applicable to the packaging of Bushless Header Assy. part number: 1814733-1

PHILIPS 2222 370 capacitors

Abstract: MSA650 philips axial ceramic capacitor philips mono-kap philips ceramic leaded capacitors PHILIPS capacitors philips components mono-kap mono-kap Philips capacitor axial Mono-Axial
Contextual Info: Philips Components Leaded ceramic multilayer capacitors General data PACKAGING The monolithic ceramic capacitors are supplied in bulk packaging, taped on reel, or in ammopack; see Tables 1 and 3. Mono-axialTM capacitors Table 1 Packaging quantities and box dimensions

smd code marking 56 sot23-6

Abstract: marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5
Contextual Info: PACKAGING Package Information Packaging & Ordering Packaging Solutions for Modern Electronic Design In addition to standard legacy packaging, Pericom leads the industry in smaller, more advanced packaging profiles and footprints for today’s designers. Our offerings include very small packages,

Contextual Info: - a t _ îl|C O Electronics _ . , Packaging Specification 107-90020 10/07/01 Rev. O Packaging Specification Sub D housing 1. SCOPE : TRAY PACKAGING FOR SUB D HOUSING WITH TYCO LABEL 2. USED PACKAGING PHANTOM NUMBERS AND QUANTITIES Packaging Phantom Number

Contextual Info: GENERAL INFORMATION LEAD TAPING AND PACKAGING LEAD TAPING AND PACKAGING OF AXIAL COMPONENTS FOR AUTOMATIC AND ROBOT INSERTION MACHINES Packaging detail T echnical term s: IEC 60286-1 A vaila ble reel 355 mm only. Reel Description Symbol Dimensions mm Component diameter

Contextual Info: RESISTIVE COMPONENTS PACKAGING OPTIONS Our packaging system ensures that our product reaches your facility in factory fresh condition. Please contact our sales department for options on your specific device type. • Tray Packaging Rigid vinyl film vacuum formed specifically for each device style

Schaffner 781

Abstract: Diodes smd e5 "Toggle Switch" C 245 B Schaffner catalog SMD e5 EIA481A TG36WS80050 IEA-RS448-2 apem -2 e6
Contextual Info: DESIGNED EXCLUSIVELY FOR SURFACE MOUNTING SMT TG Series switches incorporate many desireable features that include: ● E E4 Tape & reel packaging This type of packaging is recommended for: ● economy ● suitability for automated placement ● handling of large quantities of components per packaging unit

EIA-481-3

Abstract: EIA-481-2 MIC2557BM 56mm carrier tape Carrier tape for TO263 package 16MM TAPE PACKAGE
Contextual Info: Packaging for Automatic Handling Micrel Packaging for Automatic Handling Tape & Reel and Ammo Pack General Description Tape & Reel Surface mount and TO-92 devices are available in tape and reel packaging. Surface mount components are retained in an embossed carrier tape by a cover tape. TO-92 device

sm58a

Abstract: DO215AA EIA 481-C RGP10E DO-221
Contextual Info: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE PREFERRED ANTI-STATIC PACKAGE CODE PACKAGE CODE 51 PACKAGING DESCRIPTION Bulk 52, 52T P DO-214AA SMB /DO-215AA (SMBG), 12 mm tape, 7" diameter plastic reel

Contextual Info: Packaging Information www.vishay.com Vishay General Semiconductor Packaging Information PACKAGING ORDERING CODE ANTI-STATIC PREFERRED PACKAGE CODE PACKAGE CODE 51 PACKAGING DESCRIPTION Bulk 52, 52T P DO-214AA SMB /DO-215AA (SMBG), 12 mm tape, 7" diameter plastic reel

peel force

Abstract: Siemens matsua
Contextual Info: Taping Lead spacing 2,5 mm 4 1 Lead spacing 5,0 mm 4) 234 1) ± 1 mm / 20 hole spaces 2) Measured at top of component body 3) Peel force ≥ 5 N 4) Taping in accordance with IEC 286-2 10 Siemens Matsushita Components Packaging Ammo packaging Reel packaging

packaging

Contextual Info: Packaging and Order Information www.vishay.com Vishay Semiconductors Packaging and Order Information PACKAGING SURVEY RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the dry bag has been opened to prevent moisture absorption. TABLE 1 - PACKAGING OPTIONS OF

Contextual Info: REVISIONS SYM ZONE AMPHENOL PART NUMBER CONFIGURATION: U65 - X XX - X X 7 XXX c Z.L. IS A CAD DRAWING. DO NOT MANUALLY REVISE. PACKAGING/SPECIAL NO DIGIT = TRAY PACKAGING NO REAR COVER C = TRAY PACKAGING WITH REAR COVER SHIPPED LOOSE T = TAPE & REEL PACKAGING

TRANSISTOR BC 534

Contextual Info: THROUGH-HOLE PACKAGING REELS, TUBES, AMMO PACKS & TAPING SPECIFICATIONS MINIMUM PACKAGING QUANTITY MINIMUM PACKAGING QUANTITY Available Packaging Device Type 5KP 5W 5KW A-405 DF-M DO-15 D0-201 DO-201AD DO-35 DO-41 E-LINE GBJ GBPC/W GBU KBJ KBP KBPC/W MB/W

NCM20

Abstract: NCM50
Contextual Info: www.niccomp.com | Technical Support: tpmg@niccomp.com Leaded Components – Lead Spacing Guide RADIAL LEADED ALUMINUM ELECTROLYTIC CAPACITOR - PACKAGING Packaging Options Case Size 4X7 Qty Per Bag 200 BULK MOQ 12,000 Carton Quantity 48,000 TAPE & BOX TB

STR W 5453 A

Abstract: PLC programming beckhoff STR w 5453 c cnc wiring stepper motor CX1020 CX1000 EL2252 P1000 PLC using ARM based PROJECTS DC MOTOR SPEED CONtrol basic stamp
Contextual Info: BECKHOFF New Automation Technology PC-based Control for the Packaging Industry Beckhoff | Open automation solutions for the packaging industry 2 Packaging made from a vast range of materials and in different designs is part of the daily life of billions of consumers. The everchanging requirements for packaging machines are as diverse as

NEC stacked MCP 1999

Abstract: Stacked CSP 1999 MCP Technology Trend 13B1 NEC stacked CSP memory NEC stacked CSP 2000 Hitachi Stacked CSP sharp calculator
Contextual Info: Packaging Trends for Mobile Application Morihiro Kada Abstract The advent of the CSP has heralded a new paradigm in semiconductor packaging technology. Previously overshadowed by IC chips, packaging technology has begun to take center stage as a key factor in product competitiveness. Packaging technology will develop into 3D packages, and will create a

rc circuits

Contextual Info: INDUCTIVE COMPONENTS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Bourns Internal Bourns Plant Managers July, 2008 Model 79F - Elimination of Packaging in Bags Effective immediately, Model 79F will be only offered with packaging of 2000 pieces per ammopack box. We are no longer able to offer the 1000 pieces per bag packaging option. For your

74F686AP-3%-TR-RC

Contextual Info: INDUCTIVE COMPONENTS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Bourns Internal Bourns Plant Managers July, 2008 Model 79F - Elimination of Packaging in Bags Effective immediately, Model 79F will be only offered with packaging of 2000 pieces per ammopack box. We are no longer able to offer the 1000 pieces per bag packaging option. For your

Contextual Info: PARADIGM Module Packaging Advanced Packaging Advances in packaging techniques permit a wide variety of solutions to board space problems. M odules are comprised of individual semiconductor devises with other support devises, such as decoders and capacitors

-40SS

Abstract: philips tantalum Capacitors Philips LL capacitor axial 40SS philips philips tantalum
Contextual Info: Tape and Reel Packaging l _l Tantalum Capacitors Philips Components offers lead tape and reel packaging for axial leaded tantalum capacitors. Standard tape and reeling is per EIA specification RS-296, optional configurations for specific applications are available.

Contextual Info: Programmable LVDS Oscillator CARDINAL COMPONENTS Applications * LVDS Output * Fast Delivery * Industry Standard Packaging Part Numbering Example: CHL Z - A5 BP - 222.5792 TS BP CHL Z A5 SERIES CHL PACKAGING OPTIONS Blank = Bulk Z = Tape and Reel OPERATING TEMP.

circuit of smart hearing aid

Abstract: digital hearing aids digital pacemaker hearing aid chip Modelling pacemaker A449 A466
Contextual Info: FA C T F I L E ZARLINK ADVANCED PACKAGING MEDICAL Expertise in micro-packing—smaller, faster, more reliable Zarlink’s Advanced Packaging division delivers a competitive advantage for its customers by miniaturising electronic components to create smaller,