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    PACKAGING Search Results

    PACKAGING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
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    PACKAGING Price and Stock

    3M Interconnect PACKAGING-ADH

    HOT MELT PKG ADHESIVE 1=1STICK
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey PACKAGING-ADH Box 59 1
    • 1 $2.13
    • 10 $1.591
    • 100 $1.3124
    • 1000 $1.3124
    • 10000 $1.3124
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    FCL Ciomponents Limited CUSTOM PACKAGING-NRE

    NRE CHARGE FOR NEW FULL CUSTOM INNER CARTON PROTECTIVE SHIPPING PACKAGING - Virtual or Non-Physical Inventory (Software & Literature) (Alt: CUSTOM PACKAGING-NRE)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas CUSTOM PACKAGING-NRE No Container 31 Weeks 1
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    Super Micro Computer Inc CSE-213LTQ-R720UB-PACKAGING

    2U Chassis SAS/SATA 8-Port - Bulk (Alt: CSE-213LTQ-R720UB-)
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    Avnet Americas CSE-213LTQ-R720UB-PACKAGING Bulk 12 Weeks, 6 Days 1
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    Super Micro Computer Inc 4U90 PACKAGING

    PACKAGING FOR MCP-430-94704-0N - Bulk (Alt: 4U90 PACKAGING)
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    Avnet Americas 4U90 PACKAGING Bulk 12 Weeks, 6 Days 200
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    Super Micro Computer Inc 1U12 PACKAGING

    PACKAGING FOR MCP-430-80201-0N - Bulk (Alt: 1U12 PACKAGING)
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    Avnet Americas 1U12 PACKAGING Bulk 12 Weeks, 6 Days 200
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    PACKAGING Datasheets (35)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    Packaging Altera AN 114: Designing with FineLine BGA Packages Original PDF
    Packaging Altera AN 80: Selecting Sockets for Altera Devices Original PDF
    Packaging Altera AN 90: SameFrame Pin-Out Design for FineLine BGA Packages Original PDF
    Packaging Altera Altera Device Package Information Data Sheet Original PDF
    Packaging Altera AN 113: Plastic Package Reliability & Testing Original PDF
    Packaging Altera AN 71: Guidelines for Handling J-Lead & QFP Devices Original PDF
    Packaging Altera AN 81: Reflow Soldering Guidelines for Surface-Mount Devices Original PDF
    Packaging Atmel ATMEL Packaging Original PDF
    Packaging Lattice Semiconductor PB1094 -- Lattice Expands BGA Offering Original PDF
    Packaging Lattice Semiconductor LatticeNEWS, October 2003 Original PDF
    Packaging Lattice Semiconductor LatticeNEWS, July 2003 Original PDF
    Packaging Lattice Semiconductor LatticeNEWS, December 2003 Original PDF
    PACKAGING ADH 3M Tapes, Adhesives, Materials - Glue, Adhesives, Applicators - HOT MELT PACKAGING ADHESIVE AE L Original PDF
    Packaging Diagrams Microchip Technology Packaging - Outlines and Parameters Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution 330-mil Plastic SOP Package Code: U (28-pin) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution Mini Ball Grid Array Package Code: M (36-pin) Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution 150-mil Plastic SOP Package Code: G, GR Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution TQFP (Thin Quad Flat Pack Package) Package Code: TQ Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution 300-mil Plastic DIP Package Code: N,P Original PDF
    PACKAGING INFORMATION Integrated Silicon Solution LQFP (Low Profile Quad Flat Pack) Package Code: LQ (44-pin) Original PDF

    PACKAGING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: CUS08F30 Schottky Barrier Diode Silicon Epitaxial CUS08F30 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(3) = 0.40 V (typ.) (2) General-purpose USC package, equivalent to SOD-323 and SC-76 packages. 3. Packaging and Internal Circuit


    Original     		PDF CUS08F30 OD-323 SC-76

    Untitled

    Abstract: No abstract text available
    Text: CUS521 Schottky Barrier Diode Silicon Epitaxial CUS521 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(3) = 0.5 V (max) (2) General-purpose USC package, equivalent to SOD-323 and SC-76 packages. 3. Packaging and Internal Circuit


    Original     		PDF CUS521 OD-323 SC-76

    Untitled

    Abstract: No abstract text available
    Text: CUS10F30 Schottky Barrier Diode Silicon Epitaxial CUS10F30 1. Applications • High-Speed Switching 2. Features 1 Low forward voltage: VF(3) = 0.43 V (typ.) (2) General-purpose USC package, equivalent to SOD-323 and SC-76 packages. 3. Packaging and Internal Circuit


    Original     		PDF CUS10F30 OD-323 SC-76

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 23-Jun-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-9451301MPA ACTIVE CDIP JG


    Original     		PDF 23-Jun-2013 5962-9451301MPA 9451301MPA UCC1801 5962-9451302MPA 9451302MPA UCC1802 5962-9451303MPA 9451303MPA UCC1803

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 0672-2-15-01-30-27-10-0 Description: 0672 - Receptacle With No Tail Accepts .015-.025 diameter leads. Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 0672-2-15-01-30-27-10-0 200 - 300 " Tin/Lead over Nickel


    Original     		PDF C17200)

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 5301-0-05-15-00-00-01-0 Description: 5301 - Double Tail Header Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 5301-0-05-15-00-00-01-0 10 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL: BRASS ALLOY UNS C36000 per ASTM B 16


    Original     		PDF C36000) C/885 2002/95Annex

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 0664-3-15-80-06-80-10-0 Description: 0664 - Receptacle With A Turret Accepts .022-.032 diameter leads. Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 0664-3-15-80-06-80-10-0 200 - 300 " Tin matte finish over


    Original     		PDF C17200)

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 2325-2-00-80-00-00-07-0 Description: 2325 - Turret Terminal Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 2325-2-00-80-00-00-07-0 200 - 300 " Tin matte finish over Nickel 00 RoHS Compliant SHELL MATERIAL:


    Original     		PDF C36000) C/885 2002/95Annex

    Untitled

    Abstract: No abstract text available
    Text: Spec Sheet CERAMIC CAPACITORS High Value Multilayer Ceramic Capacitors High dielectric type LMK107B7225KA-T Features Item Summary 10V, X7R, 2.2 F, ±10%, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping paper 4000pcs Products characteristics table


    Original     		PDF LMK107B7225KA-T 4000pcs X7R/-55

    Untitled

    Abstract: No abstract text available
    Text: Spec Sheet CERAMIC CAPACITORS High Value Multilayer Ceramic Capacitors High dielectric type EMK316F106ZL-T Features Item Summary 16V, Y5V, 10 F, -20% to 80%, 1206 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping Embossed 2000pcs


    Original     		PDF EMK316F106ZL-T 2000pcs

    7010.7150

    Abstract: No abstract text available
    Text: 172322 Non resettable fuses www.schurter.com/pg01_2 Subminiature Fuse, 2.3 x 8 mm, Quick-Acting F, IEC, 125 VAC, 125 VDC IEC 60127-3 • 125 VAC · 125 VDC · Quick-Acting F Description References Standards Weblinks - High breaking capacity Packaging Details


    Original     		PDF com/pg01 125VAC 125VDC E42088 125VAC, 125VDC 13Plastic 37Taped 47Taped 7010.7150

    Untitled

    Abstract: No abstract text available
    Text: Spec Sheet INDUCTORS Wire-wound Chip Power Inductors BR series BRC1608T1R0M Features Item Summary 1.0 H(±20%), 850mA, 520mA, 0603 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 3000pcs Products characteristics table External Dimensions


    Original     		PDF BRC1608T1R0M 850mA, 520mA, 3000pcs 96MHz 850mA 520mA 140MHz

    Untitled

    Abstract: No abstract text available
    Text: Spec Sheet CERAMIC CAPACITORS High Value Multilayer Ceramic Capacitors High dielectric type AMK063BJ224MP-F Features Item Summary 4V, X5R, 0.22 F, ±20%, 0201 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping paper 15000pcs Products characteristics table


    Original     		PDF AMK063BJ224MP-F 15000pcs X5R/-55

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 3158-0-00-15-00-00-03-0 Description: 3158 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3158-0-00-15-00-00-03-0 10 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL:


    Original     		PDF C36000) C/885 2002/95Annex

    CB2012T100K

    Abstract: No abstract text available
    Text: Spec Sheet INDUCTORS Wire-wound Chip Power Inductors CB series CB2012T100KR Features Item Summary 10 H(±10%), 200mA, 520mA, 0805 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 3000pcs Products characteristics table External Dimensions


    Original     		PDF CB2012T100KR 200mA, 520mA, 3000pcs 52MHz 200mA 520mA 32MHz CB2012T100K

    Untitled

    Abstract: No abstract text available
    Text: Spec Sheet INDUCTORS Multilayer Chip Inductors CK series / CK series S type CK2125R10M-T Features Item Summary 0.1 H(±20%), 500mA, 0805 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 4000pcs Products characteristics table


    Original     		PDF CK2125R10M-T 500mA, 4000pcs 25MHz 500mA 235MHz

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 6218-0-00-15-00-00-03-0 Description: 6218 - Double Tail Header Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 6218-0-00-15-00-00-03-0 10 " Gold over Nickel 00 RoHS Compliant SHELL MATERIAL: BRASS ALLOY UNS C36000 per ASTM B 16


    Original     		PDF C36000) C/885 2002/95Annex

    LMK105BJ224KV-F

    Abstract: No abstract text available
    Text: Spec Sheet CERAMIC CAPACITORS High Value Multilayer Ceramic Capacitors High dielectric type LMK105BJ224KV-F Features Item Summary 10V, X5R, 0.22 F, ±10%, 0402 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping paper 10000pcs Products characteristics table


    Original     		PDF LMK105BJ224KV-F 10000pcs LMK105BJ224KV-F

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9557401QCA ACTIVE CDIP J


    Original     		PDF 24-Jan-2013 5962-9557401QCA 5962-9557401QC SNJ5432J 5962-9557401QDA 5962-9557401QD SNJ5432W JM38510/30501B2A JM38510/ 30501B2A

    Untitled

    Abstract: No abstract text available
    Text: Spec Sheet INDUCTORS Wire-wound Chip Inductors LB series LB2016T100M Features Item Summary 10 H(±20%), 155mA, 0806 Lifecycle Stage Mass Production Standard packaging quantity (minimum) Taping 2000pcs Products characteristics table External Dimensions 0806/2016


    Original     		PDF LB2016T100M 155mA, 2000pcs 52MHz 155mA 32MHz

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 855-22-006-30-001101 Description: Interconnect Header Spring-Loaded Header Vertical Mount Double Row Surface Mount Plating Code: 22 Shell Plating: 20 " Gold over 100 μ" Nickel Packaging: Packaged in Tubes # Of Pins Mill-Max Part Number


    Original     		PDF C36000) C/885 2002/95Annex

    MILL-MAX

    Abstract: No abstract text available
    Text: Product Number: 3158-0-00-01-00-00-03-0 Description: 3158 - Solderless Pressfit PCB Pin Packaging: Packaged in Bulk Mill-Max Part Number Shell Plating Contact Plating 3158-0-00-01-00-00-03-0 200 - 300 " Tin/Lead over Nickel 00 RoHS Compliant SHELL MATERIAL:


    Original     		PDF C36000) C/885 2002/95Annex MILL-MAX

    BENT LEAD transistor TO-92 Outline Dimensions

    Abstract: 2SC2712 equivalent 4TE12 diode ssc J Fet marking 2 AW 2SC2873 equivalent 90105 toshiba ultrasonic atomizing SMD TRANSISTOR MARKING 5c
    Text: 5. PA C K A G E FO R M S 5.1 PACKAGE FORM SELECTION TABLE 5.1.1 SUPER-MINI DEVICES S-MINI (SC-59 , SMQ (SC-61), SMV, SM6) PACKAGING FORM PACKAGE SPECIFI­ CATION OUTLINE Pack PACKAGE UNIT - e TE85L Taping EXTERIOR Unit: mm » » » 3000 pcs/ Reel TE85R TE85N


    OCR Scan     		PDF SC-59) SC-61) TE85L TE85R TE85N SC-70) BENT LEAD transistor TO-92 Outline Dimensions 2SC2712 equivalent 4TE12 diode ssc J Fet marking 2 AW 2SC2873 equivalent 90105 toshiba ultrasonic atomizing SMD TRANSISTOR MARKING 5c

    101ON

    Abstract: No abstract text available
    Text: TOSHIBA _ [ 7 ] 7. Handling Devices Handling Devices 7.1 Transport Handle devices and packaging materials with care. To avoid damage to the devices, do not toss or drop packages. During transport, ensure that devices are not subjected to


    OCR Scan     		PDF