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    PACKAGE INFORMATION Search Results

    PACKAGE INFORMATION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE INFORMATION Datasheets (173)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    Package Information Vishay CERDIP: 16 LEAD Original PDF
    Package Information Vishay QFN-16 LEAD (3 x 3) Original PDF
    Package Information Vishay SC89 3 Original PDF
    Package Information Vishay Diodes: Package Drawing - DO-35 Original PDF
    Package Information Vishay SOIC (NARROW): 16-LEAD Original PDF
    Package Information Vishay Diodes: Markings - Marking on Packages Original PDF
    Package Information Vishay CERDIP: 28 LEAD Original PDF
    Package Information Vishay SC 70: 3-LEADS Original PDF
    Package Information Vishay SQFP: 64-LEAD (10 x 10 x 1.4 MM) SQUARE (POWER IC ONLY) Original PDF
    Package Information Vishay PowerPAK 1212, (Single/Dual) Original PDF
    Package Information Vishay MLP33-10 Original PDF
    Package Information Vishay TO 206AC (TO 52) Original PDF
    Package Information Vishay SOT 23 (TO 236): 3-LEAD Original PDF
    Package Information Vishay PowerPAK MLP33-6, 8 and 10 Original PDF
    Package Information Vishay MSOP: 8-LEAD (POWER IC ONLY) Original PDF
    Package Information Vishay Optocouplers: Package Drawing - SOT-223-10 Original PDF
    Package Information Vishay TSSOP: 20-LEAD (POWER IC ONLY) Original PDF
    Package Information Vishay SOIC (WIDE BODY): 20 LEAD Original PDF
    Package Information Vishay T0-100 CAN: 10 LEAD Original PDF
    Package Information Vishay Diodes: Package Drawing - SOD-123-Pad Original PDF
    ...

    PACKAGE INFORMATION Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL

    Abstract: "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"
    Text: Package Information file:///D|/nec_intranet/package/index.htm Package Information Package Type Package List by NEC Code Explanation of Package and Packing Semiconductor Device Mounting Technology Manual Chip Size Package (CSP) BGA Family Flip Chip BGA (FCBGA)


    Original     		PDF

    7261 markem

    Abstract: Markem 7224 Ink 7224 markem Markem 7254 Ink 7224 markem black 7261 markem black 7261 markem white k 897 TO-46 weight 7224 white
    Text: HERMETIC PACKAGE INFORMATION PACKAGE TYPE CERDIP PACKAGE MATERIAL Ceramic DESCRIPTION Package Dimensions mm inch WIDTH HEIGHT(2) PACKAGE STYLE = PACKAGE Package Code CODE + Lead Count Flat Pack Glass Sealed Notes 2-June-2010 Lead Frame, Board Type RAIL/BULK


    Original     		14-Lead 18-Lead 150degC TPC460 2-June-2010 7261 markem Markem 7224 Ink 7224 markem Markem 7254 Ink 7224 markem black 7261 markem black 7261 markem white k 897 TO-46 weight 7224 white PDF

    sot-223 93

    Abstract: 3301 sot-89 3301-1000 5201 sot223
    Text: Package Information Package Types QFP Quad Flat Package The following are the package types and widths offered by Holtek. Pin Count DIP (Dual In-line Package) Pin Count Package Width Package Width 44, 48 10mm ´ 10mm 52 14mm ´ 14mm 8, 14, 16, 18, 20 300mil


    Original     		300mil 400mil 600mil 1mm/20pitches. sot-223 93 3301 sot-89 3301-1000 5201 sot223 PDF

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


    Original     		PDF

    CDIP14

    Abstract: cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14
    Text: INTEGRATED CIRCUITS DATA SHEET Package outlines Package information January 1995 File under Integrated Circuits, IC04 Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm


    Original     		OT108-1 OT109-1 OT162-1 OT163-1 OT137-1 OT136-1 OT337-1 CDIP24; OT94-1) MBB910 CDIP14 cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14 PDF

    32TSOP

    Abstract: No abstract text available
    Text: PACKAGE INFORMATION 1. OUTLINE DIMENSIONS FOR CDIP PACKAGE 2. OUTLINE DIMENSIONS FOR .600 FAMILY PDIP PACKAGE 3. OUTLINE DIMENSIONS FOR .300 FAMILY SOP PACKAGE 4. OUTLINE DIMENSIONS FOR .330 FAMILY SOP PACKAGE 5. OUTLINE DIMENSIONS FOR .450 FAMILY SOP PACKAGE


    Original     		32TSOP 40TSOP 64LQFP- 28TSOP 40TTLINE PDF

    transistor SO

    Abstract: SOL 18 package tab ic 14 pin ic dip datasheet 24-Pin Plastic DIP ic base for 40 pin DIP ic SOL-18 transistor 115 single inline 14gull
    Text: PACKAGE INFORMATION PACKAGE THERMAL CHARACTERISTICS PACKAGE THERMAL CHARACTERISTICS Allegro Package Code Package Type Common Package Designators Qty-Type of Terminals RθJA (°C/W) RθJC (°C/W) A Plastic Dual In-Line (DlP or PDlP) 14-Pin 16-Pin 18-Pin 20-Pin


    Original     		14-Pin 16-Pin 18-Pin 20-Pin 22-Pin 28-Pin 40-Pin transistor SO SOL 18 package tab ic 14 pin ic dip datasheet 24-Pin Plastic DIP ic base for 40 pin DIP ic SOL-18 transistor 115 single inline 14gull PDF

    1653G

    Abstract: No abstract text available
    Text: v00.0909 C-20 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-20 Package Outline Drawing Package Information Package Type C-20 Package Weight [1] 16.53g Spacer Weight 4.6g [1] Does not include connectors, or mounting hardware B - 24 NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR


    Original     		PDF

    DALLAS 2430A

    Abstract: 2430A DS2430AX-S TO-92 4 bits microcontroller DS2430AP T&R DS2430A DS2430AP DS2430AX J-STD-020A TSOC 6
    Text: ƒ ƒ ƒ ƒ ƒ es ig D ew 2 ORDERING INFORMATION N ot R ec DS2430A TO-92 Package DS2430AP 6-pin TSOC Package DS2430A/T&R TO-92 Package, Tape & Reel DS2430AP/T&R TSOC Package, Tape & Reel DS2430A+ TO-92 Package DS2430AP+ 6-pin TSOC Package DS2430A+T&R TO-92 Package, Tape & Reel


    Original     		DS2430A DS2430AP DS2430A/T DS2430AP/T DS2430A+ DS2430AP+ DS2430A DS2430AP DS2430AX DALLAS 2430A 2430A DS2430AX-S TO-92 4 bits microcontroller DS2430AP T&R DS2430AX J-STD-020A TSOC 6 PDF

    hssop

    Abstract: 32 QFP PACKAGE thermal resistance mitsubishi mounting technology
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES ORDERING INFORMATION TABLE OF CONTENTS 1 . GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION 3. PACKAGE STRUCTURE 4. PACKAGE CODING CONVENTIONS 5. PACKAGE LINE-UP 2 . DETAILED DIAGRAM OF PACKAGE OUTLINES


    Original     		PDF

    DIP40

    Abstract: LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1
    Text: PACKAGE INFORMATION Page Index DIP LQFP QFP SIL SO SSOP VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil)


    Original     		OT97-1 DIP14 OT27-1 DIP16 OT38-1 DIP20 OT146-1 DIP24 OT101-1 DIP28 DIP40 LQFP100 LQFP128 LQFP64 QFP44 DIP20 DIP28 015ad ZE 004-1 PDF

    pmfp

    Abstract: SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1
    Text: PACKAGE INFORMATION Page Index DIP PMFP SO VSO Soldering - Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1


    Original     		OT97-1 DIP16 OT38-1 OT144-1 OT96-1 OT96-2 OT158-2 pmfp SO8 package MS-012AA VSO40 SOT176-1 075E03 SOT144-1 PDF

    tensolite

    Abstract: No abstract text available
    Text: v01.0310 C-11 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-11 Package Outline Drawing Package Information NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. PLATING: GOLD PLATE OVER NICKEL PLATE Package Type C-11 Package Weight [1] 20 gms [2] 4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].


    Original     		231CCSF tensolite PDF

    MO-150

    Abstract: MO-187 MS-013 MS-026 TSOT23-5 103001 for mouse 44w SOT23
    Text: Package Information Package Types The following are the package types and widths offered by Holtek. LQFP Low profile Quad Flat Package Pin Count DIP (Dual In-line Package) Pin Count Package Width 8, 14, 16, 18, 20 300mil 24, 28, 32, 40, 42 600mil 28, 32, 40 (Ceramic)


    Original     		600mil 300mil MO-150 MO-187 MS-013 MS-026 TSOT23-5 103001 for mouse 44w SOT23 PDF

    oki qfp tray

    Abstract: Ultrasonic humidifier circuit 750H OKI Year Work Week "the package information document consisting of 8 chapters in total" Oki Moisture Oki Moisture level
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE This document is Chapter 3 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE


    Original     		PDF

    dallas 2430A

    Abstract: 2430A 2430A IC DS2430AP/T-R DS2430A DS2430AP DS2430AX DS2430AX-S J-STD-020A rn wire wrap
    Text: DS2430A 256-Bit 1-Wire EEPROM ƒ ƒ ƒ ƒ ƒ ORDERING INFORMATION N ot R ec DS2430A TO-92 Package DS2430AP 6-pin TSOC Package DS2430A/T&R TO-92 Package, Tape & Reel DS2430AP/T&R TSOC Package, Tape & Reel DS2430A+ TO-92 Package DS2430AP+ 6-pin TSOC Package


    Original     		DS2430A 256-Bit DS2430AP DS2430A/T DS2430AP/T DS2430A+ DS2430AP+ DS2430A DS2430AP dallas 2430A 2430A 2430A IC DS2430AP/T-R DS2430AX DS2430AX-S J-STD-020A rn wire wrap PDF

    QFP160-P-2828-0

    Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
    Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE


    Original     		PDF

    dallas 2430A

    Abstract: BF422 EQUIVALENT DS2430A T equivalent DS2430AP T
    Text: DS2430A 256-Bit 1-Wire EEPROM ƒ ƒ ƒ ƒ ƒ ORDERING INFORMATION N ot R ec DS2430A TO-92 Package DS2430AP 6-pin TSOC Package DS2430A/T&R TO-92 Package, Tape & Reel DS2430AP/T&R TSOC Package, Tape & Reel DS2430A+ TO-92 Package DS2430AP+ 6-pin TSOC Package


    Original     		DS2430A 256-Bit 64-bit 48-bit 56-G0006-001A 56-G0006-003A DS2430AX dallas 2430A BF422 EQUIVALENT DS2430A T equivalent DS2430AP T PDF

    SC-606-B

    Abstract: HM62256B MS-024BB HM6207H HM6208H HM6264B HM6287 HM6288 HM9264B 024bb
    Text: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration of your circumstance. When you use the package that has the material variation, please write down the package name in a form in


    Original     		DP-22N HM6287 DP-22NB HM6288 HM6208H DP-24NC HM6207H DP-28 HM62256B SC-606-B MS-024BB HM6264B HM9264B 024bb PDF

    LG ai 0068

    Abstract: sot162ag jedec Package TO-39
    Text: Philips Semiconductors Objective specification Package information Package outlines PACKAGES Packages in ascending order of packages outline version PACKAGE OUTLINE VERSION CODE RENAMED PACKAGE VERSION CODE (NON­ STANDARD) PACKAGE NAME DESCRIPTION PAGE


    OCR Scan     		OT27-1 OT38-1 OT38-4 OT96-1 OT97-1 OT101-1 OT102-1 OT108-1 OT109-1 OT136-1 LG ai 0068 sot162ag jedec Package TO-39 PDF

    SC-606-B

    Abstract: SC-555-24A BP-119 SC-639 MO-142BA MO-061-AB
    Text: Package Information Package Names and Code Designations T he package nam e assigned by the com pany is a package code indicating the shape of the package, the package m aterial, and the num ber o f pins. The diagram below show s the content o f the code designation.


    OCR Scan     		CP-28DN MO-077AB SC-633-A CP-32DB MO-061AB SC-638 TTP-32DR MO-133CA 119-0O BP-119 SC-606-B SC-555-24A SC-639 MO-142BA MO-061-AB PDF

    SC 2272

    Abstract: No abstract text available
    Text: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration o f your circumstance. When you use the package that has the material variation, please write down the package name in a form in


    OCR Scan     		DP-22N DP-22NB HM6287 HM6288 DP-24NC HM6208H HM6207H DP-28 HM62256B SC 2272 PDF

    EDR-7311

    Abstract: MS-024BB MO-142BO HN27C256A
    Text: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration o f your circumstance. When you use the package that has the material variation, please write down the package name in a form in


    OCR Scan     		DP-22N DP-22NB HM6287 HM6288 DP-24NC HM6208H HM6207H DP-28 HM62256B EDR-7311 MS-024BB MO-142BO HN27C256A PDF

    HM51W16405

    Abstract: No abstract text available
    Text: Package Information There are four types of package for the Hitachi IC Memories, Plastic Mold DIP, CERDIP, Flat Package and Chip Carrier. Please select a suitable package in consideration o f your circumstance. When you use the package that has the material variation, please write down the package name in a form in


    OCR Scan     		DP-22N DP-22NB HM6287 HM6288 DP-24NC DP-28 HM6208H HM6207H HM62256B HM51W16405 PDF