PACKAGE DIMENSION Search Results

igbt

Contextual Info: Package Dimensions SAMSUNG IGBT ♦ Package Dimensions 285 ELECTRONICS Package Dimensions SAMSUNG ÍGBT ♦ Package Dimensions 286 ELECTRONICS Package Dimensions SAMSUNG IGBT ♦ Package Dimensions 287 ELECTRONICS Package Dimensions SAMSUNG IGBT 4* Package Dimensions

d1ca

Abstract: S10VB STO-220 s4vb 67 s15vb s4vb AX057 AX06 AX078 S2VB
Contextual Info: OUTLINE DIMENSIONS Fig. 1 Package: AX057 Fig. 2 Package: AX06 Fig. 3 Package: AX06 Fig. 4 Package: AX06 Fig. 5 Package: AX078 Fig. 6 Package: AX10 Fig. 7 Package: AX10 Fig. 8 Package: AX14 Fig. 9 Package: AX14 1 • 8 0 0 • 6 3 4 • 3 6 5 4 OUTLINE DIMENSIONS

820 marking

Abstract: top marking codes MARKING CODE e1 6 lead marking 34 Marking code CS Marking MB linear marking code
Contextual Info: Package Description How Package Dimensions Are Indicated/Codes/Marking 1. How Package Dimensions Are Indicated 2. Package Codes 3. Marking DB81-10003-1E 1 Package Description (How Package Dimensions Are Indicated/Codes/Marking) 1. How Package Dimensions Are Indicated

7261 markem

Abstract: Markem 7224 Ink 7224 markem Markem 7254 Ink 7224 markem black 7261 markem black 7261 markem white k 897 TO-46 weight 7224 white
Contextual Info: HERMETIC PACKAGE INFORMATION PACKAGE TYPE CERDIP PACKAGE MATERIAL Ceramic DESCRIPTION Package Dimensions mm inch WIDTH HEIGHT(2) PACKAGE STYLE = PACKAGE Package Code CODE + Lead Count Flat Pack Glass Sealed Notes 2-June-2010 Lead Frame, Board Type RAIL/BULK

reel

Abstract: KCPSX04 300PCS Package 200PCS
Contextual Info: SMD DISPLAY TAPE SPECIFICATIONS KCSX02 PACKAGE: 650PCS / REEL KCDX02 PACKAGE: 300PCS / REEL KCSX03 PACKAGE: 550PCS / REEL KCDX03 PACKAGE: 300PCS / REEL KCDX04 PACKAGE: 250PCS / REEL KCPDX04 PACKAGE: 250PCS / REEL KCSX04 KCPSX04 NOTE: 1. All dimensions are in millimeters

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

32TSOP

Contextual Info: PACKAGE INFORMATION 1. OUTLINE DIMENSIONS FOR CDIP PACKAGE 2. OUTLINE DIMENSIONS FOR .600 FAMILY PDIP PACKAGE 3. OUTLINE DIMENSIONS FOR .300 FAMILY SOP PACKAGE 4. OUTLINE DIMENSIONS FOR .330 FAMILY SOP PACKAGE 5. OUTLINE DIMENSIONS FOR .450 FAMILY SOP PACKAGE

Contextual Info: PACKAGE DIMENSIONS CMOS DRAM PLASTIC DUAL IN-LINE PACKAGE 407 ELECTRONICS PACKAGE DIMENSIONS CMOS DRAM PLASTIC ZIGZAG IN-LINE PACKAGE 408 ELECTRONICS PACKAGE DIMENSIONS CMOS DRAM PLASTIC SMALL OUT-LINE J-LEAD 409 ELECTRONICS PACKAGE DIMENSIONS CMOS DRAM PLASTIC SMALL OUT-LINE J-LEAD

tensolite

Contextual Info: v01.0310 C-11 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-11 Package Outline Drawing Package Information NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. PLATING: GOLD PLATE OVER NICKEL PLATE Package Type C-11 Package Weight [1] 20 gms [2] 4. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS].

BGA and QFP Package mounting

Abstract: oki Package SOJ PGA wire bonding he package information document consisting of 8 chapters in total "the package information document consisting of 8 chapters in total"
Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 2. PACKAGE OUTLINES AND DIMENSIONS This document is Chapter 2 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 2. PACKAGE OUTLINES AND DIMENSIONS

10C2

Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension

2SC5652

Abstract: NE685 NE685M23 S21E RF TRANSISTOR 10 GHZ low noise
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE685M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

2SC5651

Abstract: NE688 NE688M23 S21E
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE688M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M03 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

2SC5650

Abstract: NE681 NE681M23 S21E
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE681M23 OUTLINE DIMENSIONS Units in mm FEATURES • PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

2SC5649

Abstract: 2SC564 NE856 NE856M23 S21E
Contextual Info: PRELIMINARY DATA SHEET NPN SILICON TRANSISTOR NE856M23 OUTLINE DIMENSIONS Units in mm FEATURES PACKAGE OUTLINE M23 NEW MINIATURE M23 PACKAGE: – World's smallest transistor package footprint — leads are completely underneath package body – Low profile/0.55 mm package height

HSOP-8

Abstract: Package Dimension HSOP8
Contextual Info: Package: HSOP-8 Unit : mm Package Dimension

transistor b 647 c

Contextual Info: PACKAGE DIMENSIONS Dimensions in Milimeters SOT-23 2 9 0 . o 20 SOT-89 . 1 5 0 0 20 _ Ì L _ I 1— $ - 641 ELECTRONICS PACKAGE DIMENSIONS 642 ELECTRONICS PACKAGE DIMENSIONS 643 ELECTRONICS PACKAGE DIMENSIONS Dimensions in Milimeters 644 ELECTRONICS PACKAGE DIMENSIONS

Application Notes

Abstract: MWT-7
Contextual Info: FET Application Notes Package Information Package Outlines All Leads are Gold-Plated Kovar Dimensions are in Inches and mm Package 71 (Solder Seal) Package 70 (Solder Seal) Package 73 (Epoxy Seal) 0.98 (2.5) 0.07 (1.78) 0.10 (2.5) Min. All Leads D D .25

Contextual Info: SUBMINIATURE SOLID STATE LAMP AM2520F3C03 Features Description ! SUBMINIATURE PACKAGE. F3 Made with Gallium Arsenide Infrared Emitting ! GULL WING. diodes. ! LONG LIFE - SOLID STATE RELIABILITY. ! LOW PACKAGE PROFILE. ! PACKAGE: 1000PCS / REEL. Package Dimensions

Contextual Info: SUBMINIATURE SOLID STATE LAMP AM2520F3C03 Features Description ! SUBMINIATURE PACKAGE. F3 Made with Gallium Arsenide Infrared Emitting diodes. ! GULL WING. ! LONG LIFE - SOLID STATE RELIABILITY. ! LOW PACKAGE PROFILE. ! PACKAGE: 1000PCS / REEL. Package Dimensions

R604A

Abstract: diode r207 R605A 60 diode R702 erg28 AF91-471 R205A R606A
Contextual Info: DIODE MODULES Dimensions mm ERG28-12 ERG78-12 2 in one-package R201 19.6m >•> 017" AF89-692 (AF88-456) + ERG28 4-ERG78 1 1n one-package R101 (AF91-473) 2 in one-package R204 1 in one-package R102 (AF91-471) 3 M5<10 p" 59 mm 2 in one-package R207 2 in one-package

tensolite

Abstract: tensolite price
Contextual Info: v01.0310 C-9 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-9 Package Outline Drawing Typical Package Weight Package 18.7 gms Spacer 3.3 gms NOTES: 1. PACKAGE, LEADS, COVER MATERIAL: KOVAR 2. FINISH: GOLD PLATE OVER NICKEL PLATE 3. ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]

HD64572

Contextual Info: Section 10 Package Dimensions 10.1 Package Dimensions Figure 10-1 shows the HD64572 package dimensions. 132 26.0 + 0.2 D 24 133 1.25 1.0 0.510.1 Figure 10-1 Package Dimensions FP-176 HITACHI 497

TO-251 footprint

Abstract: motorola triac catalog DO204AH Packages thyristor T 218 N Thyristor catalog RCA THYRISTOR isolated gate Thyristor
Contextual Info: M1 Package Dimensions M1 This section contains the dimensions for the following packages: • F Package — TO-202AB, Type 1 Non-isolated • Y Package — DO-35 or DO-204AH • R Package — TO-220AB (Non-isolated) • L Package — TO-220AB (Isolated)