P09N02 Search Results

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Catalog Datasheet	MFG & Type	PDF	Document Tags
P09N02 Abstract: No abstract text available Text: v03.0207 QUALITY & RELIABILITY QUALITY ASSURANCE Standard Process for Packaged MMICs C8, G7, G8, G16, LC3B, LC4, LC5, LH5, LH250, LM1, LM3, LM3B, P7 Packages Pick Die from Qualified Wafers 100 % Visual Inspect Kit and Record Lot Numbers Clean Package Die Attach/Epoxy Cure	Original	PDF	LH250, W10N02, W10N03, W09N03, W09N04, P15N04, P03N01, P09N02, P09N02
P09N02 Abstract: No abstract text available Text: v00.1106 QUALITY ASSURANCE Record Lot Number on List of Materials for Each Part Listed Inspect MMICs and ICs Clean Housing Install Feedthrus Clean Housing Epoxy Substrates Solder Components Clean Housing Epoxy Attach All Chip Components Wirebond 100% Visual Inspection	Original	PDF	W10N02, W09N01, W09N32 W09N03, MIL-STD-883 P15N04, P03N01, P09N02, P09N02
Untitled Abstract: No abstract text available Text: v03.0207 Standard Process for Plastic Encapsulated MMICs DFN, MSOP, QFN, QSOP, SOIC, SOT Packages Kit Qualified Wafers Visual Inspection Ship IC Sub-contract Assembly Vendor Inspect and Configure Kit at IC Sub-Contractor 100% Visual Inspect “2nd Optical”	Original	PDF	P15N04, P03N01, P09N02,
Untitled Abstract: No abstract text available Text: v02.0106 Standard Process for Commercial MMIC Chips Die Receive Wafers 1. Per P10N02, Receiving Inspection Traceability 2. Per 101099, Wafer Incoming Inspection Procedure PCM Review 3. Per 101099, Wafer Incoming Inspection Procedure 4. Per W10N03, Wafer Inspection Procedure	Original	PDF	P10N02, W10N03, MIL-STD-883 2011D P03N01, P09N02, W15N02, W10N02,