OSOP Search Results

MO-137

Abstract: OSOPA5000B
Contextual Info: OSOP Vishay Thin Film Molded, 25 mil Pitch, Dual-In-Line Resistor, Surface Mount Network FEATURES • 0.068" 1.73 mm maximum seated height • Rugged molded case construction with no internal solder • JEDEC MO-137 variation AD • Compliant to RoHS directive 2002/95/EC

OSOP

Contextual Info: SURFACE MOUNT NETWORKS SURFACE MOUNT OSOP Vishay Thin Film Molded, 25 Mil Pitch, Dual-In-Line Resistor Network FEATURES • 0.068" 1.73mm maximum seated height • Rugged molded case construction with no internal solder Actual Size • Highly stable thin film

Contextual Info: OSOP www.vishay.com Vishay Dale Thin Film Molded, 25 mil Pitch, Dual-In-Line Thin Film Resistor, Surface Mount Network FEATURES • 0.068" 1.73 mm maximum seated height • Rugged molded case construction with no internal solder • JEDEC MO-137 variation AD

Contextual Info: p_R_E C I_S_1 O N _T_ H I N F I L M T E C H N O L O G Y SM T N ETW O R K S Molded, 25 Mil Pitch, Dual-ln-Line Resistor Network T h in F ilm OSOP Series F eatures • 0.068 1.73 mm maximum seated height • Rugged molded case construction with no internal solder

MO-137

Abstract: OSOPA5000B
Contextual Info: OSOP Vishay Thin Film Molded, 25 mil Pitch, Dual-In-Line Resistor, Surface Mount Network FEATURES • 0.068" 1.73 mm maximum seated height • Rugged molded case construction with no internal solder • JEDEC MO-137 variation AD • Compliant to RoHS directive 2002/95/EC

marking 722

Abstract: OSOPA5000B OSOP
Contextual Info: SURFACE MOUNT NETWORKS SURFACE MOUNT OSOP Vishay Thin Film Molded, 25 Mil Pitch, Dual-In-Line Resistor Network FEATURES • 0.068" 1.73mm maximum seated height • Rugged molded case construction with no internal solder • Highly stable thin film Actual Size

500 volts resistor 100k ohm

Abstract: OSOP
Contextual Info: SURFACE MOUNT NETWORKS SURFACE MOUNT OSOP Vishay Thin Film Molded, 25 Mil Pitch, Dual-In-Line Resistor Network FEATURES Actual Size • Lead Pb -Free available • 0.068" (1.73mm) maximum seated height • Rugged molded case construction with no internal solder

Contextual Info: Thin Film North America Review of Select Products - 2009 THIN FILM NA RESISTORS PRECISION DIVIDERS AND NETWORKS MATCHED PAIRS MP, MPM, MPD SC70, SOT23, SOT143 SERIES MATCHED NETWORKS ORN, NOMC, OSOP (SOIC 8, 14, 16, 20) SERIES CSO CUSTOMS MARKET TRENDS ¾ TRANSITIONING AWAY FROM CUSTOMS TO STANDARD OFF-THE-SHELF VALUES

OSOPA5000B

Contextual Info: P R E C I S I O N T H I N F I L M T E C H N O L O G Y Molded, 25 Mil Pitch, Dual-In-Line Resistor Network OSOP Series FEATURES • 0.068" 1.73mm maximum seated height • Rugged molded case construction with no internal solder Actual Size • Highly stable thin film

OSOP

Contextual Info: SURFACE MOUNT NETWORKS SURFACE MOUNT OSOP Vishay Thin Film Molded, 25 Mil Pitch, Dual-In-Line Resistor Network FEATURES Actual Size • Lead Pb -Free available • 0.068" (1.73mm) maximum seated height • Rugged molded case construction with no internal solder

Contextual Info: OSOP www.vishay.com Vishay Dale Thin Film Molded, 25 mil Pitch, Dual-In-Line Thin Film Resistor, Surface Mount Network FEATURES • 0.068" 1.73 mm maximum seated height • Rugged molded case construction with no internal solder • JEDEC MO-137 variation AD

Contextual Info: OSOP www.vishay.com Vishay Dale Thin Film Molded, 25 mil Pitch, Dual-In-Line Thin Film Resistor, Surface Mount Network FEATURES • 0.068" 1.73 mm maximum seated height • Rugged molded case construction with no internal solder • JEDEC MO-137 variation AD

OSOP

Contextual Info: SURFACE MOUNT NETWORKS OSOP Vishay Thin Film Molded, 25 Mil Pitch, Dual-In-Line Resistor Network FEATURES • Lead Pb -free available • 0.068" (1.73 mm) maximum seated height • Rugged molded case construction with no internal solder • Thin film element

OSOP

Contextual Info: SURFACE MOUNT NETWORKS OSOP Vishay Thin Film Molded, 25 Mil Pitch, Dual-In-Line Resistor Network FEATURES • Lead Pb -free available • 0.068" (1.73 mm) maximum seated height • Rugged molded case construction with no internal solder • Thin film element

OHL04576

Abstract: IEC 62471 Q65111A
Contextual Info: OSLON SSL Ceramic package - 150° radiation pattern Lead Pb Free Product - RoHS Compliant LCW CQDP.CC Released Besondere Merkmale • Gehäusetyp: SMT-Keramikgehäuse mit Silikonverguss und Linse • Typischer Lichtstrom: 74 lm bei 350 mA und bis zu 127 lm bei 700 mA (4000 K)

X 0404

Abstract: VSOR2000S1 M1005 SOIC-16 mpd dfn LCC16 MM4000 WOMC
Contextual Info: Tape and Reel Specifications Vishay Thin Film 8 mm, 12 mm, 16 mm and 24 mm Embossed Conductive Tape Conforming to EIA-481 Note • Chip resistor quantities less than 1000 pieces are typically packaged in bulk or waffle packs unless specified at time of order entry.

Contextual Info: CY54/74FCT257T QUAD 2-INPUT MULTIPLEXERS CYPRESS FEATURES • Power-off disable feature ■ Function, Pinout and Drive Compatible with the FCT and F Logic ■ Matched Rise and Fall times ■ FCT-C speed at 4.3ns max. Com'i FCT-A speed at 5.0ns max. (Com'l)

transistor smd za

Abstract: smd transistor HX smd transistor HX 45 transistor smd xc transistor smd xb smd diode code T7 INTERSIL CROSS REFERENCE clocks ceramic pin grid array CPGA solder wire HMP CA3260
Contextual Info: Ordering Nomenclature I NTERSIL N OMENCLATURE GUIDE Intersil Nomenclatures ISL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 EL Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

RISCwatch

Abstract: E5903-66504 13H6984 RS232 to TCP-IP LAN Ethernet converter AC/ DC adapter RISCWatch Programming Interface 16-PIN JTAG HEADER 16-pin JTAG CONNECTOR
Contextual Info: IBM RISCWatch Debugger Installation Guide 13H6984 Twelfth edition August 2000 This edition of IBM RISCWatch Debugger Installation Guide applies to IBM RISCWatch Debugger Version 4.6 and to all subsequent versions of the debugger until otherwise indicated in new versions or technical newsletters.

Nippon capacitors

Contextual Info: HB56D473EJ Series 4,194,304-word x 72-bit High Density Dynamic RAM Module HITACHI ADE-203-725A Z Rev. 1.0 Feb. 27, 1997 Description The HB56D473EJ belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. The

270W2

Contextual Info: 19 - 1198 ; R e v 0 ; 4 /9 7 A i y i X I A I 3-Cell, High-Current, Low-Noise, Step-Up DC-DC Converters with Linear Regulator f- to The MAX1705/MAX1706 are high-efficiency, low-noise, ste p -u p DC-DC converters with an auxiliary lihearregulator output. These devices are intended for use in

MAX1246-4

Abstract: transistor P 0225 transistor 1247
Contextual Info: 1 9-1071; R e v 1; 3 /9 7 A 1 / X I V M +2.7V, Low’•Power\ 4-Channel, Serial 12-Bit ADCs in QSOP-16 The 4-wire serial interface connects directly to SPI / QSPI™ and Microwire™ devices without external logic. A serial strobe output allows direct connection to TMS320family digital signal processors. The MAX1246/MAX1247

16-DIP

Abstract: ron 350 IH5048
Contextual Info: Analog Switches I 8 x SPST* I DPST SPDT SPST MAX335 octal MAX395* (octal) 6 0 & 300 2 0 0 or 2 5 0 MAX4514Í (single; MAX4515* (single) MAX4516Í (single) MAX4517Í (single) IH5048A (dual) - 60 & 600 t MAX4555 100 t MAX4554 t MAX4556 MAX312 (quad) MAX313 (quad)

OSOP

Contextual Info: Vishay Thin Film Molded, 25 Mil Pitch, Dual-In-Line Resistor Network FEATURES • Lead Pb -free available • 0.068" (1.73 mm) maximum seated height • Rugged molded case construction with no internal solder • Thin film element • JEDEC MO #137 Package AD