tc 97101
Abstract: D472
Text: ADVANCE M IC B D N I ' I 4 MEG BURST EDO DRAM MODULE MT9LD272 B N , MT18LD472 B(N) 72 BURST ED0 DRAM MODULES 2, 4 MEG X 72 16, 32 MEGABYTE, 3.3V, ECC, BURST EDO FEATURES • • • • • • • • • 168-pin, dual-in-line memory module (DIMM) ECC pin-out
|
OCR Scan
|
MT9LD272
MT18LD472
168-pin,
048-cycle
T18LCW
tc 97101
D472
|
PDF
|
TME 87
Abstract: 1ZD12 tme 126 30 oc9 002
Text: ^EDI EDI8F6432C ß fC T R O M C D ESGNS. M C 32Kx64 SRAM Module 32Kx64 Static RAM High SpeedCMOS Cache Memory/Module Features 256KB Secondary Cache Module The EDI8F6432C is a high speed 256KB secondary cache • For use with Intel Pentium Based Systems module which is ideal for use with many Intel Pentium CPU-based
|
OCR Scan
|
256KB
66MHz
CELP2X80CS3Z48
EDI8F6432C
32Kx64
EDI8F6432C
EDI8F6432C15MDC
EDI8F6432C20MDC
TME 87
1ZD12
tme 126
30 oc9 002
|
PDF
|
Untitled
Abstract: No abstract text available
Text: " H Y U H D A I — • HYM5V64404C K-Series Unbuffered 4Mx64 bit EDO DRAM MODULE based on 4Mx4 DRAM, 3.3V, 4K-Refresh GENERAL DESCRIPTION The HYM5V64404C K-Series is a 4Mx64-bit Extended Data Out mode CMOS DRAM module consisting of sixteen HY51V16404C in 24/26 pin SOJ or TSOP-II and one 2048 bit EEPROM on a 168 pin glass-epoxy
|
OCR Scan
|
HYM5V64404C
4Mx64
4Mx64-bit
HY51V16404C
HYM5V64404CKG/CTKG
168-Pin
256ms
A0-A11)
DQ0-63)
|
PDF
|
Untitled
Abstract: No abstract text available
Text: MITSUBISHI LSIs Some contents are subject to change without notice. MH1 S64CXJJ-12,-15 67108864-B IT 1048576-W Q RD BY 64-BIT SynchronousDRAM DESCRIPTION The MH1S64CXJJ is 1048576-word by 64-bit Synchronous DRAM module. This consists of four industry standard 1Mx16 Synchronous DRAMs in
|
OCR Scan
|
S64CXJJ-12
67108864-B
048576-W
64-BIT
MH1S64CXJJ
1048576-word
64-bit
1Mx16
83MHz
67MHz
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HYUNDAI HYM5V72A214A F-Series Unbuffered 2M x 72-bit CMOS DRAM MODULE with EXTENDED DATA OUT DESCRIPTION The H YM 5V 72A 214A is a 2M x 72-bit EDO m ode C M O S DRAM module consisting of nine H Y51V 17804B in 28 28 SOJ or TSOP-II and one 2048 bit EEPROM on a 168 pm glass-epoxy printed circuit board. 0 ln F and 0.01 uF
|
OCR Scan
|
HYM5V72A214A
72-bit
17804B
A0-A10)
1EC07-10-JAN96
5V72A
|
PDF
|
bt 1690 transistor
Abstract: bt 1696 lc 945 p transistor NPN TO 92 bt 1690 philips of bt 1696 bt 1696 transistor lc 945 p transistor C 3355 transistor transistor bt 667 transistor 2028
Text: Philips Semiconductors Product specification PNP 5 GHz wideband transistor P H IL IP S I N T E R N A T I O N A L DESCRIPTION <01 ' / SLE D • g BFQ51 711GflBb 0D454fc>7 421 B I P H I N PINNING PNP transistor in a plastic SOT37 envelope. It is primarily intended for use in RF
|
OCR Scan
|
BFR90A.
BFQ51
711GflBb
0D454fc
bt 1690 transistor
bt 1696
lc 945 p transistor NPN TO 92
bt 1690 philips
of bt 1696
bt 1696 transistor
lc 945 p transistor
C 3355 transistor
transistor bt 667
transistor 2028
|
PDF
|
CLAA141XB01
Abstract: 71-22T00-D03 TLR303 LP141X5 cy4h Z768 LP133X7 IK04 JC283 ht13x
Text: Schematic Diagrams Appendix B: Schematic Diagrams Mainboard 71-22T00-D03 Sheet 1 of 31 OVCCT H 0*3 635 l U ifl AMO S _ d A l i _AW L S _-£iA*2_AMU \ ;iA * . . \ _ AfcLUL V_ H M 2 _ AL2_ \ _ HAJL1G_Afctfe. _ K _ H A I l i t _ A tti\ . H A lL i. AkL
|
OCR Scan
|
71-22T00-D03)
MDI12
HA122_
HAH21,
RB751V
PR104
DTC114EUA
PC105
2N7002
PC112
CLAA141XB01
71-22T00-D03
TLR303
LP141X5
cy4h
Z768
LP133X7
IK04
JC283
ht13x
|
PDF
|
FS DMO 365 RN
Abstract: mxj A1 connector LS 2027 audio amp MA81C WDA42 lx4 d09 st3pc 13T4 0601N D1661
Text: Model : F17P R:1 Intel Pentium 4 LGA775 +PT880+VIA8235 C E PCB STACK UP LAY1 LAY 2 LAY 3 LAY 4 LAY 5 LAY 6 LAY 7 LAY 8 LAY 9 LAY10 TOP GND INI IN2 GND1 VCC IN3 IN4 GND2 BOTTOM Revision History A O R IG IN A L RE LEA SE fe . cCL V?, o . ^ •Pff' j L
|
OCR Scan
|
LGA775)
PT880
VIA8235
LAY10
-F4011
35-A05502-00A
F17P-PCB-IV-LED
-E4985
F17P-PCB
35-A05002-00D
FS DMO 365 RN
mxj A1 connector
LS 2027 audio amp
MA81C
WDA42
lx4 d09
st3pc
13T4
0601N
D1661
|
PDF
|
Untitled
Abstract: No abstract text available
Text: HYMA6V32730E14HGTG 32MX72, 3.3V, 4K Ref, EDO Description The HYMA6V32730E14HGTG familiy is an 32Mx72 bits Dynamic RAM Module which is assembled 36 pieces of 16Mx4bit DRAMs in 32pin TSOP-II package and two 16bit driver ICs in 48pin TTSOP package and 8bit driver IC in
|
OCR Scan
|
HYMA6V32730E14HGTG
32MX72,
HYMA6V32730E14HGTG
32Mx72
16Mx4bit
32pin
16bit
48pin
20pin
168pin
|
PDF
|
Untitled
Abstract: No abstract text available
Text: DRAM MODULE KMM364V41 OAK/AS KMM364V41 OAK/AS Fast Page Mode 4Mx64 DRAM DIMM , 2K Refresh, 3.3V G EN E R A L D ES C R IPTIO N FEATURES The Samsung KMM364V410A is a 4M bit x 64 Dynamic RAM high density memory module. The Samsung KMM364V410A consists of sixteen CMOS
|
OCR Scan
|
KMM364V41
4Mx64
KMM364V410A
300mil
48pin
168-pin
|
PDF
|