NX3P1107 Search Results

Contextual Info: Package outline WLCSP4: wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm Backside coating included A B D NX3P1107/NX3P1108 A2 ball A1 index area A A1 E detail X e 1/2 e C A B C Øv Øw b C y B 1/2 e e A ball A1 index area 1 2 X 1 mm scale Dimensions (mm are the original dimensions)

Contextual Info: NX3P1107 Logic controlled high-side power switch Rev. 1 — 9 January 2013 Product data sheet 1. General description The NX3P1107 is a high-side load switch which features a low ON resistance P-channel MOSFET that supports more than 1.5 A of continuous current. Designed for operation

NX3P1108

Contextual Info: NX3P1108 Logic controlled high-side power switch Rev. 1 — 9 January 2013 Product data sheet 1. General description The NX3P1108 is a high-side load switch which features a low ON resistance P-channel MOSFET that supports more than 1.5 A of continuous current. It has an integrated output

Contextual Info: NXP Load Switches and Over-Voltage Protection ICs Simple, efficient, protection and control with smallest footprint NXP’s integrated load switch and OVP families, NX3P/NX5P/NX18P, provide simple and efficient power distribution solutions to reduce system power consumption,