NITTO TAPE, 500 Search Results

Nitto 5015

Abstract: nitto denko adhesive DAC2450CT1 nitto denko 5015 N5015 nitto tape
Contextual Info: ANTENNA ELEMENT FOR 2.4 GHz DESCRIPTION The DAC Series is a miniature dielectric antenna element for 2.4 GHz wireless LAN systems. This antenna has vertical polarization characteristics. TOKO's proprietary ceramic dielectric material provides excellent stability

SMD LED 5680

Abstract: LC-1500 MAX PLUS II free X362 3M reflective tape nitto tape, 500
Contextual Info: American Opto Plus LED BL-S3547LW-F ™ 34.7mm x 46.70mm ™ V.A.: 30.74mm x x36.24mm ™ FPC Type White Side-Look LCD Backlight PACKAGE DIMENSIONS Notes: 1. All dimensions are in millimeters monitoring Rev. 1.0 July 2006 2. Not Specified tolerance is ± 0.2mm 3.

Denko

Abstract: NITTO DENKO H9004 1.5DS 5Cs transistor separator nitto denko GT13S-1S-HU H9004 1.5CS
Contextual Info: MITSUMI Film Antenna for Digital Terrestrial Broadcasting Receiver DCA-C01 Telecommunication component OUTLINE This film antenna receives the terrestrial digital broadcast signal. Antenna unit can be mounted on the glass window of the car with ease, and has a built-in

TSS463

Abstract: Nitto MP8000 MARKING Z86 1000 BASE Isolation Modules 5000V EOS ESD S 61.1 hmt design data book MOLDING MATERIAL MP8000 HT Q100 temic gateway EIA-556-A
Contextual Info: Qualpack TSS463 / TSS461C TSS463 VAN Van Controller Serial Interface TSS461C VAN Van Controller TSS463/TSS461C VAN Controllers 1999 January TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY Rev. 2 – January 1999 1 Qualpack TS80C31X2/C32X2 1. Contents 1. Contents. 2

TAIYO PSR 4000

Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

MP 130B

Abstract: sumitomo epoxy LPV324M MP 130B 02 cf 5097 nitto UV tape A193K NSC marking code PB eme-7351ls eme marking sot23
Contextual Info: LPV321/358/324 Qualification Package 9µA Op Amp Family With 150kHz GBW NEW LPV FAMILY Part # Function Package LPV321 LPV358 LPV324 Single Dual Quad SC70-5, SOT23-5 SOIC, MSOP SOIC, TSSOP LPV Series LMV Series National’s Low-Power LPV300 Familiy IN SC70 Packaging

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

Contextual Info: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high-performance, double-balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green

Nitto 5015

Abstract: DAC2450CT1 PIFA DAC2450CT3 INVERTED F PCB ANTENNA
Contextual Info: DIELECTRIC ANTENNA ELEMENT FOR WIRELESS LAN SYSTEMS 2.4GHz無線LAN用誘電体アンテナ素子 DAC Series The DAC Series is a miniature dielectric antenna for 2.4GHz band wireless LAN systems. This antenna has vertical polarization characteristics. It is manufactured using high-performance

nitto tape

Contextual Info: PIN Diode Chips Supplied on Film Frame SMP1320-099, SMP1322-099, SMP1340-099, SMP1353-099 Features • Designed for High Performance Switch Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame

yellow 5mm LED basic

Abstract: LVY9033 nitto tape, 500
Contextual Info: LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT TYPE AND REEL LVY9033/TR2 DATA SHEET DOC. NO : QW0905-LVY9033/TR2 REV. : A DATE : 09 - Jun - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LVY9033/TR2 Package Dimensions

pin diode SMP

Abstract: SMP1302-099
Contextual Info: PIN Diode Chips Supplied on Film Frame Features • Designed for High Performance Switch and Attenuator Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame ■ Low Cost Description The SMP series of PIN diodes are designed for high

MO-150

Abstract: C194 MP8000AN G600 MO-137 amkor
Contextual Info: LEADFRAME data sheet SSOP Features: Shrink Small Outline SSOP Packages: How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. The body size was compressed and the lead pitch tightened to obtain a smaller

Contextual Info: PIN Diode Chips Supplied on Film Frame Features • Designed for High Performance Switch and Attenuator Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame ■ Low Cost Description The SMP series of PIN diodes are designed for high

Cosel

Contextual Info: SLIM STICK S-TYPE LED MODULE APPLICATIONS MANUAL WARNING ・ Direct LED emission can seriously damage the eyes. Never view a LED emission directly. ・ Never use a disassembled LED module. ・ A LED generates heat while it is emitting. The ambient temperature is increased by 20℃

Contextual Info: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high performance double balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost 2 ● 1

underfill

Abstract: with or without underfill intel C4 package underfill for good adhesion and low viscosity Low viscosity underfill for flip chip microwave oven
Contextual Info: Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel Corp. Tomomi Kume, Japan Package Technology Development, Intel Corp.

200165

Abstract: SMS3927-099 SMS3926 SMS3926-099 SMS3927 SMS3928 SMS3928-099 Schottky diode wafer
Contextual Info: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high-performance, double-balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green

FEBFSL126MR_H432V1

Abstract: sck053 ceramic buss SR-5 UU9.8 ferrite core E157822 468-2FC sck-053 E85640 Nitto 31ct KUHS-225
Contextual Info: User Guide for FEBFSL126MR_H432v1 Evaluation Board 5V, 12V Green-Mode Fairchild Power Switch FPS Featured Fairchild Product: FSL126MR Direct questions or comments about this evaluation board to: “Worldwide Direct Support” Fairchild Semiconductor.com

5252 F 1008

Abstract: transistor 1FX sd 1074 transistor SCR SN 100 folded cascode current mirror op amp FSC20000512 LMV712 MSOP-10 MSOP-10L Q-2000
Contextual Info: LMV712 Rail-to-Rail I/O, Dual Op Amp Qualification Package National’s LMV712 Dual Op Amp Offers 5V/µs Slew Rate, 5 MHz GBW LLP-10 • 0.1 µA Shutdown Current • Noise at <20 nV/√ Hz @ 1 kHz • Drives 600Ω Load @ 2.7V Actual Size 3 mm x 3 mm x .75 mm

A48 sc70

Abstract: FSC20010035 LMV301 LMV321 LMV821 SC70-5 SC70-5L LMV301MGX
Contextual Info: LMV301 Low Input Bias Current, Single Op Amp Qualification Package National’s LMV301–Low Power, Low Voltage, Single Op Amp Delivers RR/O in a Space Saving SC70 Package IBIAS Current vs. VCM 5 VS =5V 4 IBIAS pA - • Low Input Bias Current (0.18 pA Typ.)

transistor KSP 42

Abstract: irf950 IRFP100 transistor KSP 56 transistor KSP 92 G 23 ksp 36 93 IRF9500 transistor KSP 13 Samsung "NAND Flash" "ordering information" IRFP p-channel
Contextual Info: ORDERING INFORMATION KSV 3100A C N/ + BURN-IN OPTIONAL (SEE BURN-IN PROGRAM) PACKAGE TYPE (SEE EACH SPEC OF DEVICE) OPERATING TEMP IC’S ONLY BLANK: SEE INDIVIDUAL SPEC C : 0 - 70°C I : - 40 - 85°C M : - 5 5 - + 125°C DEVICE NUMBER AND SUFFIX (OPTIONAL)

SMP1302-099

Abstract: SMP1304-099 SMP1320 SMP1320-099 SMP1322 SMP1322-099 SMP1340 SMP1340-099 SMP1353-099
Contextual Info: DATA SHEET PIN Diode Chips Supplied on Film Frame Features Designed for high performance switch and attenuator applications ● Preferred device for module applications ● PIN diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Description

lm6642

Abstract: NATIONAL SEMICONDUCTOR MARKING CODE 277 marking code 604 SOT23-6 sumitomo epoxy Nitto UV MARKING 5501 SOT23-5 sot23-6 marking code 593 nitto UV tape NS Package Number MF05A operational amplifier discrete schematic
Contextual Info: LMH Products Qualification Package LMH6642, LMH6643, LMH6645, LMH6646, LMH6647, LMH6654, LMH6655 and LMH6672 National's LMH66xx family of operational amplifiers is a new series of high-speed products based on the VIP10 process. The first members of the