MP8000CH
Abstract: MP8000C 8361H MP800 CY7C373I-JC JESD22 nitto chip Nitto
Text: Cypress Semiconductor Package Qualification Report QTP# 000102 VERSION 1.0 March, 2000 84 Lead Plastic Leaded Chip Carrier NITTO 8000CH Molding Compound Level 3 Anam-Manila, Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
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8000CH
MP8000CH
37KPHIL-M
CY7C373I-JC
30C/60
MP8000C
8361H
MP800
CY7C373I-JC
JESD22
nitto chip
Nitto
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t7778a
Abstract: LM24014H LM24014 T7778 T7900 74HC138F LF0B08 T7900 LCD LF0B09 LM2401
Text: LM24014H Dot Matrix LCD Unit LCD Data Sheet FEATURES DESCRIPTION • Display Format: 240 x 64 The SHARP LM24014H Dot Matrix LCD Unit is a 240 × 64 full dot graphic display unit which consists of gray type STN, transflective mode, positive type with an LCD controller and a CG-ROM. NITTO transflector P1 type R = 66.4% (TYP , T = 30.4% (TYP).
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LM24014H
LM24014H
LF0B08
LF0B09
254Px9)
t7778a
LM24014
T7778
T7900
74HC138F
LF0B08
T7900 LCD
LF0B09
LM2401
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nitto SWT 10
Abstract: nitto SWT-20 W07 sot 23 w04 transistor sot 23 UE-111AJ W04 sot 23 transistor w07 transistor marking w08 marking W07 transistor marking w04
Text: PRODUCT CODING SYSTEM QSP0005_WEB.028 1 2.4.2007 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document. ESD EWS ID MAS MBB T&R 2 Electrostatic Sensitive Device
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QSP0005
MAS1234AB3
MAS1234AB3xxxxx)
98AA2
MAS9198AA2xxxxx)
nitto SWT 10
nitto SWT-20
W07 sot 23
w04 transistor sot 23
UE-111AJ
W04 sot 23
transistor w07
transistor marking w08
marking W07
transistor marking w04
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UE-111AJ
Abstract: nitto SWT-20 transistor marking PB nitto UE111AJ ke marking transistor 2091J Nitto marking code transistor HK mas1025 UE111
Text: 1 PRODUCT CODING SYSTEM 9.12.2004 QSP0005_WEB.026 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document: ESD EWS ID MBB T&R 2 Electrostatic Sensitive Device
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QSP0005
MAS1025AC
MAS1025ACSAxx)
MAS9124AACAxx)
UE-111AJ
nitto SWT-20
transistor marking PB
nitto UE111AJ
ke marking transistor
2091J
Nitto
marking code transistor HK
mas1025
UE111
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cirocomm gps receiver
Abstract: cirocomm Cirocomm GPS
Text: AP.12B.07.0046A Specification Part No. AP.12B.07.0046A Product Name 12mm Two Stage Active GPS Patch Antenna Feature Ultra Miniature GPS active patch High performance Ultra low power consumption RoHS compliant SPE-11-8-126/B | page 1 of 13 1. Introduction This miniaturised GPS Active Antenna
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SPE-11-8-126/B
cirocomm gps receiver
cirocomm
Cirocomm GPS
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CCL-HL832NX-A
Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
Text: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize
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CO-029)
CCL-HL832NX-A
Nitto GE100LFCS
Sumitomo G750
GE100LFCS
GE-100-LFC
CCL-HL832NX
GE100LFCS nitto
GE-100LFCS
CCL-HL-832
CCL-HL832
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Adwill D-175
Abstract: UE-111AJ lintec adwill UV tape D-175 UV tape D-175 adwill Lintec UV tape Lintec nitto UE111AJ nitto UV tape D175 lintec
Text: AN106920 Handling and processing of sawn wafers on UV dicing tape Rev. 2.0 — 13 January 2009 Application note Document information Info Content Keywords Sawn wafers, UV dicing tape, handling and processing Abstract This application note gives hints and recommendations regarding correct
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AN106920
AN106920lusion
Adwill D-175
UE-111AJ
lintec adwill UV tape D-175
UV tape D-175
adwill
Lintec UV tape
Lintec
nitto UE111AJ
nitto UV tape
D175 lintec
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SMP1302-099
Abstract: No abstract text available
Text: DATA SHEET PIN Diode Chips Supplied on Film Frame Features Designed for high-performance switch and attenuator applications ● Preferred device for module applications ● PIN diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green
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SMP1302-099
SMP1304-099
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Untitled
Abstract: No abstract text available
Text: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high-performance, double-balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green
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SMS392x-099
SMS3926
SMS3927
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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MP7100
Abstract: 82c693 140C CY82C693 CY82C693-NC
Text: Qualification Report September 1996, QTP# 95432, Version 1.0 PentiumTM hyperCacheTM Chipset Peripheral Controller CY82C693, 208-Pin Plastic Quad Flatpack Pentium is a trademark of Intel Corporation hyperCache is a trademark of Cypress Semiconductor Corporation
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CY82C693,
208-Pin
CY82693
208-Pins
CY82C693-NC
MP7100
82c693
140C
CY82C693
CY82C693-NC
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nitto tape
Abstract: No abstract text available
Text: PIN Diode Chips Supplied on Film Frame SMP1320-099, SMP1322-099, SMP1340-099, SMP1353-099 Features • Designed for High Performance Switch Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame
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SMP1320-099,
SMP1322-099,
SMP1340-099,
SMP1353-099
3/02A
nitto tape
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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pin diode SMP
Abstract: SMP1302-099
Text: PIN Diode Chips Supplied on Film Frame Features • Designed for High Performance Switch and Attenuator Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame ■ Low Cost Description The SMP series of PIN diodes are designed for high
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SMP1302-099
12/02A
pin diode SMP
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CY82C691
Abstract: CY82C691-NC 110C 130C 140C 95441
Text: Qualification Report September 1996, QTP# 95431, Version 1.0 PentiumTM hyperCacheTM Chipset System Controller CY82C691, 208-Pin Plastic Quad Flatpack Pentium is a trademark of Intel Corporation hyperCache is a trademark of Cypress Semiconductor Corporation
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CY82C691,
208-Pin
CY82691
208-Pins
CY82C691-NC
CY82C691
CY82C691-NC
110C
130C
140C
95441
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TSS463
Abstract: Nitto MP8000 MARKING Z86 1000 BASE Isolation Modules 5000V EOS ESD S 61.1 hmt design data book MOLDING MATERIAL MP8000 HT Q100 temic gateway EIA-556-A
Text: Qualpack TSS463 / TSS461C TSS463 VAN Van Controller Serial Interface TSS461C VAN Van Controller TSS463/TSS461C VAN Controllers 1999 January TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY Rev. 2 – January 1999 1 Qualpack TS80C31X2/C32X2 1. Contents 1. Contents. 2
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TSS463
TSS461C
TSS461C
TSS463/TSS461C
TS80C31X2/C32X2
Nitto MP8000
MARKING Z86
1000 BASE Isolation Modules 5000V
EOS ESD S 61.1
hmt design data book
MOLDING MATERIAL MP8000
HT Q100
temic gateway
EIA-556-A
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Carrollton Semiconductor
Abstract: No abstract text available
Text: 0 .O P IE K Emitter and Photosensor Chips Optek Technology, Inc. is widely recognized as one of the industry's leading suppliers of high quality gallium arsenide GaAs and gallium aluminum arsenide (GaAIAs) infrared emitter chips and silicon photosensor chips. In hybrid or other applications, where space forbids use
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Untitled
Abstract: No abstract text available
Text: OPTEK Emitter and Photosensor Chips Optek Technology, Inc. Is widely recognized as one of the industry's leading suppliers of high quality gallium arsenide GaAs and gallium aluminum arsenide (GaAIAs) infrared emit ter chips ana silicon photosensor chips. In hybrid or other applications, where space forbids
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underfill
Abstract: with or without underfill intel C4 package underfill for good adhesion and low viscosity Low viscosity underfill for flip chip microwave oven
Text: Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel Corp. Tomomi Kume, Japan Package Technology Development, Intel Corp.
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POWER TRANSFORMER E154515
Abstract: scheme e131175 sampo E159656 foxconn e253117 e131175 XEPEX E140166 sony bando power transformer power transformer e190246 tamradio transformer e199273
Text: 10129 LIST OF COMPANY IDENTIFICATIONS The List of Company Identifications contains the trade names, trademarks, or other designations authorized for use in lieu of these Company names. ‘‘ ’’ — 2CS SRL ’’ — ACT CO LTD ‘‘ ‘‘ ’’ — 3E HK LTD
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Untitled
Abstract: No abstract text available
Text: PIN Diode Chips Supplied on Film Frame Features • Designed for High Performance Switch and Attenuator Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame ■ Low Cost Description The SMP series of PIN diodes are designed for high
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SMP1302-099
SMP1304-099
4/03A
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Untitled
Abstract: No abstract text available
Text: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high performance double balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost 2 ● 1
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SMS392x-099
SMS3926
SMS3927
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TQ32
Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
Text: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*
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Jul-00
Oct-00
Jan-01
Apr-01
Jul-01
Oct-01
10X10,
TQ32
ablestik
amkor
amkor cabga
Nitto
ASE LQFP 208
CABGA 6x6
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Untitled
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS80C310, D2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS80C310,
JESD78,
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