MQFP TRAY 28 Search Results

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm 256 pin QFP 28 × 28 Terminal Spacing Linear = 0.4 A B 192 193 129 128 F Q R D C S detail of lead end 256 1 65 64 G H I M J M P K N L NOTE Each lead centerline is located within 0.09 mm (0.004 inch) of

P120GD-80-LBB

Contextual Info: Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm OT-001T-01 Mounting Pad 120 pin QFP 28 × 28 Terminal Spacing Linear = 0.8 A B 90 61 91 60 F 120 1 R Q S D C detail of lead end 31 30 J G H I M M P K N ITEM NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of

7404

Abstract: jedec do 35 QFP JEDEC tray
Contextual Info: UNIT : mm HEAT PROOF 7 PPE A' 32.8 37.02 74.04 30.93 MQFP 28 x 28 3.2mm 135.9 A 32.8 37.02 27.93 259.14 315 322.6 SECTION A-A' 32.8 Applied Package 120-pin Plastic QFP 3.2mm thick 208-pin Plastic QFP (Fine Pitch) (3.2mm thick) Quantity (pcs) MAX. 24 Tray

QFP JEDEC tray

Abstract: JEDEC TRAY QFP JEDEC TRAY DIMENSIONS JEDEC tray standard nec 44-pin qfp
Contextual Info: TRAY CONTAINER UNIT : mm 6x16=96 99.3 18.70 14.30 135°C MAX. 19.86 A' MQFP 10×10×2.7 18.30 14.30 280.5 17.25 315.0 322.6 SECTION A-A' 14.30 Applied Package 44-pin Plastic QFP (2.7mm thick) 56-pin Plastic QFP (2.7mm thick) 4.72 (6.35) 9.53 7.62 135.9

QFP JEDEC tray

Abstract: 7404 JEDEC TRAY QFP 32 jedec tray
Contextual Info: HEAT PROOF 7 150°C MAX 30.93 A 3x8 = 24 37.02 PPE 74.04 MQFP28×28×3.2 135.9 UNIT : mm A' 35.2 37.02 27.93 35.2 259.14 315.0 322.6 SECTION A – A' 35.2 (6.35) 7.62 27.37 3.77 Applied Package Quantity (pcs) Tray MQFP 28 × 28 × 3.2 120-pin plastic QFP (3.2mm thick)

MQFP 28x28

Contextual Info: MHiâi a n r u g NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED FOR 48 HOURS AT THE BAKE TEMPERATURE AS SPECIFIED. 2. TOTAL USABLE CELL COUNT IS 24. 3. TRAY VACUUN PICKUP METHOD REQUIRES A 28 MM SQUARE MINIMUM WALLED PICKUP AREA, LOCATED AS

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

MO-112

Abstract: MS-029 MATRIX TRAY MS-022 LD240
Contextual Info: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced

TQFP Shipping Trays

Abstract: MQFP Shipping Trays PB1083 Lattice PLSI
Contextual Info: Product Bulletin November, 1997 #PB1083 Lattice OEM Customer Ordering Guidelines For Standard Products Introduction Lattice has instituted new OEM ordering guidelines aimed at providing further enhancements to the quality of our products and services. These new guidelines will

MO-112

Abstract: MS-022 MS-029 DS250G JEDEC standard 033
Contextual Info: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date,

outline of the heat slug for JEDEC

Abstract: heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor
Contextual Info: LEADFRAME data sheet MQFP PowerQuad 4 Features: MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit

LD 337

Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
Contextual Info: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material

7404

Abstract: MQFP Tray 28 QFP JEDEC tray 32MM
Contextual Info: UNIT : mm HEAT PROOF 7 PPE A' 32.8 37.02 74.04 30.93 MQFP 28 x 28 3.2mm 135.9 A 32.8 37.02 27.93 259.14 315.0 322.6 SECTION A-A' 32.8 3.82 6.35 7.62 27.3 Applied Package 208-pin Plastic QFP (Fine Pitch) (3.2mm thick) 256-pin Plastic QFP (Fine Pitch) (3.2mm thick)

MS-029

Abstract: 144 QFP body size amkor
Contextual Info: LEADFRAME data sheet MQFP PowerQuad 4 Features MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

MD300-10A

Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Contextual Info: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case

iso 1043-1

Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container

tray 20 x 14

Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Contextual Info: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type

MC9S12Dx256

Abstract: tray qfp 14x14 1.4 tray qfp 14x14 PEAK TRAY qfp 14x14 MC9S12A256CFUE 1K79X peak mqfp 14x14 EAR99 HCS12 HCS12 1k79x
Contextual Info: Page 1 of 4 MC9S12A256BCFU Information General information Package information Environmental and Compliance information Replacement Parts Information Manufacturing and Qualification information Ordering information Product/Process Change Notice PCN Operating Characteristics

MS-026

Abstract: JEDEC Matrix Tray outlines CS-007 MS-026 lqfp 80 MS026 tray 20 x 14 LQFPPOWERQUAD4 MS-026 lqfp 128
Contextual Info: LEADFRAME data sheet LQFP PowerQuad 4 Features: LQFP PowerQuad® 4 Packages: LQFP PowerQuad® 4 PQ4 is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is

JESD51-7

Abstract: 100L JESD51-2 STATS ChipPAC Techpoint
Contextual Info: MQFP Metric Quad Flat Pack • 10 x 10mm to 32 x 32mm body sizes • 44 to 240 lead counts • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 10 x 10mm to 32 x 32mm STATS ChipPAC’s Metric Quad Flat Pack MQFP is a leadframe based, plastic encapsulated package with gull

TQFP Shipping Trays

Abstract: LATTICE plsi 3000 PB1084 lattice semiconductor tape and reel
Contextual Info: Product Bulletin June, 1998 Updated #PB1084 Lattice Pre-Patterned and Tape and Reel Ordering Guidelines Introduction After reviewing customer ordering patterns and costs associated with providing prepatterned and/or tape and reel PLDs, Lattice has modified its minimum ordering quantity

iso 1043-1

Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container

MIL-STD-81705

Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
Contextual Info: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes