MQFP 28X28 Search Results

ipc-SM-782

Abstract: 14x14-64 MQFP 14X14 AN49 fairchild 245
Contextual Info: www.fairchildsemi.com Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to

ipc-SM-782

Abstract: 128 QFP 14x20 footprint jedec mo-108 RAYTHEON Raytheon Electronics MQFP 80 PACKAGE qfp 64 land pattern qfp land pattern QFP-10X10-44 Raytheon Company
Contextual Info: Electronics Semiconductor Division Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to

Contextual Info: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm 256 pin QFP 28 × 28 Terminal Spacing Linear = 0.4 A B 192 193 129 128 F Q R D C S detail of lead end 256 1 65 64 G H I M J M P K N L NOTE Each lead centerline is located within 0.09 mm (0.004 inch) of

P120GD-80-LBB

Contextual Info: Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm OT-001T-01 Mounting Pad 120 pin QFP 28 × 28 Terminal Spacing Linear = 0.8 A B 90 61 91 60 F 120 1 R Q S D C detail of lead end 31 30 J G H I M M P K N ITEM NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of

IPC-7351

Abstract: ipc7351 LQFP_EP IPC 7351 ADSP-21369 land pattern for MQFP MQFP 28x28 ADSP-21371 ADSP21369 EE-notes ee-notes for ADSP-21369
Contextual Info: Engineer-to-Engineer Note a EE-313 Technical notes on using Analog Devices DSPs, processors and development tools Visit our Web resources http://www.analog.com/ee-notes and http://www.analog.com/processors or e-mail processor.support@analog.com or processor.tools.support@analog.com for technical support.

microprocessors architecture of 8251

Abstract: microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251 DS4812 CLA200
Contextual Info: CLA200 Series CMOS Gate Arrays Advance Information DS4812 - 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

8251 uart vhdl

Abstract: microprocessors interface 8086 to 8251 microprocessors architecture of 8251 DS4812 8048 8251 8086 microprocessor kit manual
Contextual Info: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

zarlink clt

Abstract: 8251 uart vhdl microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Zarlink CLA200 CLA200 Series UART 8251 DS4812 zarlink asic
Contextual Info: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

Contextual Info: CLA200 Series M IT E L CMOS Gate Arrays Advance Information SEMICONDUCTOR DS4812 -1 .3 July 1997 IN TR O D U C TIO N The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

MQFP 28x28

Contextual Info: MHiâi a n r u g NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED FOR 48 HOURS AT THE BAKE TEMPERATURE AS SPECIFIED. 2. TOTAL USABLE CELL COUNT IS 24. 3. TRAY VACUUN PICKUP METHOD REQUIRES A 28 MM SQUARE MINIMUM WALLED PICKUP AREA, LOCATED AS

Arm processor vlsi technology

Abstract: PC302 QFP 128 bonding
Contextual Info: VLSI T e ch n o lo g y o.5-m ic r o n in c. _ PRELIMINARY ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.5-micron 0.45-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec

FPQ 208 0.5 10

Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
Contextual Info: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch

EIA 481 QFN pin 1

Abstract: smd transistor 5c sot-23 TB347 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1
Contextual Info: Tape and Reel Specification for Integrated Circuits Technical Brief January 5, 2007 TB347.10 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

Contextual Info: Technical Brief 347 Tape and Reel Specification for Integrated Circuits Introduction Many Surface Mounted Devices SMDs are being packaged for shipment in embossed tape and wound onto reels. The Intersil tape and reel specifications are in compliance with

Contextual Info: HARRIS H S E M I C O N D U C T O R S P 4 5 1 1 6 A Numerically Controlled Oscillator/Modulator December 1996 Features Description • NCO and CMAC on One Chip The Harris HSP45116A combines a high performance quadrature numerically controlled oscillator NCO and a

ps2 keyboard interface in arm7

Abstract: ARM720T 16C550 AX07PT7202 AMBA APB UART CABGA 8X8
Contextual Info: Mixed-Signal Products AX07PT7202 Product Summary ARM720T Microcontroller with Embedded Peripherals Preliminary Data Sheet December 1, 2003 www.aeroflex.com/ARM7 FEATURES ‰ Debug interface and boundary scan ‰ 32-bit ARM720T core with cache and MMU ‰ 3.3V supply voltage

BGA 11x11 junction to board thermal resistance

Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20
Contextual Info: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature

VSSO10

Abstract: VSSO11 PM5361 PM5371 TA-NWT-000253 TU12 sot-5 theta jc value VSSO12
Contextual Info: PM5371 TUDX DATA SHEET PMC-920525 ISSUE 6 SONET/SDH TRIBUTARY UNIT CROSS CONNECT PM5371 TUDX SONET/SDH TRIBUTARY UNIT CROSS CONNECT DATA SHEET ISSUE 6: SEPTEMBER 1998 PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE PM5371 TUDX

PC5004

Abstract: VGC650 VGC6P52 VGC600 IN01D1 NR02D1 QFP 128 bonding
Contextual Info: V L S I T ech n o lo gy, inc. O.6-MICRON _ ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.6-micron 0.55-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec - 5 V (4.5 to 5.5 V): 190 ps, 2.6 nW/MHz

Contextual Info: DATA SHEET PM PMC-920525 ISSUE 6 PMC-Sierra, Inc. PM5371 tudx SONET/SDH TRIBUTARY UNIT CROSS CONNECT PM5371 TUDX SONET/SDH TRIBUTARY UNIT CROSS CONNECT DATA SHEET ISSUE 6: SEPTEMBER 1998 PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE

Contextual Info: SEPTEMBER 1993 DS3820 - 2.0 CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION ARRAY SIZES The new CLA80k gate array series from GEC Plessey Semiconductors offers advantages in speed and density over previous array series. The unique architecture allows

MUX2T01

Abstract: MUX4T01
Contextual Info: •JUL J Ü 9 S3- GEC PLES S EY J U N E 1993 S E M I C O N D U C T O R S DS3820 - 1.0 CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION ARRAY SIZES The new CLA80k gate array series from GEC Plessey Semiconductors offers advantages in speed and density

DS3820

Contextual Info: S i GEC PLESS EY SEPTEMBER 1993 S E M I C O N D U C T O R S DS3820 - 2.0 CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS IN T R O D U C T IO N ARRAY SIZES The new CLA80k gate array series from GEC Plessey Semiconductors offers advantages in speed and density