MIF3225F25R0 Search Results

Contextual Info: LC Modules MULTILAYER CHIP IFTS, MIA AND MIF SERIES FEATURES • Closed magnetic circuit configuration eliminates cross coupling. Suitable for high density applications. • Monolithic inorganic material construction for high reliability. PC BOARD PATTERNS

tdk marking code

Abstract: TDK EL
Contextual Info: Multilayer Chip IFTs MIA and MIF Series FEATURES PRODUCT IDENTIFICATIONS MIA 3225 AR455 O □ □ □ • Shielded construction to minimize crosstalk in density mounting applications. • Adjustment free IFTs are well suited for high volume automated assembly.

10.7MHz, shielded IF transformer

Contextual Info: Multilayer Chip IFTs MIA and MIF Series TDK has produced the world’s smallest Chip IFT. This adjustment free monolithic circuit is packaged in 3225 3.2L x 2.5W mm [.126 x .098 inches] size. The internal capacitor and transformer are multilayered and cofired resulting in high reliability parts.