LFBGA56 Search Results

LFBGA56 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
LFBGA56		NXP Semiconductors	Footprint for reflow soldering		Original	PDF

LFBGA56 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
sot516 Abstract: No abstract text available Text: PDF: 1999 Jun 07 Philips Semiconductors Package outline LFBGA56: plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm SOT516-1 D ball A1 index area A2 A E A1 detail X A b ∅w M y v A ZD e ZE K J H G e F E D C B A 1 2 3 4	Original	LFBGA56: OT516-1 sot516	PDF
SOT516 Abstract: LFBGA56 Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA56: plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm D SOT516-1 A B ball A1 index area A2 A E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E	Original	LFBGA56: OT516-1 SOT516 LFBGA56	PDF
565FHE Abstract: No abstract text available Text: RENESAS Code PLBG0565KA-A w S B JEITA Package Code P-LFBGA565-15x15-0.50 D Previous Code 565FHE w S A MASS[Typ.] 0.6g φb A A1 φx M S AB ZD e e A ×4 y S v Index mark Laser mark S B ZE E AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Reference	Original	PLBG0565KA-A P-LFBGA565-15x15-0 565FHE 565FHE	PDF
Untitled Abstract: No abstract text available Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10	Original	MBL179 BGA156 OT472-1 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA316	PDF
SST39WF160x Abstract: AM29F SST25VF016B tsop i 12mmx20mm 48-WFBGA SST38VF640x TSOP 28 SPI memory Package flash FLASH CROSS sst39vf040 WFBGA-48 48TSOP Text: Silicon Storage Technology, Inc. NOR Flash Cross Reference Guide 1.8V, 3V, 5V www.SST.com Comparison Guide Spansion Company Density Spansion SST SST AM29F SST39SF S29AL S29GL SST39VF SST38VF S29AS SST39WF 1 ~ 32 Mb 2 ~ 16 Mb 1 ~ 4 Mb 4 ~ 32 Mb 16 Mb ~ 1Gb	Original	AM29F SST39SF S29AL S29GL SST39VF SST38VF S29AS SST39WF SST39WF160x AM29F SST25VF016B tsop i 12mmx20mm 48-WFBGA SST38VF640x TSOP 28 SPI memory Package flash FLASH CROSS sst39vf040 WFBGA-48 48TSOP	PDF
PZ3064AS10BP Abstract: PZ3064DS10 PZ3064DS10BC Text: INTEGRATED CIRCUITS PZ3064A/PZ3064D 64 macrocell CPLD with enhanced clocking Product specification Supersedes data of 1999 May 07 IC27 Data Handbook Philips Semiconductors 1999 Jun 16 Philips Semiconductors Product specification 64 macrocell CPLD with enhanced clocking	Original	PZ3064A/PZ3064D PZ3064A/PZ3064D 44-pin 56-ball 100-pin PZ3064AS10BP PZ3064DS10 PZ3064DS10BC	PDF
handbook philips ic26 packaging Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50 Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3	Original	AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50	PDF
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package	PDF
PQFP100 Abstract: PQFP160 XILINX LQFP128 PZ5064CS10 PACKAGE LQFP128 PZ3064AS10 TQFP100 tQFP100 package TQFP44 package PLCC44 package Text: Exh C - Att: 1 December 1999 LIST OF PHILIPS CPLD COOLRUNNER PARTS SOLD AND TRANSFERRED TO XILINX INC. 12NC 935239090557 935239090551 935262246551 935262246518 935262221557 935262221551 935260106112 935260109112 935260112112 935260107112 935260110112 935260113112	Original	93QFP100 PLCC84 PQFP100 PQFP160 LQFP128 TQFP100 PQFP100 PQFP160 XILINX LQFP128 PZ5064CS10 PACKAGE LQFP128 PZ3064AS10 TQFP100 tQFP100 package TQFP44 package PLCC44 package	PDF
plcc32 pinout Abstract: BIOS 32 Pin PLCC TSOP 28 SPI memory Package flash 89C58 64Kx8 CMOS RAM sst BIOS 8 Pin PLCC tsop32 static ram 64kx8 SST49LF040A MCU 64KX16 Text: Application Specific Memory Products Serial Flash—45 Series ComboMemory Family—31, 32 & 34 Series The Serial Flash family of products is a low-power application specific memory that implements Read and Program/Erase operations through the Serial Peripheral Interface SPI bus compatible serial protocol.	Original	Flash--45 Family--31, 32-Pin SST58SD008 SST58SD016 SST58SD024 SST58SD032 SST58SD048 SST58SD064 SST58LD008 plcc32 pinout BIOS 32 Pin PLCC TSOP 28 SPI memory Package flash 89C58 64Kx8 CMOS RAM sst BIOS 8 Pin PLCC tsop32 static ram 64kx8 SST49LF040A MCU 64KX16	PDF
Untitled Abstract: No abstract text available Text: Philips Sem iconductors Product specification 64 macrocell CPLD with enhanced clocking FEATURES Table 1. PZ3064A/PZ3064D Features • Industry’s first TotalCMOS PLD - both CM OS design and process technologies PZ3064A/PZ3064D Usable gates • Fast Zero Power FZP™ design technique provides ultra-low	OCR Scan	PZ3064A/PZ3064D PZ3064A/PZ3064D 44-pin 56-ball 100-pin	PDF