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    LEADLESS PACKAGE Search Results

    LEADLESS PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    EVM-LEADLESS1 Texas Instruments Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages Visit Texas Instruments Buy
    TLC32044MFK/B Rochester Electronics LLC Rochester Manufactured TLC32044, VB Interface, 28 LCC Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    26LS32/B2A Rochester Electronics LLC Rochester Manufactured 26LS32, Line Driver, 20 LCC Package, SMD spec. Visit Rochester Electronics LLC Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    LEADLESS PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		PDF MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet

    leadless chip carrier

    Abstract: MIL-STD-1835 L55 PACKAGE DIAGRAM L51 transistor diagram L64 PACKAGE DIAGRAM 20 PIN LEADLESS CHIP CARRIER
    Text: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13


    Original     		PDF 32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A leadless chip carrier L55 PACKAGE DIAGRAM L51 transistor diagram L64 PACKAGE DIAGRAM 20 PIN LEADLESS CHIP CARRIER

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


    Original     		PDF IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern

    clcc 44

    Abstract: MATRA MHS
    Text: Packages Leadless Chip Carrier LCC package outlines 22 Leads .050 center leadless rectangular chip carrier Code : 4H Date : 25–04–96 28 Leads .050 center leadless rectangular chip carrier Code : 4P MATRA MHS Date : 29–02–96 1 Packages 32 Leads .040 center leadless square chip carrier


    Original     		PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: MIL-STD-1835 leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79
    Text: Package Diagram Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 1 Package Diagram 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 2 Package Diagram 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13 3 Package Diagram


    Original     		PDF 32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A CERAMIC LEADLESS CHIP CARRIER leadless chip carrier 20 PIN LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER 68 MIL-STD square L64 PACKAGE DIAGRAM 7c79

    44 Lead Ceramic Leadless Chip Carrier

    Abstract: leadless chip carrier MIL-STD-1835
    Text: Package Diagrams Ceramic Leadless Chip Carriers 32-Lead Leadless Chip Carrier L45 51-80047 1 Package Diagrams 18-Pin Rectangular Leadless Chip Carrier L50 MIL-STD-1835 C-10 A 51-80063 2 Package Diagrams 20-Pin Rectangular Leadless Chip Carrier L51 MIL-STD-1835 C-13


    Original     		PDF 32-Lead 18-Pin MIL-STD-1835 20-Pin 22-Pin 24-Pin 28-Pin MIL-STD-1835 C-11A 44 Lead Ceramic Leadless Chip Carrier leadless chip carrier

    NTLMS4506N

    Abstract: MOSfet 4392
    Text: NTLMS4506N Advance Information Power MOSFET 30 A, 30 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic


    Original     		PDF NTLMS4506N r14525 NTLMS4506N/D NTLMS4506N MOSfet 4392

    4392 mosfet

    Abstract: No abstract text available
    Text: NTLMS4501N Advance Information Power MOSFET 17 A, 30 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic


    Original     		PDF NTLMS4501N r14525 NTLMS4501N/D 4392 mosfet

    NTLMS4502N

    Abstract: No abstract text available
    Text: NTLMS4502N Advance Information Power MOSFET 17 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic


    Original     		PDF NTLMS4502N r14525 NTLMS4502N/D NTLMS4502N

    ntlms4504n

    Abstract: No abstract text available
    Text: NTLMS4504N Advance Information Power MOSFET 28 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic


    Original     		PDF NTLMS4504N r14525 NTLMS4504N/D ntlms4504n

    NTLMS4403N

    Abstract: MOSfet 4392
    Text: NTLMS4403N Advance Information Power MOSFET 22 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic


    Original     		PDF NTLMS4403N r14525 NTLMS4403N/D NTLMS4403N MOSfet 4392

    NTLMS4505N

    Abstract: 4392 MOSFET
    Text: NTLMS4505N Advance Information Power MOSFET 31 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic


    Original     		PDF NTLMS4505N r14525 NTLMS4505N/D NTLMS4505N 4392 MOSFET

    Untitled

    Abstract: No abstract text available
    Text: Vishay Electro-Films Thin Film Packaged Product Networks STYLE SURFACE MOUNT LEADLESS PACKAGED PRODUCTS LEADLESS CHIP CARRIER PERFORMANCE SINGLE LAYER MODEL SLR.131 PACKAGED PRODUCTS NETWORKS Performance Key www.vishay.com 130 TCR ± 10 ppm/°C


    Original     		PDF 09-Mar-07

    vco using varactor diode for carrier generation

    Abstract: voltage variable capacitor "Voltage Controlled Oscillators" Voltage Controlled Oscillators MAVCML0034 MAVCML0043 MAVCML0044 power varactor
    Text: Leadless Packaged Voltage Controlled Oscillators MAVCMLSeries V1 Features • • • • • • • Extremely Linear Tuning High Tuning Speed Low Phase Noise Leadless Package Hermetically Sealed Suitable for High Reliability Applications Custom Designs Available


    Original     		PDF MAVCML0043 vco using varactor diode for carrier generation voltage variable capacitor "Voltage Controlled Oscillators" Voltage Controlled Oscillators MAVCML0034 MAVCML0044 power varactor

    LFB01

    Abstract: LFB01L
    Text: Ordering number:EN1885C LFB01, 01L Silicon Planar Leadless Type Ultrahigh-Speed Switching Diode Features Package Dimensions • Highly reliable leadless glass sleeve structure. · Very small size. · Capable of being suface-mounted. · Forward voltage : VF max=1.2V.


    Original     		PDF EN1885C LFB01, LFB01L LFB01 LFB01 LFB01L

    r 2501 kk 135

    Abstract: 0922E atf-*m4 r 2501 kk 346 r 2501 kk 250 r 2501 kk 106 r 2501 kk 341
    Text: ATF-541M4 Low Noise Enhancement Mode ­Pseudomorphic HEMT in a ­Miniature Leadless Package Data Sheet Description Features Avago Technologies’ ­ ATF­‑541M4 is a high linearity, low noise, single supply E‑PHEMT housed in a miniature leadless package.


    Original     		PDF ATF-541M4 ATF541M4 ATF-541M4 Featur00 AV01-0621EN AV01-0922EN r 2501 kk 135 0922E atf-*m4 r 2501 kk 346 r 2501 kk 250 r 2501 kk 106 r 2501 kk 341

    Untitled

    Abstract: No abstract text available
    Text: NTLTS3107P Power MOSFET -20 V, -8.3 A, Single P-Channel, Micro8 Leadless Package Features •ăLow RDS on for Extended Battery Life •ăSurface Mount Micro8 Leadless for Improved Thermal Performance •ăLow Profile (<1.0 mm) Optimal for Portable Designs


    Original     		PDF NTLTS3107P NTLTS3107P/D

    C1316C

    Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
    Text: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface


    Original     		PDF IPC-SM-782. SC-70 10/02A C1316C LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10

    tssop 16 exposed pad stencil

    Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 tssop 16 exposed pad stencil C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern

    Untitled

    Abstract: No abstract text available
    Text: Leadless Inductors: NL Series CAL-CHIP LEADLESS INDUCTORS NL322522, NL453232, series for signal circuit applications These revolutionary, high reliability winding type leadless wound chip inductors for autom atic mounting have been developed in response to the trend toward


    OCR Scan     		PDF NL322522, NL453232, NL322522T10 14CPF] NL322522 NL453232 300mm 449to

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY M IC R O N I 4 MEG X SfcMCONOUCTORMC MT12D436 36, 8 MEG x 18 DRAM MODULE 4 MEG X 36, 8 MEG x 18 DRAM MODULE FAST PAGE MODE FEATURES OPTIONS MARKING • Tim ing 60ns access 70ns access • Packages Leadless 7 2 -pin Leadless 7 2 -pin Leadless 7 2 -pin


    OCR Scan     		PDF MT12D436 T12D436 bill54 A0-A10 MT120436 C1994,

    C22PH

    Abstract: NL453232 NL453232-1R5K NL322522T-221K
    Text: CAL-CHIP ELECTRONICS IN 54E • ^ 0 0 0 0 5 5 OODQOlt, TDb CAL-CHIP LEADLESS INDUCTORS CAL-CHIP LEADLESS INDUCTORS NL322522, NL453232, series for signal circuit applications These revolutionary, high reliability winding type leadless wound chip inductors for automatic mounting


    OCR Scan     		PDF NL322522, NL453232, 14CPF] NL322522 NL453232 C22PH NL453232-1R5K NL322522T-221K

    NL322522T-1R0K

    Abstract: NL453232-331K NL322522T-220K NL453232-330K NL453232-1R5K NL453232-8R2K NL453232-102K NL322522T-5R6K NL453232 NL453232-560K
    Text: CAL-CHIP ELECTRONICS IN 54E • ^ 0 0 0 0 5 5 OODQOlt, TDb CAL-CHIP LEADLESS INDUCTORS CAL-CHIP LEADLESS INDUCTORS NL322522, NL453232, series for signal circuit applications These revolutionary, high reliability winding type leadless wound chip inductors for automatic mounting


    OCR Scan     		PDF NL322522, NL453232, NL453232 6092A NL322522T-1R0K NL453232-331K NL322522T-220K NL453232-330K NL453232-1R5K NL453232-8R2K NL453232-102K NL322522T-5R6K NL453232-560K

    MLL34

    Abstract: MLL5243B mll5232bt1 1N5221 MLL41 MLL5221B MLL5222B MLL5223B MLL5224B MLL-34
    Text: Leadless Zener Diodes Leadless Diodes — MLL34 8mm tape and MLL41 (12mm tape) • S m all, convenient leadless package. A full range of i watt and 1 w att z e n e r diodes a re av ailab le using the sam e die as products presently offered in DO-35 (1N5221 S eries) and DO-41 (N4728 S eries) zeners.


    OCR Scan     		PDF MLL34 MLL41 DO-35 1N5221 DO-41 N4728 DO-35 DO-41 MLL5268B, MLL34 MLL5243B mll5232bt1 MLL41 MLL5221B MLL5222B MLL5223B MLL5224B MLL-34