Solder Paste, Indium 5.8
Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
Text: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land
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AN10343
Solder Paste, Indium 5.8
SOT996-2
VSSOP8
MICROPAK XX
SOT103
WLCSP stencil design
J-STD-020D
SOT996
sot1049
XQFN10U
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PDF
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SAC387
Abstract: IPC-7525 pcb warpage in ipc standard land pattern for WLCSP "x-ray machine" ROSIN FLUX TYPE ROL0 WLCSP stencil design FDZ191P sac105 IPC-9075
Text: www.fairchildsemi.com AN-6084 Surface Mount Assembly Guideline for WLCSP 1.0x1.5 Introduction The Wafer-Level Chip-Scale Package WLCSP is one of the smallest discrete MOSFET devices available in the market. Fairchild’s offering comes in two ultra-low profile
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Original
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AN-6084
SAC387
IPC-7525
pcb warpage in ipc standard
land pattern for WLCSP
"x-ray machine"
ROSIN FLUX TYPE ROL0
WLCSP stencil design
FDZ191P
sac105
IPC-9075
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PDF
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RF6280
Abstract: RD6280
Text: RF6280 Preliminary POWER MANAGEMENT IC Package Style: 15-Bump WLCSP, 4 x 4 Array, 2 mm x 2 mm Features Peak Efficiency Up To 96% High Efficiency Over Various Loads Transient Response < 10 s 650 mA Current Capability
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RF6280
15-Bump
RF6280
DS090304
RD6280
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PDF
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Untitled
Abstract: No abstract text available
Text: RF6280 Preliminary POWER MANAGEMENT IC Package Style: 15-Bump WLCSP, 4 x 4 Array, 2 mm x 2 mm Features ̈ ̈ ̈ ̈ ̈ ̈ ̈ ̈ ̈ ̈ ̈ ̈ ̈ Peak Efficiency Up To 96% High Efficiency Over Various Loads Transient Response < 10 s 650 mA Current Capability
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RF6280
15-Bump
RF6280
DS090304
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PDF
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IPC-6011
Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications
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1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6011
IPC-D-279
IPC-6013
ipc 7094
IPC-6012
IPC-2223
IPC 6012
IPC-6016
IPC-2221
IPC-2222
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PDF
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IPC-6012
Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel
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Original
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1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6012
IPC-D-279
IPC-6013
IPC-6016
IPC-2223
ipc 7094
IPC-7094
IPC-2226
IPC-6011
IPC-7525
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PDF
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Nihon handa rx303-92skho
Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
Text: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale
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VMMK-1225
VMMK-125
AV02-1078EN
Nihon handa rx303-92skho
RX303-92SKHO
0402 land pattern
INCOMING INSPECTION solder paste
recommended land pattern for 0402 cap
WLCSP stencil design
land pattern for WLCSP
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W4x4.16C WLCSP 0.5mm PITCH WAFER LEVEL CHIP SCALE PACKAGE Rev 1, 05/14 1.500 X Y 2.160 ±0.030 0.500 D C 16x 0.320 ±0.030 2.160 ±0.030 B A 0.330 (4X) 1 PIN 1 (A1 CORNER) 0.10 2 4 3 0.330
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5M-1994,
SPP-010.
TB451
TB451.
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PDF
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SPP-010
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W2x2.4 4 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP 0.4mm PITCH Rev 3, 5/15 X 0.975 ±0.020 Y 0.400 B 1.155 ±0.020 4x 0.265±0.035 (4x) 0.10 PIN 1 (A1 CORNER) 0.3775 A 1 2 0.2875 TOP VIEW BOTTOM VIEW
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SPP-010.
com/data/tb/tb451
SPP-010
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W5x5.25 5X5 ARRAY 25 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP Rev 1, 2/13 2.000 2.600 ±0.030 X 25X 0.320 ± 0.030 Y E D 2.600 ±0.030 C B 0.500 A 0.10 (4X) 0.300 1 PIN 1 (A1 CORNER) 2 3 4
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040mm
5M-1994,
SPP-010.
TB451
com/data/tb/tb451
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W4x6.24 4X6 ARRAY 24 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP Rev 1, 9/10 1.60± 0.02 24X 0.270 ± 0.03 1.20 PIN A1 F E D 2.40± 0.02 2.00 C B 0.40 A 1 TOP VIEW 2 3 4 BOTTOM VIEW 0.305 ± 0.025
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5M-1994,
SPP-010.
TB451
com/data/tb/tb451
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W11x11.121 121 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP 0.5mm Pitch Rev 2, 9/13 5.455±0.030 5.000 X 0.500 Y 121x 0.320±0.030 L K J H G 5.535±0.030 5.000 F E D C B A (4x) 0.10 1 PIN 1 2
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W11x11
SPP-010.
TB451
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W8x8.64A 8x8 Array 64 Balls Wafer Level Chip Scale Package WLCSP 0.5mm Pitch (BSC) Rev 0, 7/14 X 4.025 ± 0.030 Y 0.500 64x 0.320 ± 0.030 H G F 4.025 ± 0.030 E D C B 0.263 A (4X) 0.10 1 2
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ASMEY14
com/data/tb/tb451
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W5x5.25B 5X5 ARRAY 25 BALL WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE WLCSP Rev 2, 12/11 X Y 1.60 2.11±0.03 25x 0.225±0.03 E D 0.40 2.13±0.03 1.60 C B 0.265 A 0.10 PIN 1 (A1 CORNER)
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5M-1994,
SPP-010.
TB451
com/data/tb/tb451
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PDF
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|
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W11x11.121B 121 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP 0.5mm pitch Rev 0, 2/14 5.526±0.030 X 0.500 Y 121x 0.320±0.030 L K J H G 5.540±0.030 F E D C B 0.270 A (4X) 1 0.10 2 3 4 5 6 7 8
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W11x11
SPP-010.
TB451.
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W11x11.121A 121 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP 0.5mm pitch (BSC) Rev 1, 2/14 5.526±0.030 X 0.500 Y 121x 0.320±0.030 L K J H G 5.540±0.030 F E D C B 0.270 A (4X) 1 0.10 2 3 4 5
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W11x11
SPP-010.
TB451.
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PDF
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land pattern for WLCSP
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W4x5.20 4x5 Array 20 Ball Wafer Level Chip Scale Package WLCSP Rev 1 8/09 2.545 ± 0.02 X 2.00 20X 0.32 ± 0.03 Y 4 0.25 3 1.50 2.045 ± 0.02 2 1 0.50 0.10 PIN 1 (A1 CORNER) TOP VIEW E D C
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5m-1994,
SPP-10.
com/data/tb/TB451
land pattern for WLCSP
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W4x5.20K 20 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP Rev 0, 8/14 1.200 X Y 1.82±0.030 0.400 E 20x 0.265±0.035 2.15±0.030 D C 1.600 B 0.275 A (4X) 0.10 1 2 4 3 0.310 TOP VIEW 0.200 PIN 1
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sph20x
SPP-010.
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W4x4.16G 16 BALL WLCSP WITH 0.4mm PITCH 4x4 ARRAY 1.740mm x 1.740mm Rev 0, 4/14 X 0.400 1.740±0.030 Y D 1.740±0.030 16x 0.265±0.035 C B A (4X) 0.270 0.10 1 0.200 2 3 4 0.270 PIN 1 (A1 CORNER)
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740mm
740mm)
ASMEY14
SPP-010.
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W5x7.28 28 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP Rev 0, 7/12 1.600 X 2.185±0.02 Y 0.800 G G F F E E 0.400 2.92±0.02 (2X) 0.10 5 4 3 2 28X 0.260±0.03 D D C C B B A A 1.600 2.400 1 1 2
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SPP-010.
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W4x5.20B 20 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP Rev 2, 9/12 1.200 X 1.82±0.03 PIN 1 (A1 CORNER) Y 0.400 A 0.400 B 20x 0.265 ± 0.03 C 2.15±0.03 1.600 D E (2X) 0.10 4 3 2 1 0.200 TOP VIEW
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SPP-010.
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land pattern for WLCSP
Abstract: JESD 95-1, SPP-010 asme jesd SPP-010 W5x5
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W5x5.25 5X5 ARRAY 25 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP Rev 0, 1/11 2.00 2.60 ±0.05 X 25X 0.32 ± 0.03 Y E D 2.60 ±0.05 2.00 C B 0.50 A d 0.10 (4X) 1 PIN 1 (A1 CORNER) 2 3 4 5 0.50
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5M-1994,
SPP-010.
025mm
NS/11
TB451
com/data/tb/tb451
land pattern for WLCSP
JESD 95-1, SPP-010
asme
jesd
SPP-010
W5x5
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W5x6.30A 5X6 ARRAY 30 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP BSC Rev 0, 6/13 1.600 X Y 2.330±0.030 0.400 F E 30x 0.265±0.035 D 2.000 2.610±0.030 C B A 0.305 (4X) 0.10 1 2 3 4 5 0.400
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SPP-010.
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing W4x5.20M 20 BALL WAFER LEVEL CHIP SCALE PACKAGE WLCSP 0.4mm PITCH Rev 0, 01/15 X Y 0.400 1.74 ±0.030 20x 0.265 ±0.035 E D C 2.15 ±0.030 B A (4X) 0.10 PIN 1 (A1 CORNER) TOP VIEW 0.275 1 2
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SPP-010.
TB451.
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PDF
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