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    LAND PATTERN FOR TSSOP Search Results

    LAND PATTERN FOR TSSOP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    LAND PATTERN FOR TSSOP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SOD-323 land pattern

    Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
    Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern

    tssop 16 exposed pad stencil

    Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 tssop 16 exposed pad stencil C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


    Original     		PDF IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern

    1206 land pattern

    Abstract: NOMCA MPMA HTRN
    Text: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin


    Original     		PDF IPC-SM-782 M/D55342 12-Jun-15 1206 land pattern NOMCA MPMA HTRN

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP10 package SOT552-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF TSSOP10 OT552-1 OT552-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP24 package SOT355-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF TSSOP24 OT355-1 OT355-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP38 package SOT510-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF TSSOP38 OT510-1 OT510-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT505-2 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF OT505-2 OT505-2

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP8 package SOT530-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF OT530-1 OT530-1

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of TSSOP14 package SOT402-1 Hx Gx P2 0.125 (0.125) Hy By Gy Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area


    Original     		PDF TSSOP14 OT402-1 sot402-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP80 package SOT647-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF TSSOP80 OT647-1 OT647-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TSSOP16 package SOT403-1 Hx Gx P2 0.125 Hy Gy (0.125) By Ay C D2 (4x) D1 P1 Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		PDF TSSOP16 OT403-1 OT403-1

    AA112A

    Abstract: IPC-7351A
    Text: PACKAGE OUTLINE DIMENSIONS AP02002 SUGGESTED PAD LAYOUT(AP02001) (Based on IPC-7351A) Table of Contents X4-DFN0402‐2/SWP . 10


    Original     		PDF AP02002) AP02001) IPC-7351A) DFN0402â DFN0603â DFN0606â IPC-7351A, AA112A IPC-7351A

    land pattern for TSsOP 16

    Abstract: 8 PIN Plastic DIP land pattern maxim 1584 land pattern for TSSOP 24 pin land pattern for TSSOP land pattern for SOIC 16
    Text: 19-1539; Rev 0; 2/00 High-Speed, Single-Supply, Quad, SPST Analog Switches Features Applications Test Equipment Sample-and-Hold Circuits Disk Drives Guidance and Control Systems Tape Drives Military Radios Audio and Video Communications Systems Switching PBX, PABX


    Original     		PDF MAX4591/MAX4592/MAX4593 MAX4591 MAX4592 MAX4593 100pA MAX4581, MAX4582, MAX4583 MAX4617, land pattern for TSsOP 16 8 PIN Plastic DIP land pattern maxim 1584 land pattern for TSSOP 24 pin land pattern for TSSOP land pattern for SOIC 16

    IPC-7351A

    Abstract: MiniMELF land pattern land pattern for TSsOP 16 land pattern for TSSOP sot89 land pattern PowerDI3333-8 SOD-323 land pattern y1 SOT23 DFN2020 SOD523 land pattern
    Text: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523


    Original     		PDF IPC-7351A DFN1006-2 DFN1006H4-2 OD-323 OD-123 OD-523 DFN1006H4-2 OD-123 OD-323 IPC-7351A MiniMELF land pattern land pattern for TSsOP 16 land pattern for TSSOP sot89 land pattern PowerDI3333-8 SOD-323 land pattern y1 SOT23 DFN2020 SOD523 land pattern

    SOT-563 SOT-666

    Abstract: SOD523 land pattern IPC-7351A IPC SOD 323F SOT-95 SOD-323 land pattern SOT-353 G5 Y3 SOT23 DFN1006-3 DFN1006H4-2
    Text: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523


    Original     		PDF IPC-7351A DFN1006-2 DFN1006H4-2 OD-323 OD-123 OD-523 DFN1006H4-2 OD-123 OD-323 SOT-563 SOT-666 SOD523 land pattern IPC-7351A IPC SOD 323F SOT-95 SOD-323 land pattern SOT-353 G5 Y3 SOT23 DFN1006-3

    Y1 SOT-23

    Abstract: MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8
    Text: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523


    Original     		PDF IPC-7351A DFN1006-2 DFN1006H4-2 OD-323 OD-123 OD-523 DFN1006H4-2 OD-123 OD-323 Y1 SOT-23 MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8

    Untitled

    Abstract: No abstract text available
    Text: 19-1339; Rev 9; 2/07 ±15kV ESD-Protected, 1µA, 1Mbps, 3.0V to 5.5V, RS-232 Transceivers with AutoShutdown Plus The MAX3224E/MAX3225E/MAX3226E/MAX3227E/ MAX3244E/MAX3245E are 3V-powered EIA/TIA-232 and V.28/V.24 communications interfaces with automatic shutdown/wakeup features, high data-rate capabilities, and enhanced electrostatic discharge ESD


    Original     		PDF RS-232 MAX3224E/MAX3225E/MAX3226E/MAX3227E/ MAX3244E/MAX3245E EIA/TIA-232 MAX3225EETP T2055 mvp/id/1847/t/or 26-Jul-2010

    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


    Original     		PDF

    tssop14 0.65 land pattern

    Abstract: TSSOP14 package TSSOP14
    Text: 14-Pin Thin Shrink Small Outline Package TSSOP14 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 6.4 ±0.2 4.4 ±0.1 0.15 -0.01 8 14 0 ～10゜ 1 7 0.22 +0.09 –0.06 0.55 typ. 0.5 0.45 ～ 0.75 0.13 M 0.65 S 0.1 S Land Pattern Example


    Original     		PDF 14-Pin TSSOP14 TSSOP14 tssop14 0.65 land pattern TSSOP14 package

    TSSOP48

    Abstract: TSSOP48 outline
    Text: 48-Pin Thin Shrink Small Outline Package TSSOP48 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 25 6.1 ±0.1 48 0 ～10゜ 0.5 1 0.5 typ. 24 0.5 0.2 +0.07 –0.06 0.45 ～ 0.75 0.1 M 12.8 max 0.1 ±0.05 1.0 ±0.05


    Original     		PDF 48-Pin TSSOP48 TSSOP48 TSSOP48 outline

    land pattern for TSSOP56

    Abstract: TSSOP56 package TSSOP56
    Text: 56-Pin Thin Shrink Small Outline Package TSSOP56 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 29 6.1 ±0.1 56 0 ～10゜ 0.5 1 0.25 typ. 28 0.2 +0.07 –0.06 0.5 0.45 ～ 0.75 0.1 M 14.3 max A 0.1 ±0.05 1.0 ±0.05


    Original     		PDF 56-Pin TSSOP56 TSSOP56 land pattern for TSSOP56 TSSOP56 package

    land pattern for TSSOP16

    Abstract: TSSOP16 TSSOP16 datasheet TSSOP16 Package TSSOP16 LAND PATTERN
    Text: 16-Pin Thin Shrink Small Outline Package TSSOP16 Package Outline Dimensions Outline Dimensions Unit: mm 16 0.25 +0.03 0.15 -0.01 6.4 ±0.2 4.4 ±0.1 9 0 ～10゜ 1 8 0.22 +0.09 –0.06 0.225 typ. 0.5 0.45 ～ 0.75 0.13 M 0.65 5.4 max 0.1 S Land Pattern Example


    Original     		PDF 16-Pin TSSOP16 TSSOP16 land pattern for TSSOP16 TSSOP16 datasheet TSSOP16 Package TSSOP16 LAND PATTERN