Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LCX164245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LCX164245FT
TSSOP48
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LCX16244FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LCX16244FT
TSSOP48
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Untitled
Abstract: No abstract text available
Text: Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT
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TSSOP48:
OT362-1
MO-153
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74HCXXX
Abstract: 74HCxx TSSOP48 CMOS4000 STMicroelectronics package outline dip 74LX1G M013TR M74HCXXXM1R TC74HCTXXXAP SN74ACTXXXPW
Text: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Cross reference guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm)
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SO-14
SO-16L
SO-16
SO-20
SO-24
TSSOP14
OT23-8L
TSSOP20
TSSOP16
OT23-5L
74HCXXX
74HCxx
TSSOP48
CMOS4000
STMicroelectronics package outline dip
74LX1G
M013TR
M74HCXXXM1R
TC74HCTXXXAP
SN74ACTXXXPW
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TSSOP48
Abstract: TSSOP48 outline JEDEC MO-153 jedec MO-153 48-led
Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).
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TSSOP48:
OT362-1
MO-153
TSSOP48
TSSOP48 outline
JEDEC MO-153
jedec MO-153 48-led
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TSSOP48
Abstract: No abstract text available
Text: TSSOP48 Adapter thin shrink small outline package RE933-09 - EPOXY fibre-glass FR4 1.50 mm double-sided 35 µm CU (pth) - Solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.50 mm (240 mil) - pins: 48 - hole dia 1.00 mm - size 27.00 x 34.50 mm
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TSSOP48
RE933-09
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LCXR164245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LCXR164245FT
TSSOP48
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Untitled
Abstract: No abstract text available
Text: Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A2 A 3 A1 pin 1 index A θ Lp L detail X 1 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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TSSOP48:
OT480-1
MO-153
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VCXR162245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VCXR162245FT
TSSOP48
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sot362
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).
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TSSOP48:
OT362-1
OT362-1
MO-153ED
sot362
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TSSOP48
Abstract: SOT480-1
Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5
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TSSOP48:
OT480-1
MO-153
TSSOP48
SOT480-1
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TSSOP48
Abstract: TSSOP48 outline
Text: 48-Pin Thin Shrink Small Outline Package Embossed EL Tape for the TSSOP48 Package Tape Dimensions Unit: mm 4.0 ±0.1 Y 11.5 ±0.1 X’ 13.1 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0 1.75 ±0.1 2.0 ±0.1 Y’ Y’ 8.6 ±0.1 X 1.65 ±0.1
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48-Pin
TSSOP48
TSSOP48
TSSOP48 outline
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TSSOP48
Abstract: TSSOP48 outline TSSOP-48
Text: Thin Shrink Small Outline Package 48pin TSSOP48 パッケージ 外形図 パッケージ形状および寸法 単位 : mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 25 6.1 ±0.1 48 0 ～10゜ 0.5 1 0.5 typ. 24 0.5 0.2 +0.07 –0.06 0.45 ～ 0.75 0.1 M 12.8 max
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48pin
TSSOP48
TSSOP48
TSSOP48 outline
TSSOP-48
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TSSOP48
Abstract: TSSOP48 outline
Text: 48-Pin Thin Shrink Small Outline Package TSSOP48 Package Outline Dimensions Outline Dimensions Unit: mm 0.25 +0.03 0.125 -0.01 8.1 ±0.2 25 6.1 ±0.1 48 0 ～10゜ 0.5 1 0.5 typ. 24 0.5 0.2 +0.07 –0.06 0.45 ～ 0.75 0.1 M 12.8 max 0.1 ±0.05 1.0 ±0.05
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48-Pin
TSSOP48
TSSOP48
TSSOP48 outline
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TSSOP48
Abstract: No abstract text available
Text: PDF: 2003 Apr 14 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 A 3 A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).
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TSSOP48:
OT362-1
MO-153
TSSOP48
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sot480
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5
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TSSOP48:
OT480-1
OT480-1
MO-153
sot480
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TSSOP48
Abstract: TSSOP64 SPDT SPI STP08CL596M TSSOP24 5V SPST RELAY 74V1G66CTR 74V1G66STR 74V1T384CTR 74V1T384STR
Text: Surface mounting packages Advanced Logic ICs SOT23-8L SOT23-5L SOT323-5L Selection guide TSSOP16 TSSOP20 LFBGA96 TSSOP24 TFBGA54 SO-16 SO-20 TSSOP24 exposed-pad TSSOP48 µTFBGA42 QFN16 SO-24 TSSOP64 Flip-Chip5 SSOP24 Flip-Chip11 H (inch) W (tape width mm)
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OT23-8L
OT23-5L
OT323-5L
TSSOP16
TSSOP20
LFBGA96
TSSOP24
TFBGA54
SO-16
SO-20
TSSOP48
TSSOP64
SPDT SPI
STP08CL596M
TSSOP24
5V SPST RELAY
74V1G66CTR
74V1G66STR
74V1T384CTR
74V1T384STR
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TSSOP48
Abstract: No abstract text available
Text: PDF: 2000 Jan 05 Philips Semiconductors Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; lead pitch 0.4 mm SOT480-1 E D A X c y HE v M A Z 25 48 Q A 3 A2 A A1 pin 1 index θ Lp L detail X 1 24 w M bp e 2.5
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TSSOP48:
OT480-1
MO-153
TSSOP48
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TSSOP48
Abstract: TSSOP48 outline TSSOP-48
Text: Thin Shrink Small Outline Package 48pin TSSOP48 パッケージ エンボス方式テーピング寸法 EL テープ形状および寸法 単位 : mm 4.0 ±0.1 Y 11.5 ±0.1 X’ 13.1 ±0.1 Y φ2.0 ±0.1 X 0.3 ±0.05 24.0 ±0.3 12.0 ±0.1 φ1.5 +0.1 –0
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48pin
TSSOP48
TSSOP48
TSSOP48 outline
TSSOP-48
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Untitled
Abstract: No abstract text available
Text: TS SO P4 8 SOT362-1 TSSOP48; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 5 — 15 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape
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OT362-1
TSSOP48;
001aak603
OT362-1
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VCX16245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VCX16245FT
TSSOP48
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LCX16245FT Package Name: TSSOP48 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a momet) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LCX16245FT
TSSOP48
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4001 4011 cmos
Abstract: 4049 DIP14 4013 datasheet hct lcx 574 CMOS 4541 str 4512 C3245 4017 14 pin package CMOS4000 hcf 4541 be
Text: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Selection guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm) SO-8, TFBGA42
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SO-14
SO-16L
SO-16
SO-20
SO-24
TSSOP14
OT23-8L
TSSOP20
TSSOP16
OT23-5L
4001 4011 cmos
4049 DIP14
4013 datasheet hct
lcx 574
CMOS 4541
str 4512
C3245
4017 14 pin package
CMOS4000
hcf 4541 be
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Untitled
Abstract: No abstract text available
Text: TOSHIBA TC74VCX16373FT TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TC74VCX16373FT LOW-VOLTAGE 16-BIT D-TYPE LATCH WITH 3.6V TOLERANT INPUTS AND OUTPUTS The TC74VCX16373FT is a high performance CMOS 16-bit D-TYPE LATCH. Designed for use in 1.8, 2.5 or 3.3 Volt
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TC74VCX16373FT
16-BIT
TC74VCX16373FT
TSSOP48-P-OQ61
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