KPIN1061E02 Search Results
KPIN1061E02 Datasheets Context Search
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Contextual Info: PHOTODIODE Si PIN photodiode S8650 Flat surface ideal for bonding to scintillator S8650 Si PIN photodiode has an epoxy coating window processed to have a flat surface flatness: ±5 µm . When bonded to a scintillator, the flat surface allows highly tight coupling to the scintillator so bubbles are unlikely to penetrate in between. |
Original |
S8650 S8650 SE-171 KPIN1061E02 | |
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Contextual Info: PHOTODIODE Si PIN photodiode S8650 Flat surface ideal for bonding to scintillator S8650 Si PIN photodiode has an epoxy coating window processed to have a flat surface flatness: ±5 µm . When bonded to a scintillator, the flat surface allows highly tight coupling to the scintillator so bubbles are unlikely to penetrate in between. |
Original |
S8650 S8650 SE-171 KPIN1061E02 | |
scintillator
Abstract: KPIN1061E02 S8650 SE-171
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Original |
S8650 S8650 SE-171 KPIN1061E02 scintillator KPIN1061E02 |