K4N51163QE Search Results

Contextual Info: 512M gDDR2 SDRAM K4N51163QE 512Mbit gDDR2 SDRAM Revision 1.3 August 2007 Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

K4N51163QE

Abstract: K4N51163QE-ZC2A K4N51163QE-ZC20
Contextual Info: 512M gDDR2 SDRAM K4N51163QE 512Mbit gDDR2 SDRAM Revision 1.2 May 2007 Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

Contextual Info: 512M gDDR2 SDRAM K4N51163QE 512Mbit gDDR2 SDRAM Revision 1.0 November 2006 Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

Contextual Info: 512M gDDR2 SDRAM K4N51163QE 512Mbit gDDR2 SDRAM Revision 1.1 February 2007 Notice INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

U665B

Abstract: SCD1U10V2KX-5GP aol14 H5PS5162 0R2J-2-GP ICS9LPRS365YGLFT-GP TPS51125 WPC775L RTM875T-606 si7686
Contextual Info: A C D Mobile CPU CLK GEN. PCB STACKUP 667/800/1066MHz@1.05V 800/667MHz Cantiga AGTL+ CPU I/F 12,13 LVDS DDR Memory I/F PCI-EG INPUTS 71.CNTIG.00U 12,13 X4 DMI 400MHz 4 36 OUTPUTS DCBATOUT 1D8V_S3 10A RT9026 35 DDR_VREF_S0 (1.5A) S 1D8V_S3 GND DDR_VREF_S3

ene kb3926qf c0

Abstract: ene kb3926qf kb3926 ene kb3926qf d2 kb3926qf d2 kb3926qf c0 IDT92HD RT8206B AT5231 OZ8119
Contextual Info: 1 2 3 4 5 7 8 Jones/Cujo BLOCK DIAGRAM PCB STACK UP 8L Dis. LAYER 2 : SGND 14.318MHz PAGE 4 A 478P uPGA /35W PAGE 3,4 LAYER 3 : IN2 01 CPU THERMAL SENSOR CPU Penryn LAYER 1 : TOP A 6 CLK_CPU_BCLK,CLK_CPU_BCLK# CLOCK GEN CLK_MCH_BCLK,CLK_MCH_BCLK# LAYER 4 : SGND1

ene kb3926qf

Abstract: ene kb3926qf d2 KB3926QF A1 ene kb3926qf c0 kb3926qf c0 kb3926qf d2 kb3926 apl*5606 92HP61B7X5 AT5231
Contextual Info: 1 2 3 4 5 7 8 01 UT7D BLOCK DIAGRAM PCB STACK UP 8L CPU THERMAL SENSOR CPU Penryn LAYER 1 : TOP A 6 LAYER 2 : SGND 14.318MHz PAGE 4 A 478P uPGA /45W PAGE 3,4 LAYER 3 : IN1 CLK_CPU_BCLK,CLK_CPU_BCLK# LAYER 4 : SVCC CLOCK GEN CLK_MCH_BCLK,CLK_MCH_BCLK# DREFCLK,DREFCLK#

SN0608098-GP

Abstract: BQ24745RHDR-GP lcd 15.4 inverter EPSON C691 MAIN AMD RS780 tps51125 MEC5035 foxconn TPS51117PWR-GP BCM5761
Contextual Info: 5 4 3 2 1 FOOSE UMA Schematics Document AMD 15.4" D D AMD Giffin CPU S1G2 AMD RS780 +SB700 C C 2008-01-04 REV : SB B B DY : Nopop Component 5761 : Use BCM5761E 5756 : Use BCM5756M B_TPM : Use LOM TPM C_TPM : Use China TPM <Variant Name> A A Wistron Corporation

k4w2g1646

Abstract: GDDR K4J52324Q 54NS k4j10324qd-hc k4n51163qe-zc K4J55323 K4W1G1646D-EC K4W1G1646E A/SAMSUNG GDDR3
Contextual Info: Date : February. 9, 2009 Application Application Note Note Graphic Memory Dout Valid Window at DLL-Off Mode Product Planning & Application Eng.Team Memory Technology & Product Division Samsung Electronics Co., Ltd San #16 Banwol-Ri, Taean-Eup Hwasung-City, Kyungki-Do, Korea R.O.K

MDIN325

Abstract: jmb385 K4N51163QE-ZC25 48.4H701.011 G545A2 RN412 03a a03 isl6265 TPS51125 PDTA124EU-1-GP DDR3 fs1
Contextual Info: 5 4 3 2 P1/P15 Block Diagram DDRII Slot 0 8 667/800 DDRII 667/800 MHz Channel A Project code PCB Number Revision Part Number Thermal & Fan G792 23 AMD S1G2 CPU D DDRII Slot 1 9 667/800 638-Pin uFCPGA DDRII 667/800 MHz Channel B 1 :91.4H701.001 : 07254 : -1

OZ129TN

Abstract: LA-4121P KB926 NB8M jal30 la4121p FBMA-L11-201209-221LMA30T ISL6251 LA-4231P JAL30 LA-4121P compal
Contextual Info: A B C D E 1 1 Compal Confidential 2 2 Schematic Document Crestline_GM/PM+NB8M-GS & ICH8M 2008 / 3 / 17 Rev:1.0 3 3 4 4 Compal Secret Data Security Classification Issued Date 2007/1/15 2008/1/15 Deciphered Date THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

H5PS5162

Abstract: TPS51125 ALC269 ST220U6D3VDM-15GP ICS9LPRS365YGLFT-GP R649 wistron homa ich9 RTM875T-606-VD-GRT SC1U10V2KX-1GP
Contextual Info: A C D Mobile CPU CLK GEN. PCB STACKUP 5V_S5 5A DCBATOUT 3D3V_S5(5A) INPUTS 667/800/1066MHz@1.05V OUTPUTS DCBATOUT 1D8V_S3(10A) VCC S 800/667MHz Cantiga AGTL+ CPU I/F 12,13 WXGA/SXGA+ 15"LCD 14 LVDS ATI DDR Memory I/F PCI-EG INTEGRATED GRAHPICS RT9026 35 DDR_VREF_S0

OZ129TN

Abstract: LA-4121P jal30 la4121p jal30 la-4121p FBMA-L11-201209-221LMA30T smd pwm controller ISL6251 fuse smd code e AO4712_SO8 K4N51163QE-ZC25
Contextual Info: A B C D E 1 1 Compal Confidential 2 2 Schematic Document Crestline_GM/PM+NB8M-GS & ICH8M 2007 / 1 / 2 Rev:0.4 3 3 4 4 Compal Secret Data Security Classification Issued Date 2007/1/15 2008/1/15 Deciphered Date Title Compal Electronics, Inc. Cover Sheet THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL

ene kb3926qf

Abstract: ene kb3926qf d2 intel G41 MOTHERBOARD crb kb3926 kb3926qf d2 ene kb3926qf c0 kb3926qf KB3926QF A1 Quanta qt6 bosch 0 281 003 039
Contextual Info: 1 2 3 4 5 7 8 QT6 BLOCK DIAGRAM PCB STACK UP 8L LAYER 2 : SGND 14.318MHz PAGE 5 A 478P uPGA /35W PAGE 3,4 LAYER 3 : IN2 01 CPU THERMAL SENSOR CPU Penryn LAYER 1 : TOP A 6 CLK_CPU_BCLK,CLK_CPU_BCLK# LAYER 4 : SGND1 CLOCK GEN CLK_MCH_BCLK,CLK_MCH_BCLK# DREFCLK,DREFCLK#

SN0608098-GP

Abstract: BQ24745RHDR-GP TPS51117PWR-GP nxp pr533 foose rs780M mec5035 c840 dell BCM5761 RS780
Contextual Info: 5 4 3 2 1 FOOSE UMA 14" Schematics Document D D AMD Giffin CPU S1G2 RS780M + SB700 C C 2008-01-04 REV : SB B B DY : Nopop Component 5761 : Use BCM5761E 5756 : Use BCM5756M B_TPM : Use LOM TPM C_TPM : Use China TPM <Variant Name> A A Wistron Corporation 21F, 88, Sec.1, Hsin Tai Wu Rd., Hsichih,

ene kb3926qf

Abstract: ene kb3926qf d2 ene kb3926qf a1 kb3926 kb3926qf kb3926qf d2 ene kb3926 KB3926 A01 quanta tw7 kb3926 d3
Contextual Info: 1 2 3 PCB STACK UP 5 6 31TW7MB00XX LAYER 2 : SGND1 LAYER 3 : IN1 LAYER 4 : IN2 LAYER 5 : VCC 7 DC/DC 3VSUS 5VSUS DC/DC 3VPCU 5VPCU DC/DC +1.05V +1.5V PG43 PG38 PG37 RUN POWER SW PG 43 LAYER 7 : SGND2 AC/BATT CONNECTOR PG 40 BATT CHARGER PG 40 Merom 35W CPU VR

ene kb3926qf

Abstract: ene kb3926qf d2 kb3926qf d2 kb3926 ene kb3926qf c0 kb3926qf Quanta qt6 KB3926 AT5 C833 apl*5606 H5PS5162
Contextual Info: 1 2 3 4 5 7 8 UT7 BLOCK DIAGRAM PCB STACK UP 8L LAYER 2 : SGND 14.318MHz PAGE 4 A 478P uPGA /35W PAGE 3,4 LAYER 3 : IN1 01 CPU THERMAL SENSOR CPU Penryn LAYER 1 : TOP A 6 CLK_CPU_BCLK,CLK_CPU_BCLK# CLOCK GEN CLK_MCH_BCLK,CLK_MCH_BCLK# LAYER 4 : SVCC DREFCLK,DREFCLK#

U665B

Abstract: ICS9LPRS365YGLFT-GP ALC269 1D05V TPS51125 c4381 JMB385 Wistron Corporation VIP 12A ich9
Contextual Info: A C D Mobile CPU CLK GEN. PCB STACKUP 667/800/1066MHz@1.05V 800/667MHz Cantiga AGTL+ CPU I/F 12,13 LVDS DDR Memory I/F PCI-EG INPUTS 71.CNTIG.00U 12,13 X4 DMI 400MHz 4 36 OUTPUTS DCBATOUT 1D8V_S3 10A RT9026 35 DDR_VREF_S0 (1.5A) S 1D8V_S3 GND DDR_VREF_S3

samsung gddr5

Abstract: k4w2g1646 GDDR5 K4J52324K K4J52324KI SAMSUNG GDDR3 GDDR5 application note samsung K4W1G1646D-EC gddr5 samsung K4J10324KE
Contextual Info: Rev. 1.1, Nov. 2009 Graphic Memory Dout Valid Window at DLL-off mode A guide for user to use graphic memory at DLL-off mode Rev.1.1 1. Introduction The graphic industry keeps driving memory vendors to increase the memory frequency as fast as they can. Through continuous efforts, now GDDR3 hits over