JESD201
Abstract: JESD 201 whisker JESD 201 class 1A
Text: Tin Whisker Growth Results on Tin Surface Finished Products Rev. A, 02 May 2007 Whisker growth test methods and conditions per JESD-201 and JEDEC22a121.01. In case of deviation between the two methods, JESD-201 was used. Definitions per JESD-201 and JEDEC22a121.01
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JESD-201
JEDEC22a121
3000X
JESD201
JESD 201
whisker
JESD 201 class 1A
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PDF
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Untitled
Abstract: No abstract text available
Text: CSM Current Sense MELF Resistor y iabilit logy • Rel y t Techno i l a n via w Qu o t-D Cos Specifications Per • IEC 60115-1, 60115-2 • CECC 40101 CSM • DIN 44061 Features B L • High power handling with superior reliability and stability D • Conformal multi-layer coating against humidity
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CSM204
CSM101
CSM201
CSM301
CSM52
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PDF
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Untitled
Abstract: No abstract text available
Text: EFP - Enhanced Film Power MELF Resistor y iabilit logy • Rel y t Techno i l a n via w Qu o t-D Cos Specifications Per • IEC 60115-1, 60115-2 • CECC 40101 EFP • DIN 44061 Features B L • High power handling D • Superior reliability and stability
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EFP204
EFP101
EFP201
EFP401
EFP301
EFP204,
EFP101:
EFP201,
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PDF
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J-STD-020 MSL Rating
Abstract: mil J-STD-020
Text: KEMET Surface Mount Ceramic Revision D, 03 November 2006 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party might suffer
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2002/95/EC,
2005/618/EC.
J-STD-020 MSL Rating
mil J-STD-020
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PDF
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kemet CWR29 datasheet
Abstract: JESD22a121 cwr29 capacitor code MCV CWR29 MAR 618 transistor T496 T497 T498 T499
Text: KEMET Surface Mount Tantalum Revision E, 15 January 2007 Note: Information subject to change without notice. Monitor website regularly for updates. KEMET is not liable for any damages, direct or indirect, consequential or otherwise, that the reader might incur as a result of ignoring this warning, or that any third party
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Original
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2002/95/EC
2002/95/EC,
2005/618/EC.
kemet CWR29 datasheet
JESD22a121
cwr29 capacitor
code MCV
CWR29
MAR 618 transistor
T496
T497
T498
T499
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PDF
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Untitled
Abstract: No abstract text available
Text: Enhancing Long-Term Reliability with Copper Leadframes One of the points to consider when selecting a semiconductor device is the package reliability, relative to the expected operating conditions of the electronics application. With this in mind, ISSI now includes
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Alloy42
64Mbit
512Mbit.
16Mbit.
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PDF
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Untitled
Abstract: No abstract text available
Text: Enhancing Long-Term Reliability with Copper Leadframes One of the points to consider when selecting a semiconductor device is the package reliability, relative to the operating conditions of the electronics application. With this in mind, ISSI recently added synchronous
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Original
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Alloy42
64Mbit
512Mbit.
16Mbit)
256Kbit)
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PDF
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BFG95
Abstract: No abstract text available
Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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UG112
UG072,
UG075,
XAPP427,
BFG95
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PDF
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XILINX/part marking Hot
Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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Original
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UG112
UG072,
UG075,
XAPP427,
XILINX/part marking Hot
SMT, FPGA FINE PITCH BGA 456 BALL
PC84/PCG84
XCDAISY
TT 2076
XC2VP7 reflow profile
SPARTAN-II xc2s50 pq208
sn63pb37 solder SPHERES
qfn 3x3 tray dimension
HQG160
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PDF
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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Original
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UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
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PDF
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