UM0306
Abstract: smartcard mcu
Text: UM0306 Reference manual STM32F101xx and STM32F103xx advanced ARM-based 32-bit MCUs Introduction This Reference Manual targets application developers. It provides complete information on how to use the STM32F101xx and ST32M103xx microcontroller memory and peripherals.
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UM0306
STM32F101xx
STM32F103xx
32-bit
ST32M103xx
STM32F10x
UM0306
smartcard mcu
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Untitled
Abstract: No abstract text available
Text: Adhesive Adhesive strip with removable liner 5” Made in America 15" To Install: 1. Remove the shoe and then remove the release paper exposing the adhesive tape from the Heel Grounder assembly. 2. Install the portion of the adhesive tape to the bottom of
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TB-2040,
TB-3000.
FTMS-1018,
JEDEC-108/9,
MIL-HDBK-263A,
MIL-STD-1686,
DOD-STD-2000.
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a2531
Abstract: transistor a2431 8257A A2757 a2430 A2393 a2400 a2529 A2527 a2495
Text: Intel386 EX Embedded Microprocessor User’s Manual title.fm4 Page i Tuesday, August 15, 1995 3:01 PM Intel386™ EX Embedded Microprocessor User’s Manual February 1995 title.fm4 Page ii Tuesday, August 15, 1995 3:01 PM Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including
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Intel386TM
Index-10
a2531
transistor a2431
8257A
A2757
a2430
A2393
a2400
a2529
A2527
a2495
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Untitled
Abstract: No abstract text available
Text: Made in America 12" To Attach: 1. Strip release paper from pressure sensitive adhesive. 2. Fold and clip aluminum strip to top and inside of shoe or boot between shoe and sock . 3. Pull strap snugly down and under heel. 4. Step firmly onto pressure-sensitive adhesive and tear off excess material at serration.
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FTMS-1018,
JEDEC-108/9,
MIL-HDBK-263A,
MIL-STD-1686,
DOD-STD-2000.
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cosmo 1010 817
Abstract: RM0008 Reference Manual STM32F2 RM0008 phillips sq10 amplifier stm32f105 stm32 encoder IC cosmo 1010 817 stm32 timer STM32F10xx
Text: RM0008 Reference manual STM32F101xx, STM32F102xx, STM32F103xx, STM32F105xx and STM32F107xx advanced ARM-based 32-bit MCUs Introduction This reference manual targets application developers. It provides complete information on how to use the STM32F101xx, STM32F102xx, STM32F103xx and
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RM0008
STM32F101xx,
STM32F102xx,
STM32F103xx,
STM32F105xx
STM32F107xx
32-bit
STM32F103xx
cosmo 1010 817
RM0008 Reference Manual
STM32F2
RM0008
phillips sq10 amplifier
stm32f105
stm32 encoder
IC cosmo 1010 817
stm32 timer
STM32F10xx
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a2305
Abstract: 80386EX es relay RAS 1210 EV386EX 0F804H PS5 1020 a2400 Ps3 MOTHERBOARD CIRCUIT diagram Intel386 SX a2531
Text: Intel386 EX Embedded Microprocessor User’s Manual Intel386™ EXTB Embedded Microprocessor Intel386™ EXTC Embedded Microprocessor Intel386™ EX Embedded Microprocessor User’s Manual 1996 Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of
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Intel386TM
Index-11
a2305
80386EX
es relay RAS 1210
EV386EX
0F804H
PS5 1020
a2400
Ps3 MOTHERBOARD CIRCUIT diagram
Intel386 SX
a2531
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RM0008 Reference Manual
Abstract: RM0008 phillips sq10 amplifier STM32F10xxx UM0306 phillips sq10 amplifier datasheet stm32f103xx technical reference manual STM32F10* I2C cosmo 1010 317 STM32F10xxx jtag RM008
Text: RM0008 Reference manual Low-, medium- and high-density STM32F101xx, STM32F102xx and STM32F103xx advanced ARM-based 32-bit MCUs Introduction This reference manual targets application developers. It provides complete information on how to use the low-, medium- and high-density STM32F101xx, STM32F102xx and
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RM0008
STM32F101xx,
STM32F102xx
STM32F103xx
32-bit
STM32F102xx
RM0008 Reference Manual
RM0008
phillips sq10 amplifier
STM32F10xxx UM0306
phillips sq10 amplifier datasheet
stm32f103xx technical reference manual
STM32F10* I2C
cosmo 1010 317
STM32F10xxx jtag
RM008
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STM32L15xxx Flash programming manual
Abstract: RM0038 STM32L152 STM32L152xx STM32L151 STM32L s41 230 hall effect hp laptop battery pinout STM32L151xx STM32L15xxx
Text: RM0038 Reference manual STM32L151xx and STM32L152xx advanced ARM-based 32-bit MCUs Introduction This reference manual targets application developers. It provides complete information on how to use the STM32L151xx and STM32L152xx microcontroller memory and peripherals.
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RM0038
STM32L151xx
STM32L152xx
32-bit
STM32L152xx
STM32L15xxx
STM32L15xxx Flash programming manual
RM0038
STM32L152
STM32L151
STM32L
s41 230 hall effect
hp laptop battery pinout
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07590
Abstract: No abstract text available
Text: E Description: 90P1 D LISTED F The 07590 premium series heel grounder provides effective ESD protection. The cup is made from a black and non-marring rubber with inner tear resistant conductive scrim. The rubber is antistatic, low tribocharging, and dissipative. It
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STM97
JEDEC-108/9,
MIL-HDBK-263A,
MIL-STD-1686,
DOD-STD-2000.
07590
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Untitled
Abstract: No abstract text available
Text: Key: A. Exterior layer made of conductive rubber to ground the operator via ESD flooring B. Interior layer made of non-marring rubber that will not blemish shoes C. 24” conductive ribbon D. One megohm fully insulated current limiting resistor E. High visibility lime green hook and loop adjustable closure
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TB-2020,
TB-2040,
TB-3034.
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a2531
Abstract: MCR 22-B 409 240331 80386EX Ps3 MOTHERBOARD CIRCUIT diagram MT 1336 Ei type CORE BV4 INTEL 386EX a2400 386ex ssio
Text: Intel386 EX Embedded Microprocessor User’s Manual Intel386™ EXTB Embedded Microprocessor Intel386™ EXTC Embedded Microprocessor Intel386™ EX Embedded Microprocessor User’s Manual 1996 Order Number 272485-002 Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of
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Intel386TM
Index-11
a2531
MCR 22-B 409
240331
80386EX
Ps3 MOTHERBOARD CIRCUIT diagram
MT 1336
Ei type CORE BV4
INTEL 386EX
a2400
386ex ssio
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STM32F100
Abstract: STM32F100* rm0041 STM32 PWM output developer kit AN2606 stm32 RM0041 STM32F100xx advanced ARM-based 32-bit MCUs DIODE marking SL x7 sda 2023 mos internal diagram of 7400 IC IC 7400 datasheet
Text: RM0041 Reference manual STM32F100xx advanced ARM-based 32-bit MCUs Introduction This reference manual targets application developers. It provides complete information on how to use the STM32F100x4, STM32F100x6, STM32F100x8 and STM32F100xB microcontroller memory and peripherals. The STM32F100x4, STM32F100x6,
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RM0041
STM32F100xx
32-bit
STM32F100x4,
STM32F100x6,
STM32F100x8
STM32F100xB
STM32F100
STM32F100* rm0041
STM32 PWM output developer kit
AN2606 stm32
RM0041
STM32F100xx advanced ARM-based 32-bit MCUs
DIODE marking SL x7
sda 2023 mos
internal diagram of 7400 IC
IC 7400 datasheet
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rM0042
Abstract: cosmo 1010 817 RM0008 Reference Manual RM0008 cosmo 3063 cosmo 3010 814 STM32 13902 11 cosmo 3010 -814 STM32F100 arm cortex a9
Text: RM0008 Reference manual STM32F101xx, STM32F102xx, STM32F103xx, STM32F105xx and STM32F107xx advanced ARM-based 32-bit MCUs Introduction This reference manual targets application developers. It provides complete information on how to use the STM32F101xx, STM32F102xx, STM32F103xx and
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RM0008
STM32F101xx,
STM32F102xx,
STM32F103xx,
STM32F105xx
STM32F107xx
32-bit
STM32F103xx
rM0042
cosmo 1010 817
RM0008 Reference Manual
RM0008
cosmo 3063
cosmo 3010 814
STM32 13902 11
cosmo 3010 -814
STM32F100
arm cortex a9
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Untitled
Abstract: No abstract text available
Text: RM0008 Reference manual STM32F101xx and STM32F103xx advanced ARM-based 32-bit MCUs Introduction This reference manual targets application developers. It provides complete information on how to use the STM32F101xx and STM32F103xx microcontroller memory and peripherals.
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RM0008
STM32F101xx
STM32F103xx
32-bit
STM32F103xx
STM32F10xxx
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07560
Abstract: No abstract text available
Text: A. B. C. D. Outer conductive layer 10^5 RTT Inner non-marking neoprene layer Reinforced with 4.3 oz. polyester mesh scrim layer .060” thick, 1 ¼” wide contact area E. 30” long, 3/8” wide, 8 string black conductive ribbon F, G. 3/4”, double sided hook and loop material, for quick and easy attachment to
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8x103
FTMS-1018,
3x106
RMA-808
TB-2040.
TB-2020.
JEDEC-108/9,
MIL-HDBK-263A,
MIL-STD-1686
07560
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07588
Abstract: No abstract text available
Text: Key: A. Two layer rubber composite material. Material consists of a layer which provides a non-marring interior surface that will not blemish shoes and a black conductive layer to ground via ESD flooring. B. Non-marring inner layer. C. 24” conductive ribbon.
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JEDEC-108/9,
MIL-HDBK-263A,
MIL-STD-1686,
DOD-STD-2000.
FTMS-1018,
ASTM-D3389
ASTM-D2240
07588
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Untitled
Abstract: No abstract text available
Text: YAMAICHI Q.F.P. Production Sockets Body M aterial: Polyphenylene Sulfide PPS Contact M aterial: Beryllium Copper (BeCu) Contact Plating; Tin over Nickel Mating Package: JEDEC100 pin Bumpered QFP IC157-100-001-SS4 • CHARACTERISTICS Insulation Resistance
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JEDEC100
IC157-100-001-SS4
500MO
500VDC
10mA/20mV
IC157
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2SC2028
Abstract: 2SC2028/2
Text: S U T R A N S I S r— T O ““ *: I T .•, v,.* .v, î' R * f■W>*:■■ .* U m v * t - >■■■■*1" IV-* 2SC2028/2 27MHz 2Wffi^. g î class o Y 9 4 ' < - # ¿ L - t S t t S ixft npN x k T ^ * * * .7 \s-+% y'} h Ts*Mfi1 'f o EPG? JEDEC10-176 1 Æ
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2SC2028/2
27MHz
Vcb-30
Ic-100
j-500mA,
50roA
f-27MHz
in-30mW
2SC2028
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8208 ns
Abstract: No abstract text available
Text: PRELIMINARY DATA SHEET NEC / MOS INTEGRATED CIRCUIT MC-4516DA72 16M-WORD BY 72-BIT SYNCHRONOUS DYNAMIC RAM MODULE BUFFERED TYPE Description The MC-4516DA72 is a 16,777,216 words by 72 bits synchronous dynamic RAM module on which 18 pieces of 64M SDRAM : ¿/PD4564441 are assembled.
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MC-4516DA72
16M-WORD
72-BIT
MC-4516DA72
uPD4564441
MC-4516DA72-A10
8208 ns
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"Dual Schottky Rectifier"
Abstract: 8D241 SD241 SD24145 1118H
Text: COORS COMPONENTS INC Ä5 EM3D0Dt i Dual Schottky Rectifier □□□□ISA Series SD 241 30 A Avg; VRRM up to 45 Volts 820 00128 D - r - ï -• 0 3 - 1 9 ■ Designed for center tap rectification and commutation ■ 45 Volts Vrrm/V rwm ■ 160° 7-j ■ Guard ring reverse protection
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Untitled
Abstract: No abstract text available
Text: YAMAICHI ELECTRONICS INC 0QG0S7Ö SSfl • bflE D YAMAICHI IC157-100-001-SS4 Q.F.P. Production Sockets RECOMMENDED PC BOARO LAYOUT 10* V « W M U M SOCKET 1 D0- *0. ss talsrttr jjf H; =1 “ Bodv Material : Polyphenylene Sulfide PPS Contact Material: Beryllium Copper (BeCu)
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IC157-100-001-SS4
JEDEC100
500MQ
500VDC
10mA/20mV
IC157-
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Untitled
Abstract: No abstract text available
Text: YA HA IC HI E L E C T R O N I C S Q.F.P. SMT INC bflE D TTHSSati D O D G S ? 1! MTM YAMAICHI IC198 Series + 0.05 I SPE C IF IC A T IO N S • Low profile 4.0mm. Easy for ROM upgrade. • SMT terminals • C H A R A C T E R IS T IC S Insulation Resistance
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IC198
IC157-100-001-SS4
JEDEC100
500MQ
500VDC
10mA/20mV
IC157-
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