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    JEDEC TRAY SSOP Search Results

    JEDEC TRAY SSOP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP139AIYAHR
    		Texas Instruments JEDEC DDR5 temperature sensor with 0.5 °C accuracy 6-DSBGA -40 to 125 Visit Texas Instruments Buy
    SN74SSQEA32882ZALR
    		Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQEB32882ZALR
    		Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy
    SN74SSQE32882ZALR
    		Texas Instruments JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments
    SN74SSQEC32882ZALR
    		Texas Instruments JEDEC SSTE32882 Compliant Low Power 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 Visit Texas Instruments Buy

    JEDEC TRAY SSOP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    JEDEC TRAY DIMENSIONS ssop

    Abstract: H649 JEDEC TRAY DIMENSIONS JEDEC TRAY ssop SOP JEDEC tray JEDEC tray standard
    Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF PPE 7 105.0 NEC 10.3 135°C MAX. 15.00 15.45 375mil48p SSOP A' 15.75 22.00 14.50 286.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 15.75 7.62 135.9 8x14=112 A Applied Package Quantity (pcs) 48-pin • Plastic Shrink SOP (1.7 mm thick)


    Original     		375mil48p 48-pin 375mil48pSSOP SSD-A-H6495-1 JEDEC TRAY DIMENSIONS ssop H649 JEDEC TRAY DIMENSIONS JEDEC TRAY ssop SOP JEDEC tray JEDEC tray standard PDF

    SSOP12

    Abstract: SOP package tray SOP JEDEC tray SSOP12 Package h740 JEDEC TRAY DIMENSIONS SSOP-12
    Contextual Info: TRAY CONTAINER NEC 119.9 5.86 135° CMAX. 10.90 SSOP12.3 x 6.1A 8.00 135.9 PPE 12 × 20=240 UNIT : mm 12.70 15.50 10.25 294.5 315.0 322.6 SECTION A-A' 5.27 (6.35) 7.62 12.70 Applied Package 38-pin • Plastic Shrink SOP Quantity (pcs) 240 MAX. SSOP12.3 × 6.1A


    Original     		SSOP12 38-pin SSD-A-H7409 SOP package tray SOP JEDEC tray SSOP12 Package h740 JEDEC TRAY DIMENSIONS SSOP-12 PDF

    JEDEC TRAY DIMENSIONS ssop

    Abstract: SOP package tray JEDEC tray standard 20pin SOP SOP JEDEC tray JEDEC TRAY DIMENSIONS JEDEC TRAY ssop TRAY DIMENSIONS JEDEC TRAY DIMENSIONS ssop 20 JEDEC tray standard H645
    Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 7 PPE NEC 135°C MAX. A' 8.4 12.75 135.9 300mil20p SSOP 10.58 114.75 10x24=240 A 6.4 12.20 17.20 280.6 315.0 322.6 SECTION A – A' 5.27 7.62 (6.35) 6.40 Applied Package Quantity (pcs) 20-pin • Plastic Shrink SOP (1.2 mm thick)


    Original     		300mil20p 20-pin 300mil20pSSOP SSD-A-H6455-1 JEDEC TRAY DIMENSIONS ssop SOP package tray JEDEC tray standard 20pin SOP SOP JEDEC tray JEDEC TRAY DIMENSIONS JEDEC TRAY ssop TRAY DIMENSIONS JEDEC TRAY DIMENSIONS ssop 20 JEDEC tray standard H645 PDF

    H7665

    Abstract: SOP package tray SSOP36 SOP JEDEC tray H7665 DATA SHEET JEDEC TRAY DIMENSIONS JEDEC tray standard 490
    Contextual Info: TRAY CONTAINER UNIT : mm 120.9 14 x 35=490 135° C MAX. 3.9 8.85 7.05 6.8 NEC A' 9.30 7.50 SSOP3.6 × 4.4A 135.9 PPE A 300.9 315.0 322.6 SECTION A-A' 5.92 6.35 7.62 3.90 Applied Package 10-pin Plastic Shrink SOP Quantity (pcs) 490 MAX. Tray SSOP3.6×4.4A


    Original     		10-pin SSD-A-H7665 H7665 SOP package tray SSOP36 SOP JEDEC tray H7665 DATA SHEET JEDEC TRAY DIMENSIONS JEDEC tray standard 490 PDF

    JEDEC TRAY DIMENSIONS

    Abstract: JEDEC tray standard SOP JEDEC tray ssop300mil10 SOP package tray tray container dimensions TRAY DIMENSIONS TRAY CONTAINER SSD-A-H6451-2 H645
    Contextual Info: TRAY CONTAINER UNIT : mm PPE 7 HEAT PROOF 114.75 NEC 135° MAX. A' 8.4 10.58 12.75 SSOP300MIL10 135.9 10x21=210 A 9.6 14.75 10.00 295.0 315.0 322.6 SECTION A – A' 5.27 7.62 (6.35) 9.60 Applied Package Quantity (pcs) 30-pin • Plastic Shrink SOP (1.2 mm, 1.7 mm thick)


    Original     		SSOP300MIL10 30-pin SSD-A-H6451-2 JEDEC TRAY DIMENSIONS JEDEC tray standard SOP JEDEC tray ssop300mil10 SOP package tray tray container dimensions TRAY DIMENSIONS TRAY CONTAINER SSD-A-H6451-2 H645 PDF

    footprint jedec MS-026 TQFP

    Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
    Contextual Info: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES


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    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Contextual Info: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


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    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


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    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Contextual Info: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


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    MQFP Shipping Trays

    Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook
    Contextual Info: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


    Original     		PDF

    MIL-STD-81705

    Abstract: JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray
    Contextual Info: 2 10 Transport Media and Packing 1/16/97 5:51 PM CH10WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 10 TRANSPORT MEDIA AND PACKING 10.1. TRANSPORT MEDIA 10.1.1. Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride (PVC) with an


    Original     		CH10WIP MIL-STD-81705 JEDEC TRAY PLCC transport media and packing tsop Shipping Trays JEDEC TRAY DIMENSIONS INTEL PLCC 68 dimensions tray bga PLCC 44 intel package dimensions AZ 2535 PLCC JEDEC tray PDF

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing PDF

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


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    DAEWON tray tsop 48LD

    Abstract: nikon v12B 6n1 tube IPC-J-STD-001 nikon GRAINGER TRAY TSOP 56LD daewon TRAY DAEWON TSOP venturi meter
    Contextual Info: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.4 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Procedures


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    IPC-J-STD-001

    Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide DAEWON tray 48 optical Pick-Up head venturi meter R08-01-FOGO
    Contextual Info: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.5 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Process Procedures


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    HT 1200-4

    Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
    Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional


    Original     		March/97 HT 1200-4 YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341 PDF

    EIA and EIAJ standards 783

    Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label
    Contextual Info: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label PDF

    JEDEC Matrix Tray outlines

    Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783
    Contextual Info: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare


    Original     		SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783 PDF

    PT740 AB

    Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
    Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		September/2000 PT740 AB diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48 PDF

    EIA and EIAJ standards 783

    Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP
    Contextual Info: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to


    Original     		SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP PDF

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Contextual Info: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A PDF

    PT740 AB

    Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
    Contextual Info: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		March/2001 standard-856-8650 PT740 AB PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311 PDF

    ssop300mil10

    Abstract: SSOP-300mil JEDEC TRAY DIMENSIONS SOP JEDEC tray
    Contextual Info: UNIT : mm PPE 7 HEAT PROOF 114.75 NEC 135° MAX. A' 8.4 10.58 12.75 SSOP300MIL10 9.6 14.75 10.00 295.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 9.6 7.62 135.9 10x21=210 A Applied Package Quantity (pcs) 30-pin • Plastic Shrink SOP (300mil)(1.2mm thick)


    Original     		SSOP300MIL10 30-pin 300mil) ssop300mil10 SSOP-300mil JEDEC TRAY DIMENSIONS SOP JEDEC tray PDF

    tray matrix bga

    Abstract: tray datasheet bga BGA package tray JEDEC tray standard for PLCC CERAMIC PIN GRID ARRAY CPGA AMD PLCC JEDEC tray V Box codes
    Contextual Info: u Chapter 1 Codes and Carrier Options CHAPTER 1 CODES AND CARRIER OPTIONS Revision Status Product Carrier Options Package Codes Product Date Codes Packages and Packing Publication Revision A 3/1/03 1-1 u Chapter 1 Codes and Carrier Options REVISION STATUS


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