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    IGC114T170S8RM Search Results

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    IGC114T170S8RM Price and Stock

    Infineon Technologies AG IGC114T170S8RMX1SA2

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC114T170S8RMX1SA2)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas () IGC114T170S8RMX1SA2 Waffle Pack 2,025
    • 1 -
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    • 10000 $15.93914
    		Buy Now
    IGC114T170S8RMX1SA2 Waffle Pack 111 Weeks 2,025
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $15.93914
    		Buy Now
    IGC114T170S8RMX1SA2 Waffle Pack 111 Weeks 2,025
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $15.93914
    		Buy Now

    IGC114T170S8RM Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    soft solder die bonding

    Contextual Info: IGC114T170S8RM IGBT3 Power Chip Features: • 1700V Trench + Field stop technology • low switching losses • soft turn off • positive temperature coefficient • easy paralleling Chip Type VCE IC IGC114T170S8RM 1700V 100A This chip is used for: • power modules


    Original     		IGC114T170S8RM IGC114T170S8RM L7783O, soft solder die bonding PDF

    Contextual Info: IGC114T170S8RM IGBT3 Power Chip Features: • 1700V Trench + Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling Chip Type VCE IC IGC114T170S8RM 1700V 100A This chip is used for:  power modules


    Original     		IGC114T170S8RM IGC114T170S8RM L7783O, L7783T, L7783E, PDF