IC53 Search Results

Contextual Info: LCC IC51/IC53 Series ORDERING PROCEDURE IC53-016 4-082 I ! _ CHARACTERISTICS_ Insulation Resistance Withstanding Voltage Contact Resistance Contact Force Operating Temperature Design Number No. of Sides with Contacts Number of Leads_ Socket Series

Contextual Info: LCC IC51/IC53 Series ORDERING PROCEDURE IC53-016 4-082 I CHARACTERISTICS_ Insulation Resistance Withstanding Voltage Contact Resistance Contact Force Operating Tempterature I Design Number | |_ No. of Sides with Contacts i_ _ Number of Pins_

Contextual Info: IC53-5A Diodes Varactor Diode Military/High-RelN Ct{Cj} Nom. F Junction Cap.3.3p‘ C1/C2 Min. Capacitance Ratio4.3 V(RRM)(V) Rep.Pk.Rev. Voltage50 Q Factor Min.50 f(co) Min. (Hz) Cut-off freq. P(D) Max. (W)500m Semiconductor MaterialSilicon Package StyleSIP

Contextual Info: QFP, PQFP, & LCC IC51/IC53 Series FEATURES • Any kind of SMT type or IC package type SOP & QFP Available. • High reliability, durability and temperature range. • Custom made also available for high pin count and fine-pitch packages. CHARACTERISTICS

IC53-0324-069

Abstract: Yamaichi Electronics IC53-0484-100 ic53-0284 IC53-0204-184 IC53-0324-065 ic53 IC53-0284-095 IC53-0284-096 ic 1105 socket Yamaichi ic51
Contextual Info: IC53 / IC51 - Lid Type Leadless Chip Carrier LCC Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: Part Number (Details) IC53 - 016 4 - 082 1,000M Ω min. at 500V DC

Contextual Info: SOP, SSOP & TSOP IC51 & IC53 Series CHARACTERISTICS Insulation Resistance Withstanding Voltage Bellow 0.5mm Pitch Contact Resistance Operating Temp. Range Typical Life 1.000MQ min. at 500 VDC 700V AC for one minute 500V AC for one minute 30mQ at 10mA/20mV

Contextual Info: IC533-10C Diodes Varactor Diode Military/High-RelN Ct{Cj} Nom. F Junction Cap.33p‘ C1/C2 Min. Capacitance Ratio4.6 V(RRM)(V) Rep.Pk.Rev. Voltage50 Q Factor Min.100 f(co) Min. (Hz) Cut-off freq. P(D) Max. (W)500m Semiconductor MaterialSilicon Package StyleSIP

IC51-0082-1024

Contextual Info: SOP, SSOP & TSOP CHARACTERISTICS Insulation Resistance Withstanding Voltage Bellow 0.5mm Pitch Contact Resistance Operating Temp. Range Typical Life MATERIAL Insulator Contact Contact IC51&IC53 Series 1,OOOMO min. at 500 VDC 700V AC for one minute 500V AC for one minute

Contextual Info: QFP, PQFP, & TQFP IC51/IC53 Series FEATURES • Any kind of SMT type or IC package type QFP Available. • High reliability, durability and temperature range. • Custom made also available for high pin count and fine-pitch packages. CHARACTERISTICS I n s u la tio n R e s is ta n c e

Yamaichi Electronics IC53-0484-100

Abstract: IC53-0484-100 socket Yamaichi ic53 ic53 IC51-0684-498 IC 2388 IC53-0444-306 Yamaichi IC51 socket
Contextual Info: IC53 / IC51 Series Leadless Chip Carrier LCC Specifications Part Number (Details) IC53 - 044 4 - 306 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m Ω max. at 10m/20mV max. Contact Resistance:

Yamaichi Electronics IC53-0484-100

Abstract: IC53-0484-100 IC53-0284-095 ic53-0284 IC51-0844-846 IC53-0204-184 IC53-0364-296 IC53-0324-065 IC53-0284-096 IC51
Contextual Info: Clamshell / Open Top IC51/53 Series IC53- 016 4- 082 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads No. of Sides With Contacts Insulator: Contact: Plating: Design No. Characteristics 1,000M½minimum at 500 VDC

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods

188es board

Abstract: AMD k86
Contextual Info: A m 186 EM an d A m 188™ EM Advanced Micro Devices High-Performance, 80C186- and 80C188-Compatible, 16-Bit Embedded Microcontrollers DISTINCTIVE CHARACTERISTICS • E86™ fami ly 80C186- and 80C188-com patible m icrocontrollers with enhanced bus interface

DFDH2012T900S

Abstract: LPC 815 LG F11YT1 HAT2180RP G402R P06KE GP03S ara cd 100 39p LPC TPM 0603FT
Contextual Info: 1-fid e n tic i Iw in iie a u Model : F11YT1 R:0 Intel Yonah ULV+Calistoga 945GM+ICH7-M Revision History ORIGINAL RELEASE A B 2006/01/12 Rev:B release. c 2006/03/17 R e v :C release. 2006/03/31 R e v :0 release. PCB STA C K U P LAY1 LAY2 LAY3 LAY4 LAY5

0 280 130 069

Contextual Info: YA MA IC HI E L E C T R O N I C S INC bfiE D • T ì M S S B b 0 0 0 G S5 7 D^b PQFP / TQFP MATCHm oPÁCKm um zü l*KOf fins Body Sue Pitch A B C » IC51-0324-805 IC51-0324-1498 IC51-0444-1195-3 32 32 44 5x5 7X 7 10x10 7.0 9.0 12.6 7.0 9.0 12.6 5.0 7.0 10.0

LTC4098-3.6

Abstract: D313E SXA-01GW-P0.6
Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 A2C !3 A2EC !38 1 4C6C"#$%9C !9E792D36453 8C&&9A29!6 9E73D9'C6DC3 9 9"7C 39!6 9 2' 4C6C"#$%9EC !39*7592D364573 8C&9A29F6 9E73D9'C6DC3 9(9 7C 39F6 9)2'

E43E

Contextual Info: 23456784539A6BCDEF7C699345674F976BCDEF7C6 A2C 3 A2EC 38 12 !4C6C"#$%9C 9E792D364538C&&9A29 69!E73D9'C6DC39 !9"7C39 69 2' !4C6C"#$%9EC  '

Contextual Info: YAMAICHI ELECTRONICS INC bflE D • ‘m S S B b ÜDÜDSBT TtiT ■ MQUAD Part Number IC51-2084-1509 IC51-2404-1655-3 No. of Pins 208 240 Body Size 28x28 32x32 Pitch 03 03 Matching Package Size A B C 28.0 30.6 30.6 34.6 34.6 31.6 D 28.0 31.6 E 29.9 33.7

IC51-0082-1024

Abstract: ic 445 KS 0302 IC51-0302-755 IC51-0162-778 IC-445 IC51 Series IC51-0322-667-2 IC51-0202-1026 IC51-0202-912
Contextual Info: SOPP , SSOPP , TSOPP IC51 Series IC51- 028 2- 334-1 * Socket Series Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: No. of Leads No. of Sides with Contact Design No. Material PES / PEI Glass Filled Beryllium Copper

IC51-128

Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
Contextual Info: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Contextual Info: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)

Contextual Info: Receptacles Design Rules Part Number Ordering Procedure Acceptable Socket 51- 1004818- * 1 * 0 Terminal Length Socket Series Code Minimum Pin Length: Maximum Pin Length: Material Socket Contact Type Insulator: Inner Contact: Insulator Plate Thickness Outer Sleeve:

IC5359

Abstract: DS7060 IC5343 1C5367 IC5373 1C5335 1C5336 1C5337 1C5338 1C5339
Contextual Info: o I Zener ZENER + REGULATOR DIODE @ For Use in Compact and High Performance ~ Up to 180 Watt Surge Rating and Cathode and Thermosonic *t\ CHIPS Circuits @ 8.3 ms @ Silicon-Oxide-Passivated Junctions Environmental Conditions 9 Anode I chips for Resistance Metallization

m5241

Contextual Info: MITSUBISHI SOUND PROCESSOR ICs M5206P _ LINEAR CONTROL DUAL VCA 1C DESCRIPTION The M5206P has 2 channels of built-in linear controlled VCA Voltage controlled amplifier . These channels can be controlled independently. The ICs applications include radio cassette tape recorders, car audio systems, and Hi-Fi