I0118 Search Results
I0118 Price and Stock
DiTom Microwave Inc D4I01181.60 - 1.80 GHZ ISOLATOR |
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DiTom Microwave Inc D3I01181.60 - 1.80 GHZ ISOLATOR |
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DiTom Microwave Inc D4I0118-31.60 - 1.80 GHZ ISOLATOR |
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DiTom Microwave Inc D4I0118-21.60 - 1.80 GHZ ISOLATOR |
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DiTom Microwave Inc D4I0118-11.60 - 1.80 GHZ ISOLATOR |
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I0118 Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: Bulletin I0118J rev. A 05/01 SC275.5. Series SCHOTTKY DIE 275 x 275 mils a 0.35 ± 0.01 14 ± 0.4 c NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). C b d D A Ø 40 (157) 3. DIMENSIONS AND TOLERANCES: a = 6.98 + 0, - 0.01 |
Original |
I0118J SC275. S1025 | |
Contextual Info: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION: |
Original |
I0118J SC275. S1025 SC275R015x5x SC275S020x5x SC275S030x5x | |
S1025
Abstract: sc275s045 s045x5x
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Original |
I0118J SC275. S1025 SC275R015x5x SC275 S020x5x SC275ability, 12-Mar-07 sc275s045 s045x5x | |
Contextual Info: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION: |
Original |
I0118J SC275. S1025 SC275R015x5x SC275S020x5x SC275S030x5x SC275S045x5x SC275S060x5x SC275H045x5x SC275H100x5x | |
sc275s045
Abstract: IRF 830 equivalent S1025
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Original |
I0118J SC275. S1025 sc275s045 IRF 830 equivalent | |
Contextual Info: Bulletin I0118J rev. D 03/07 SC275.5. Series SCHOTTKY DIE 275 x 275 mils 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) |
Original |
I0118J SC275. S1025 SC275R015x5x SC275S020x5x | |
Contextual Info: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION: |
Original |
I0118J SC275. S1025 SC275R015x5x SC275S020x5x SC275S030x5x SC275S045x5x SC275S060x5x SC275H045x5x SC275H100x5x | |
Contextual Info: /^ T SGS-1H0MS0N ^/# lifilDWilLieTOiDtgi M48Z59 CMOS 8K x 8 ZEROPOWER SRAM • INTEGRATED ULTRA LOW POWER SRAM, POWER-FAIL CONTROL CIRCUIT and BATTERY ■ MICROPROCESSOR POWER-ON RESET V&lid all the way to V cc = Vss ■ AUTOMATIC PO\AER-FAIL CHIP DESELECTand |
OCR Scan |
M48Z59 M48Z59 M48Z59Y: | |
ISPVM embedded
Abstract: post card schematic with ispgal Supercool TQFP-100 footprint matrix converting circuit VHDL or CPLD code low pass Filter VHDL code microcontroller using vhdl ISPVM ieee 1532 ispPAC80
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Original |
240VA 750kHz I0117 ISPVM embedded post card schematic with ispgal Supercool TQFP-100 footprint matrix converting circuit VHDL or CPLD code low pass Filter VHDL code microcontroller using vhdl ISPVM ieee 1532 ispPAC80 | |
EX-75
Abstract: trompeter TAI-123 bj249 6M225
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OCR Scan |
PL220 CJ220 PL240 CJ240 BJ226 BJ229 BJ246 BJ249 UPL220 UPL240 EX-75 trompeter TAI-123 bj249 6M225 |