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    Broadcom Limited HPND-0002

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    HPND0002 Datasheets (3)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    HPND-0002 Agilent Technologies Chip PIN diodes for hybrid assemblies Original PDF
    HPND-0002 Avago Technologies Chip PIN diodes for hybrid assemblies Original PDF
    HPND0002 Unknown Historical semiconductor price guide (US$ - 1998). From our catalog scanning project. Historical PDF

    HPND0002 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    integrated circuits equivalents list

    Abstract: digital phase shifters HPND-0002 hydrofluoric acid HPND0002 HSMP3810 5965-9143E eutectic
    Text: HPND-0002 Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Data Sheet Description Features These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression bonding techniques. The top metallization


    Original     		PDF HPND-0002 5965-9143E AV01-0640EN integrated circuits equivalents list digital phase shifters HPND-0002 hydrofluoric acid HPND0002 HSMP3810 5965-9143E eutectic

    ku-band pll lnb

    Abstract: MGA-68563 mga-62563 MMIC SOT 363 HP 5082-3081 ATF-36077 5Ghz lna transistor datasheet schottky diode 3 lead ATF-511P8 power fet 70 mil micro-X Package
    Text: Semiconductor Wireless Applications and Selection Guides System Block Diagrams and Product Suggestions System Block Diagrams and Suggested Products 3 Wireless Infrastructure 3 • Basestation Radiocard 5 • Basestation Low Noise Amplifier LNA 5 • Basestation Tower Mounted Amplifier (TMA)


    Original     		PDF 11a/b/g AV00-0061EN AV00-0116EN ku-band pll lnb MGA-68563 mga-62563 MMIC SOT 363 HP 5082-3081 ATF-36077 5Ghz lna transistor datasheet schottky diode 3 lead ATF-511P8 power fet 70 mil micro-X Package

    Untitled

    Abstract: No abstract text available
    Text: PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, which make each more suitable for a particular application. For switching, attenuating, and other general purpose applications particularly in the VHF/UHF range,


    Original     		PDF OT-23 HPND-4005 HPND-4028 HPND-4038

    IAM-81008

    Abstract: 5082-2830 HSMP-3895 5082-3043 ina-02170 INA-01170 30533 5082-0012 5082-2970 HSMP 2800
    Text: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101


    Original     		PDF 1N5711 1N5712 1N5719 1N5767 MSA-1023 MSA-1100 MSA-1104 MSA-1105 MSA-1110 VTO-9068 IAM-81008 5082-2830 HSMP-3895 5082-3043 ina-02170 INA-01170 30533 5082-0012 5082-2970 HSMP 2800

    ISDB-t modulator

    Abstract: ku-band pll lnb HP 5082-3081 MMIC SOT 363 power fet 70 mil micro-X Package VCO 9GHZ 10GHZ MGA-30116 mga-62563 mga 51563 MGA-30316
    Text: Semiconductor Wireless Applications and Selection Guides System Block Diagrams and Product Suggestions System Block Diagrams and Suggested Products 3 Wireless Infrastructure 3 • Basestation Radiocard 5 • Basestation Low Noise Amplifier LNA 5 • Basestation Tower Mounted Amplifier (TMA)


    Original     		PDF 11a/b/g AV00-0116EN AV00-0141EN ISDB-t modulator ku-band pll lnb HP 5082-3081 MMIC SOT 363 power fet 70 mil micro-X Package VCO 9GHZ 10GHZ MGA-30116 mga-62563 mga 51563 MGA-30316

    5082-3077

    Abstract: 1N5767 2101 5082-3081 glass 1N5719 HPND-0001 HPND-0002 5082-3039 5082-3188
    Text: RF Non-Surface Mount PIN Diodes Glass Axial Lead, Beam Lead, Chip, Stripline Part Number CT Max. pF 5082-3001 5082-3039 1N5719 5082-3077 5082-3188 5082-3080 1N5767 5082-3379 5082-3081 HPND-0001 HPND-0002 0.25 0.25 0.3 0.3 1 0.4 0.4 0.4 0.4 0.2 0.2 RS Max.


    Original     		PDF 1N5719 1N5767 HPND-0001 HPND-0002 5082-3077 1N5767 2101 5082-3081 glass 1N5719 HPND-0001 HPND-0002 5082-3039 5082-3188

    5082-2830

    Abstract: IAM-81008 HSMP-3895 hsms-2850 5082-0012 8205 datasheet hsms-285b HSMS-285C HSMS-2862 MSA-0870
    Text: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101


    Original     		PDF 1N5711 1N5712 1N5719 1N5767 MSA-1023 MSA-1100 MSA-1104 MSA-1105 MSA-1110 VTO-9068 5082-2830 IAM-81008 HSMP-3895 hsms-2850 5082-0012 8205 datasheet hsms-285b HSMS-285C HSMS-2862 MSA-0870

    LNA ku-band

    Abstract: ku-band pll lnb AT-64020 microwave transmitter 10GHz MGA-725M4 micro-X ceramic Package lna fet gaas fet 70 mil micro-X Package HSMS-2850 HSCH-9401 900-1700MHz
    Text: Semiconductor Wireless Applications and Selection Guides System Block Diagrams and Product Suggestions Wireless Infrastructure 2 Basestation Radiocard 2 Basestation Low Noise Amplifier LNA 3 Basestation Tower Mounted Amplifier (TMA) 3 Basestation Multi-carrier Power Amplifier (MCPA)


    Original     		PDF 11a/b/g) 5988-9866EN LNA ku-band ku-band pll lnb AT-64020 microwave transmitter 10GHz MGA-725M4 micro-X ceramic Package lna fet gaas fet 70 mil micro-X Package HSMS-2850 HSCH-9401 900-1700MHz

    HSMP-38xx

    Abstract: diode hsmp 382 HPND-0002
    Text: Surface Mount PIN Diodes Reliability Data HPND-00XX HSMP-38XA HSMP-38XX HSMP-48XX latest revision of MIL-STD-750. Data was gathered from the product qualification, reliability monitor, and engineering evaluation. Description The following cumulative test results have been obtained from


    Original     		PDF HPND-00XX HSMP-38XA HSMP-38XX HSMP-48XX MIL-STD-750. MIL-STD-202, DOD-HDBK-1686 HPND-0002 HSMP-381X HSMP-381A HSMP-38xx diode hsmp 382 HPND-0002

    hydrofluoric acid

    Abstract: HPND0001 HPND-0001 HPND-0002 thermocompression
    Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression


    Original     		PDF HPND-0001 HPND-0002 HPND-000X hydrofluoric acid HPND0001 HPND-0001 HPND-0002 thermocompression

    5082-3043

    Abstract: diode 5082-3080 HPND-4038 5082-0012 diode 5082-3042 HPND-4018 1N5719 1N5767 HPND-0001 HPND-0002
    Text: PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, which make each more suitable for a particular application. For switching, attenuating, and other general purpose applications particularly in the VHF/UHF range,


    Original     		PDF OT-23 5082-3043 diode 5082-3080 HPND-4038 5082-0012 diode 5082-3042 HPND-4018 1N5719 1N5767 HPND-0001 HPND-0002

    hydrofluoric acid

    Abstract: thermocompression HPND0001 HPND-0001 HPND-0002
    Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression


    Original     		PDF HPND-0001 HPND-0002 HPND-000X 5965-9143E hydrofluoric acid thermocompression HPND0001 HPND-0001 HPND-0002

    HSCH-5337

    Abstract: HSMS-2850 5082-3188 HSMP-3804 ifd 0512 5082-2970 5082-2800 SERIES DATASHEET 5082-2830 AT-41470 HSCH-9301
    Text: Alphanumeric Index 1N5711 . 3-52 1N5712 . 3-52 1N5719 . 2-101 1N5767 . 2-101


    Original     		PDF 1N5711 1N5712 1N5719 1N5767 MSA-1023 MSA-1100 MSA-1104 MSA-1105 MSA-1110 VTO-9068 HSCH-5337 HSMS-2850 5082-3188 HSMP-3804 ifd 0512 5082-2970 5082-2800 SERIES DATASHEET 5082-2830 AT-41470 HSCH-9301

    hp 3080 diode

    Abstract: No abstract text available
    Text: Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ Thermosonically Bondable These PIN/NIP diode chips are specifically designed for hybrid applications requiring thermosonic or thermocompression


    Original     		PDF HPND-0001 HPND-0002 HPND-000X 5965-9143E hp 3080 diode

    Untitled

    Abstract: No abstract text available
    Text: • 4 M M 7 5 Ô 4 G D O T b ñ ? OTO ■ H P A HEWLETT-PACKARD/ CMPNTS blE D m HEW LETT PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 Features • Thermocompression/ Thermosonically Bondable


    OCR Scan     		PDF HPND-0001 HPND-0002 HPND-0003 HPND000X

    Untitled

    Abstract: No abstract text available
    Text: Wljm SMALL SIGNAL RF PIN DIODE CHIPS FOR HYBRID INTEGRATED CIRCUITS HEW LETT PACKARD wLEM HPND-0001 HPND-0002 HPND-0003 T E C H N IC A L DATA M ARCH 1988 Features THERMOCOMPRESSION/THERMOSONICALLY BON DAB LE IDEAL FOR HYBRID INTEGRATED CIRCUITS GOLD METALLIZATION


    OCR Scan     		PDF HPND-0001 HPND-0002 HPND-0003

    Untitled

    Abstract: No abstract text available
    Text: W ß%H EW L E T T 1“KM PA CK A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features Description • Thermocompression/ ThermosonicaUy Bondable These PIN/NIP diode chips are specifically designed for hybrid


    OCR Scan     		PDF HPND-0001 HPND-0002 HPND-000X

    HPND0003

    Abstract: HPND-0003
    Text: W fipi H E W LE T T mL'HM P A C K A R D Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 HPND-0003 F eatures • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization


    OCR Scan     		PDF HPND-0001 HPND-0002 HPND-0003 HPND000X HPND0003 HPND-0003

    HRMA-0470B

    Abstract: Semicon volume 1 HPMA-2085 HP 33002A AVANTEK ATF26884 SJ 2036 HPMA-0470TXV HPMA-0485 HPMA-0370 DIODE GOC 61
    Text: Whal HEWLETT \HrJk PACKARD Communications Components Designer’s Catalog, GaAs and Silicon Products A Brief Sketch Hewlett-Packard is one of the world’s leading designers and manufacturers of RF and microwave semiconductors, optoelectronic, and fiber optic


    OCR Scan     		PDF E-28230 S-164 CH-8902 HRMA-0470B Semicon volume 1 HPMA-2085 HP 33002A AVANTEK ATF26884 SJ 2036 HPMA-0470TXV HPMA-0485 HPMA-0370 DIODE GOC 61

    HSMP3811

    Abstract: sot-23 MARKING CODE G1 HSMP3821 HSMP-3801 HSMP3831 HSMP3881 HSMP-3811 hsmp-3831 hsmp3801 HSMP-3881
    Text: Surface Mount PIN Diodes Available Configurations SOT-23 DIE APPLICATION GUSS SINGLE SINGLE SERIES COMMON ANODE b R B / o HPNWXJ01 HPND-0002 HPND-0003 5082-0012 tr 'a S' X - ll XX ht-ir là ' COMMON CATHODE LOW LOW INDUCTANCE INDUCTANCE B a Il XX '- á -Ir 1


    OCR Scan     		PDF OT-23 HPNWXJ01 HSMP-3802 HSMP-3812 HSMP-3800 HSMP-3801 HSMP-3810 HSMP-3811 HSMP-3820 HSMP-3821 HSMP3811 sot-23 MARKING CODE G1 HSMP3821 HSMP3831 HSMP3881 hsmp-3831 hsmp3801 HSMP-3881

    Untitled

    Abstract: No abstract text available
    Text: What H E W L E T T * mLliM PACKARD Small Signal RF PIN Diode Chips for Hybrid Integrated Circuits Technical Data HPND-0001 HPND-0002 Features D escription • Thermocompression/ Thermosonically Bondable • Ideal for Hybrid Integrated Circuits • Gold Metallization


    OCR Scan     		PDF HPND-0001 HPND-0002 HPND-000X

    hsmp-3800

    Abstract: HPND-0003
    Text: Whp% mL'EM HEWLETT PACKARD Surface Mount PIN Diodes R eliability D ata The following cumulative test results have been obtained from testing performed at HewlettPackard Communications Com­ ponents Division in accordance with the latest revision of MIL- HPND-OOOX Series


    OCR Scan     		PDF HSMP-3800 HSMP-3810 HSMP-3820 HSMP-3830 STD-750. MIL-STD-750 MIL-STD-202, DOD-HDBK-1686A HPND-0003, HPND-0003

    1N5767

    Abstract: No abstract text available
    Text: Wha% HEW LETT mitíM P A C K A R D PIN Diode Selection Guides Hewlett-Packard PIN diodes are available in chip form and several types of packages, w hich make each more suitable for a particular application. For switching, attenuating, and other general purpose applications


    OCR Scan     		PDF OT-23 400P1 1N5767