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    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HLQFP256: plastic thermal enhanced low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm; exposed die pad SOT1128-1 c exposed die pad y X Dh 192 ZE 129 193 A 128 e bp Eh D w HE A A2 A3 A1 θ Lp detail X L pin 1 index 256 65 1 64 e


    Original     		HLQFP256: OT1128-1 MS-026 sot1128-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HLQFP256 package SOT1128-1 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


    Original     		HLQFP256 OT1128-1 PDF