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    "thermal via" PCB D2PAK

    Abstract: JESD24-3 "thermal via" PCB D-PAK so8 pcb pattern double sided pcb, thermal via powersi so8 footprint AN-994 thermal PCB D2PAK IRF3706S
    Text: Evaluation of Power MOSFET Thermal Solutions for Desktop and Mobile Processor Power Tim McDonald and John Ambrus International Rectifier Corporation 233 Kansas Street El Segundo, CA 90245 USA Tmcdona1@irf.com, jambrus1@irf.com as presented at PCIM China, March 2002


    Original     		PDF HFPC2001 AN-994, JESD24-3, "thermal via" PCB D2PAK JESD24-3 "thermal via" PCB D-PAK so8 pcb pattern double sided pcb, thermal via powersi so8 footprint AN-994 thermal PCB D2PAK IRF3706S