HBCC32 Search Results

Contextual Info: Package outline HBCC32: plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm x B D b1 SOT560-1 v M C A B w M C ball A1 index area v M C A B w M C b b3 E b2 v M C A B w M C v M C A B w M C detail X x C A e1 B e C y v A e2 E1 e4 1

sot560

Abstract: HBCC32 MO217
Contextual Info: PDF: 1999 Sep 10 Philips Semiconductors Package outline HBCC32: plastic, heatsink bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm SOT560-1 x B D pin 1 index area b1 w M w M b b3 E w M b2 w M detail X x C A e1 B e y v A C E1 e4 e2 1 32 A1 X D1 A2 e3

Contextual Info: PDF: 2003 Jun 19 Philips Semiconductors PC board footprint HBCC32; SOT560-1 FOOTPRINT REFLOW SOLDERING handbook, full pagewidth PA = OA = 5.40 (2x) 3.05 (2×) 2.55 (2×) 1.275 (2×) solder lands solder resist 0.075 clearance 0.50 (24×) 0.150 solder paste

MO-217

Abstract: 132A-1
Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline HBCC32: plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm x B D b1 SOT560-1 v M C A B w M C ball A1 index area v M C A B w M C b b3 E v M C A B w M C b2 v M C A B w M C

5.1 B2

Contextual Info: PDF: 2000 Feb 02 Philips Semiconductors Package outline HBCC32: plastic, heatsink bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm SOT560-1 x B D b1 w M w M ball A1 index area b b3 E w M b2 w M detail X x C A e1 B e y v A C E1 e4 e2 1 32 A1 X D1 A2

LPC2148 i2c

Abstract: BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent
Contextual Info: Building blocks for vibrant media Highlights of the NXP product portfolio Building blocks for vibrant media  At NXP Semiconductors, the new company founded by Philips, we’re driven by a single purpose — to deliver vibrant media technologies that create better sensory experiences.

R114426

Abstract: BLM11P300S dipsw_4 232270296001 433003036301 Philips 2322-702-96001 BLM11P300 AN99071 STM16 TP97036
Contextual Info: APPLICATION NOTE OM5808 demoboard negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN99071 TP97036.2/F5.5 Philips Semiconductors OM5808 demoboard negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN99071 Abstract

702 TRANSISTOR smd

Abstract: SIEMENS AVR GENERATOR fire alarm abstract using thermistor and op-amp Phycomp 2238 Laser power supply abstract 2238 916 15636 3006p 205 Variable Resistor 2238-787-15636 phycomp 2322-702-60102 capacitor 0402 X7R 100NF 50V 10
Contextual Info: APPLICATION NOTE OM5811 minidil demo board for TZA3010/11/47 laser drivers covering 30-3200 Mb/s AN10191-01 TP97036.2/F5.5 Philips Semiconductors OM5811 minidil demo board for TZA3010/11/47 laser drivers covering 30-3200 Mb/s Application Note AN10191-01 Abstract

R114426

Abstract: BLM11P300S 3006P 201 PHILIPS 433003036301 Philips 2322-702-96001 433003036301 dipsw_4 HLMP6500-011 siemens c45 Stocko R5
Contextual Info: APPLICATION NOTE OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN01023 TP97036.2/F5.5 Philips Semiconductors OM5809 demo board positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN01023 Abstract

BGE788

Abstract: Datahandbook HBCC32 TRANSIMPEDANCE mmic laser BGR269 BGS67A BGY585A BGY587 BGY587B BGY588N
Contextual Info: Semiconductors Product Portfolio RF Access Systems CATV RF Hybrid Amplifiers * Type Number Description Reverse Hybrids BGS67A 65 MHz, 25.5 dB gain Reverse Amplifier, 12 V BGY68 75 MHz, 30 dB gain Reverse Amplifier BGY66B 120 MHz, 25 dB gain Reverse Amplifier

BF1201A

Abstract: bf1211 dual gate mosfet bfq34 application note SA636 BFG480W BF862 AM LNA BFR10 SA676 Reliability SA612A SA614A
Contextual Info: RF Products RF Products 241 RF Access Systems CATV RF Hybrid Amplifiers Type Number Description Frequency Range Gain dB Slope (dB) FL S11/S22 CTB XMOD CSO @Ch @Vo (dBmV) F @fmax Itot (mA) BGS67A 65 MHz, 25.5 dB gain Reverse Amplifier, 12 V 5 - 65 25 - 26

tcxo philips 4322

Abstract: philips tcxo 4322 190 ISO9001-Certified philips bfq32 philips bare die datasheet 2SK170BL ON4749 philips BFG196 S8740230 toshiba fet databook 2sk162 hitachi
Contextual Info: RF Manual 5th edition Product and design manual for RF Products October 2004 Semiconductors RF Manual Philips Semiconductors 5th edition Product and design manual for RF Products  Koninklijke Philips Electronics N.V. 2004 All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The

JESD51-5

Abstract: JESD51-7 TZA3010B TZA3010BVH soft ferrite handbook
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TZA3010B 30 Mbits/s up to 3.2 Gbits/s laser driver Preliminary specification File under Integrated Circuits, IC19 2001 Nov 16 Philips Semiconductors Preliminary specification 30 Mbits/s up to 3.2 Gbits/s laser driver TZA3010B

HTQFP100

Abstract: LQFP48 HBCC32 DB4042 CGY2110 TZA3001 TZA3013 TZA3023 TZA3031 TZA3033
Contextual Info: MSD818 Philips Semiconductors Input Fiber Optic Interface ICs Line Card Part number Datarate Mb/s Package Type Bare Die TRANSIMPEDANCE AMPLIFIERS TZA3033 TZA3023 TZA3043 TZA3013 CGY2102 CGY2110 CGY2140 155 622 1250 2488 3250 10700 39813 SO8 SO8 SO8 HVQFN24

x band receiver

Abstract: BCC32 SA3601
Contextual Info: INTEGRATED CIRCUITS SA3601 Low voltage dual-band RF front-end Preliminary specification Philips Semiconductors 1999 Nov 09 Philips Semiconductors Preliminary specification Low voltage dual-band RF front-end SA3601 DESCRIPTION APPLICATIONS • 800 to 1000 MHz analog and digital receivers

2.4 ghz FM TRANSMITTER CIRCUIT DIAGRAM

Abstract: BCC32 SA9502 SA9503 pcs-2
Contextual Info: INTEGRATED CIRCUITS SA9503 Dual-band, CDMA/AMPS LNA and downconverter mixers Objective specification Supersedes data of 1999 Jul 06 Philips Semiconductors 1999 Jul 29 Philips Semiconductors Objective specification Dual-band, CDMA/AMPS LNA and downconverter mixers

Contextual Info: INTEGRATED CIRCUITS DATA SHEET TZA3011A; TZA3011B 30 Mbits/s up to 3.2 Gbits/s laser drivers Objective specification File under Integrated Circuits, IC19 2001 Jan 29 Philips Semiconductors Objective specification 30 Mbits/s up to 3.2 Gbits/s laser drivers

8b 10b m-phy

Abstract: cgy2141 LQFP32 LQFP48 QFP64 TSSOP16 TZA3014 TZA3034 TZA3044 BARE die
Contextual Info: Chip sets for optical networking Delivering the broadband revolution Introduction: As a result of the Internet revolution in communications infrastructure the demand for data transmission bandwidth is expanding tenfold each year. Fiber optic transmission is the

HVQFN20

Abstract: BGD502 BGR269 BGS67A BGY585A BGY587 BGY587B BGY588N BGY66B BGY67
Contextual Info: Semiconductors Product Portfolio RF Access Systems CATV RF Hybrid Amplifiers * Type Number Reverse Hybrids BGS67A BGY68 BGY66B BGY67 BGY67A BGR269 40 - 550MHz Push-Pulls BGY585A BGY587 BGY587B BGY588N 40 - 550 MHz Power Doubler BGD502 40 - 600MHz Push-Pulls

SA3601

Abstract: SA3601W
Contextual Info: INTEGRATED CIRCUITS SA3601 Low voltage dual-band RF front-end Product specification Supersedes data of 1999 Nov 09 Philips Semiconductors 2001 Feb 20 Philips Semiconductors Product specification Low voltage dual-band RF front-end SA3601 DESCRIPTION APPLICATIONS

JESD51-5

Abstract: JESD51-7 TZA3010B TZA3010BVH AVR IC Laser diode temperature
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TZA3010B 30 Mbits/s up to 3.2 Gbits/s A-rate laser driver Product specification Supersedes data of 2001 Nov 16 2003 Apr 07 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rate laser driver TZA3010B

B45196

Abstract: BLM11P300S dipsw_4 OC48 STM16 TP97036 TZA3014 TZA3019 PHILIPS 433003036301 philips c3
Contextual Info: APPLICATION NOTE OM5808 demo board negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN01022 TP97036.2/F5.5 Philips Semiconductors OM5808 demo board negative supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN01022 Abstract

2222916

Abstract: B45196H1107M9 AN99072 OC48 STM16 TP97036 TZA3014 TZA3019 TZA3019A AN9907
Contextual Info: APPLICATION NOTE OM5809 demoboard positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package AN99072 TP97036.2/F5.5 Philips Semiconductors OM5809 demoboard positive supply for 2.5 Gb/s TZA3014 / TZA3019 with HBCC package Application Note AN99072 Abstract

MGT028

Abstract: TZA3019 TZA3019AHT TZA3019AVH TZA3019BHT TZA3019BVH TZA3019CHT TZA3019CVH
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TZA3019 2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch Product specification Supersedes data of 2000 Apr 10 File under Integrated Circuits, IC19 2001 Jun 25 Philips Semiconductors Product specification