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    GS881E18C Search Results

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    GS881E18C Price and Stock

    GSI Technology GS881E18CGD-200I

    SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 6.5ns/3ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CGD-200I)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas GS881E18CGD-200I Tray 144
    • 1 -
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    • 100 -
    • 1000 $11.61
    • 10000 $11.223
    Buy Now

    GSI Technology GS881E18CGD-200IV

    SRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 6.5ns/3ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CGD-200IV)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas GS881E18CGD-200IV Tray 24 Weeks 144
    • 1 -
    • 10 -
    • 100 -
    • 1000 $25.38
    • 10000 $24.534
    Buy Now

    GSI Technology GS881E18CGT-333

    SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 4.5ns/2.5ns 100-Pin TQFP Tray - Trays (Alt: GS881E18CGT-333)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas GS881E18CGT-333 Tray 24 Weeks 72
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    • 100 $25.74
    • 1000 $22.62
    • 10000 $22.62
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    GSI Technology GS881E18CGD-200V

    SRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 6.5ns/3ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CGD-200V)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas GS881E18CGD-200V Tray 24 Weeks 144
    • 1 -
    • 10 -
    • 100 -
    • 1000 $22.68
    • 10000 $21.924
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    GSI Technology GS881E18CD-200IV

    SRAM Chip Sync Dual 1.8V/2.5V 9M-Bit 512K x 18 6.5ns/3ns 165-Pin FBGA Tray - Trays (Alt: GS881E18CD-200IV)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas GS881E18CD-200IV Tray 24 Weeks 144
    • 1 -
    • 10 -
    • 100 -
    • 1000 $25.38
    • 10000 $24.534
    Buy Now

    GS881E18C Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: GS881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline


    Original
    PDF GS881E18C /GS881E32C /GS881E36C 100-Pin 165-bump supply881E18C 100-lead

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline


    Original
    PDF GS881E18C /GS881E32C /GS881E36C 100-Pin 165-bump supply881E18C 100-lead

    Untitled

    Abstract: No abstract text available
    Text: GS881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline


    Original
    PDF GS881E18C /GS881E32C /GS881E36C 100-Pin 165-bump supply881E18C 881E18C

    Untitled

    Abstract: No abstract text available
    Text: GS881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline


    Original
    PDF GS881E18C /GS881E32C /GS881E36C 100-Pin 165-bump supply881E18C 881E18C

    Untitled

    Abstract: No abstract text available
    Text: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation


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    PDF GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC

    Untitled

    Abstract: No abstract text available
    Text: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation


    Original
    PDF GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC

    Untitled

    Abstract: No abstract text available
    Text: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline


    Original
    PDF GS881E18/32/36C 100-Pin 165-bump

    Untitled

    Abstract: No abstract text available
    Text: GS881E18/32/36C T/D -xxx 100-Pin TQFP & 165-bump BGA Commercial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation


    Original
    PDF GS881E18/32/36C 100-Pin 165-bump supply881E18C 100-lead 881E18C

    Untitled

    Abstract: No abstract text available
    Text: GS881E18/32/36C T/D -xxxIV 100-Pin TQFP & 165-bump BGA Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan


    Original
    PDF GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC

    Untitled

    Abstract: No abstract text available
    Text: GS881E18/32/36C T/D -xxxI 100-Pin TQFP & 165-bump BGA Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation


    Original
    PDF GS881E18/32/36C 100-Pin 165-bump supply881E18C 100-lead 881E18C

    Untitled

    Abstract: No abstract text available
    Text: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation


    Original
    PDF GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC

    Untitled

    Abstract: No abstract text available
    Text: GS881E18/32/36C T/D -xxxV 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs D es ig n Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin (Pin 14). Holding the FT mode


    Original
    PDF GS881E18/32/36C 100-Pin 165-bump 100-lead

    Untitled

    Abstract: No abstract text available
    Text: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan


    Original
    PDF GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline


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    PDF GS881E18/32/36C 100-Pin 165-bump 100-lead 881ExxC

    GS8640Z36

    Abstract: GS840Z18A GS816032 GS8342T36 GS8662Q18
    Text: Untitled3.fm Page 1 Wednesday, September 10, 2008 12:03 PM toc.fm Page 1 Wednesday, September 10, 2008 11:05 AM Untitled1.fm Page 1 Wednesday, September 10, 2008 11:32 AM SigmaQuad_new_20080904.fm Page 4 Wednesday, September 10, 2008 11:04 AM SigmaQuad/ CIO/SIO


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    PDF 144Mb GS81302D37yy-# GS81302D19yy-# GS81302D36yy-# GS81302D18yy-# GS81302D09yy-# GS81302D08yy-# GS8640Z36 GS840Z18A GS816032 GS8342T36 GS8662Q18