GS816218A Search Results

Contextual Info: Preliminary GS816218A B/D /GS816236A(B/D)/GS816272A(C) MHz–200 MHz 1M x 18, 512K x 36, 256K x 72 300 1.8 V or 2.5 V VDD 18Mb S/DCD Sync Burst SRAMs 1.8 V or 2.5 V I/O 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation

13007 h3

Abstract: passing H7 K744 gw 340 13007 h4
Contextual Info: Preliminary GS816218A B/D /GS816236A(B/D)/GS816272A(C) MHz–200 MHz 1M x 18, 512K x 36, 256K x 72 300 1.8 V or 2.5 V VDD 18Mb S/DCD Sync Burst SRAMs 1.8 V or 2.5 V I/O 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation

GS816218AB-300

Contextual Info: Preliminary GS816218A B/D /GS816236A(B/D)/GS816272A(C) MHz–150 MHz 1M x 18, 512K x 36, 256K x 72 300 2.5 V or 3.3 V VDD 18Mb S/DCD Sync Burst SRAMs 2.5 V or 3.3 V I/O 119-, 165- & 209-Pin BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation

t10-25 u2

Abstract: G2156 f10107
Contextual Info: Preliminary GS816273AC-300/275/250/225/200 300 MHz–200 MHz 256K x 72 1.8 V or 2.5 V VDD 18Mb S/DCD Sync Burst SRAMs 1.8 V or 2.5 V I/O 209-Pin BGA Commercial Temp Industrial Temp Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: Revision: 5/17/02 GS816273AC Datasheet Errata Base datasheet: GS816273AC, Rev.1.00, 3/2002 Product s covered in this supplement: GS816273AC-300/275/250/225/200 Product specification(s) addressed by this supplement: Bump R5 Note: The specifications cited in the base datasheet for the products addressed by this errata remain in force except where