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    GE100L Price and Stock

    INA Bearings GE100-LO

    Spherical Plain Bearing, maintenance-liable, 100mm ID, 150mm OD, 100mm WIDTH | INA Bearings (Schaeffler) GE100-LO
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS GE100-LO Bulk 1
    • 1 $1658.79
    • 10 $1658.79
    • 100 $1658.79
    • 1000 $1658.79
    • 10000 $1658.79
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    AddOn Networks GLC-GE-100LX-AO

    CISCO GLC-GE-100LX COMP TAA SFP LC XCVR
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    NAC GLC-GE-100LX-AO 99 1
    • 1 $182.76
    • 10 $182.76
    • 100 $182.76
    • 1000 $182.76
    • 10000 $182.76
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    Accortec Inc GLC-GE-100LX-ACC

    ACCORTEC CISCO GLC-GE-100LX COMPATIBLE TAA COMPLIANT 100BASE-LX SFPTRANSCEIVER(SMF, 1310NM, 10KM, LC, DOM)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    NAC GLC-GE-100LX-ACC 1
    • 1 -
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    GE100L Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Nitto GE 100

    Abstract: NITTO GE-100 Nitto GE MARK FA
    Text: 11/10/2006 RELIABILITY REPORT FOR DS33R11, Rev A2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		DS33R11, 30C/60% Nitto GE 100 NITTO GE-100 Nitto GE MARK FA PDF

    CCL-HL832NX-A

    Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
    Text: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize


    Original     		CO-029) CCL-HL832NX-A Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832 PDF

    ge100lfcsv

    Abstract: GE100LFCS SPIL mold compound aus308 GE-100LFCS-V HL832NX Ablestik 89HPES12N3AZGBCGI AUS-308 89HPES10T4G2ZBBCG
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-03 Product Affected: DATE: September 10, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 19mm x 19mm CABGA-324 (Standard & Green)


    Original     		A1008-03 CABGA-324 89HPES12N3A2ZCBCI8 89HPES12N3AZCBC 89HPES12N3AZCBCG 89HPES12N3AZCBCI 89HPES12N3AZGBC 89HPES12N3AZGBCG 89HPES12N3AZGBCGI 89HPES12N3AZGBCI ge100lfcsv GE100LFCS SPIL mold compound aus308 GE-100LFCS-V HL832NX Ablestik 89HPES12N3AZGBCGI AUS-308 89HPES10T4G2ZBBCG PDF

    HL832nxa

    Abstract: VPP1552BFG HL832NX-A HL-832NXA HL832NXA-EX GE100LFCS HL832-NX-A HL832 KE1250LKDS HL832NX
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-04 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 26-Jul-2010 15.0mm x 15.0mm x 1.7mm FPBGA-324


    Original     		A1004-04 26-Jul-2010 FPBGA-324 VPP1552BFG VPP1552BFG8 26-Oct-2010 JESD22-A113 LBGA-167 JESD22-A118 JESD22-A104 HL832nxa VPP1552BFG HL832NX-A HL-832NXA HL832NXA-EX GE100LFCS HL832-NX-A HL832 KE1250LKDS HL832NX PDF

    nitto GE

    Abstract: GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-07 Product Affected: DATE: September 17, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 17mm x 17mm TEBGA-580 (Green) Product Mark


    Original     		A1008-07 TEBGA-580 facilitSD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 SXVX-110BHG SXVX-200BHG SXVX-210BHG nitto GE GE-100L SXVX-50BHG nitto GE-100L SXVX-210BHG SXVX-50 HL832NX SXVX-210 Nitto GE 100 HL832HS PDF

    Nitto GE 100

    Abstract: GE-100-LFC nitto GE100LFC NITTO GE-100 MIL-STD-883-2012 ML614R J-STD-020 nitto GE ds12r885-5
    Text: 12/2/2005 RELIABILITY REPORT FOR DS12R887, Rev A2-R0A Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Don Lipps Staff Reliability Engineer Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : don.lipps@dalsemi.com


    Original     		DS12R887, Nitto GE 100 GE-100-LFC nitto GE100LFC NITTO GE-100 MIL-STD-883-2012 ML614R J-STD-020 nitto GE ds12r885-5 PDF

    KE-G1250

    Abstract: AUS308 KE-G1250 mold compound GE100LFCS EME-G770 SSTE32882 2025D GE-100-LFC HL832NX SSTE32882HLBAKG
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0911-02 DATE: 20-Nov-2009 Product Affected: 13.5mm x 8.0mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers


    Original     		A0911-02 20-Nov-2009 FPBGA-176 20-Feb-2010 JESD22-A110-B JESD22-A104-B JESD22-A103-B JESD22-A113 SSTE32882HLBAKG KE-G1250 AUS308 KE-G1250 mold compound GE100LFCS EME-G770 SSTE32882 2025D GE-100-LFC HL832NX SSTE32882HLBAKG PDF

    EME-G770

    Abstract: KE-G1250 AUS308 KE-G1250 mold compound HL832NX GE-100-LFC Ablestik AUS-308 GE100LFCS bt resin HL832NX
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0911-02R1 DATE: 18-Dec-2009 Product Affected: 13.5mm x 8.0mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers


    Original     		A0911-02R1 18-Dec-2009 FPBGA-176 20-Feb-2010 JESD22-A110-B JESD22-A104-B JESD22-A103-B JESD22-A113 SSTE32882HLBAKG EME-G770 KE-G1250 AUS308 KE-G1250 mold compound HL832NX GE-100-LFC Ablestik AUS-308 GE100LFCS bt resin HL832NX PDF

    CV-8710

    Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
    Text:  Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010


    Original     		JIG-101 CV-8710 EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy PDF

    KEG1250LKDS

    Abstract: KE-G1250LKDS KE-G1250TC Ablestik 2025D KE-G1250 SSTE32882 Ablestik 2025D EME-G770 eme-g770lc
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-02 DATE: 3-Jun-2010 Product Affected: 13.5mm x 8.0mm x 1.1mm FPBGA-176 (Green) Refer to Attachment II for the affected part numbers


    Original     		A1004-02 3-Jun-2010 FPBGA-176 3-Sep-2010 JESD22-A118 JESD22-A104 JESD22-A103 JESD22-A113 SSTE32882HLBAKG KEG1250LKDS KE-G1250LKDS KE-G1250TC Ablestik 2025D KE-G1250 SSTE32882 Ablestik 2025D EME-G770 eme-g770lc PDF

    KEG1250LKDS

    Abstract: aus303 KE-G1250LKDS G1250LKDS GE100LFCS KE-G1250 GE-100-LFC HL832NX a1008 JESD22-A103
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-06 Product Affected: DATE: August 27, 2010 82P20516DBFG & 82P20516DBFG8 built in 19mm x 19mm FPBGA-484 Date Effective: November 27, 2010


    Original     		A1008-06 82P20516DBFG 82P20516DBFG8 FPBGA-484 JESD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 82P20416DBFG KEG1250LKDS aus303 KE-G1250LKDS G1250LKDS GE100LFCS KE-G1250 GE-100-LFC HL832NX a1008 JESD22-A103 PDF

    Nitto GE 100

    Abstract: nitto GE J-STD-020 NITTO GE-100 GE-100L
    Text: 10/25/2006 RELIABILITY REPORT FOR DS33R41, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		DS33R41, reliabil48 30C/60% Nitto GE 100 nitto GE J-STD-020 NITTO GE-100 GE-100L PDF

    PCN0712

    Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array


    Original     		PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100 PDF

    Amkor Wafer level mold compound

    Abstract: l2aa CCL-HL-832 JEDEC tray standard 13 SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Ablestik 2300 4-Layer tepbga-2 CO-029
    Text: LAMINATE data sheet PBGA Innovative designs and expanding package offerings provide a platform from prototype-to-production. Features • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm standard ball pitch available other ball pitches available upon request, (e.g. 0.8mm


    Original     		PDF

    EN4900GC

    Abstract: NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG
    Text: PCN No: PCN1-110704 Qualification of selected products at additional assembly and test sites Initial Change Notification Date: 7/04/2011 This is an initial announcement of change to a device that is currently offered by Energy Micro. The details of this change are on the following pages.


    Original     		PCN1-110704 EFM32G890F128 J-STD-020D, JESD22-A113 JESD22-A104 C/125 JESD22-A103 JESD22-A102 JESD22-A110 EN4900GC NC7720 CEL9220HF10 EME-G760L EME-G760 HL832nxa Yizbond Hitachi EN4900GC CEL9220 DS-7409HG PDF

    l2aa

    Abstract: tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound
    Text: LAMINATE data sheet PBGA Features: • Custom ball counts up to 1521 • 1.00, 1.27 & 1.50 mm ball pitch available other ball pitches available upon request • 13 mm to 40 mm body sizes • Thin Au wire (0.5mil or Cu wire compatible • Large mold cap for quality enhancement


    Original     		CO-029) l2aa tepbga-2 CO-029 Amkor mold compound Amkor Wafer level mold compound GE-100L Amkor Technology pbga moisture GE-100-L UM2219 mold compound PDF

    M82172G-13

    Abstract: GE-100L CEL-9750ZHF10AKL CEL9750 M82154G-13 CEL-9750 M82154-13 GE100L M82108G-13 M82152G-13
    Text: October 30, 2009 CN-103009 Customer Notification M821XX Second Source Assembly Site Dear Valued Customer: This notification is for the purpose of informing you of a second assembly site for the products listed below. Purpose To assure long term supply for the M821XX product family, Mindspeed is qualifying a second assembly site at ASE


    Original     		CN-103009 M821XX M82104-13 M82152-13 M82170-13 M82172G-13 M82104G-13 M82152G-13 M82170G-13 M82172G-13 GE-100L CEL-9750ZHF10AKL CEL9750 M82154G-13 CEL-9750 M82154-13 GE100L M82108G-13 M82152G-13 PDF

    GE100LFCS

    Abstract: HL832nxa HL-832NXA HL832NX-A BFG81 Ablestik 2000 aus308 HL832 nx-a AUS-308 JESD22-A110
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-05 DATE: September 24, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 82V2082BFG & 82V2082BFG8 built in 8 mm x 8mm CABGA-81


    Original     		A1008-05 82V2082BFG 82V2082BFG8 CABGA-81 FPBGA-289 JESD22-A110 JESD22-A104 JESD22-A103 JESD22-A113 GE100LFCS HL832nxa HL-832NXA HL832NX-A BFG81 Ablestik 2000 aus308 HL832 nx-a AUS-308 JESD22-A110 PDF