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    FTG256C Search Results

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    FTG256C Price and Stock

    AMD XC3S500E-4FTG256C

    IC FPGA 190 I/O 256FTBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC3S500E-4FTG256C Tray 11,018 1
    • 1 $88.09
    • 10 $88.09
    • 100 $88.09
    • 1000 $88.09
    • 10000 $88.09
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    Avnet Asia XC3S500E-4FTG256C 5 1
    • 1 -
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    EBV Elektronik XC3S500E-4FTG256C 143 Weeks 7
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    AMD XC2C256-7FTG256C

    IC CPLD 256MC 6.7NS 256FTBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC2C256-7FTG256C Tray 3,896 1
    • 1 $50.43
    • 10 $50.43
    • 100 $50.43
    • 1000 $50.43
    • 10000 $50.43
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    Avnet Silica XC2C256-7FTG256C 143 Weeks 12
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    EBV Elektronik XC2C256-7FTG256C 143 Weeks 12
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    AMD XC3S400-4FTG256C

    IC FPGA 173 I/O 256FTBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC3S400-4FTG256C Tray 3,892 1
    • 1 $58.88
    • 10 $58.88
    • 100 $58.88
    • 1000 $58.88
    • 10000 $58.88
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    AMD XC3S200AN-4FTG256C

    IC FPGA 195 I/O 256FTBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC3S200AN-4FTG256C Tray 3,164 1
    • 1 $50.83
    • 10 $50.83
    • 100 $50.83
    • 1000 $50.83
    • 10000 $50.83
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    Avnet Asia XC3S200AN-4FTG256C 5 1
    • 1 -
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    Avnet Silica XC3S200AN-4FTG256C 143 Weeks 1
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    EBV Elektronik XC3S200AN-4FTG256C 143 Weeks 12
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    		Buy Now

    AMD XC3S200-4FTG256C

    IC FPGA 173 I/O 256FTBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC3S200-4FTG256C Tray 2,578 1
    • 1 $55.6
    • 10 $55.6
    • 100 $55.6
    • 1000 $55.6
    • 10000 $55.6
    		Buy Now
    Bristol Electronics XC3S200-4FTG256C 4
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    EBV Elektronik XC3S200-4FTG256C 143 Weeks 11
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    Find more FTG256C price and stock on Findchips.com

    FTG256C Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    BFG95

    Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF