NTLMS4502N
Abstract: No abstract text available
Text: NTLMS4502N Advance Information Power MOSFET 17 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic
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NTLMS4502N
r14525
NTLMS4502N/D
NTLMS4502N
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4392 mosfet
Abstract: No abstract text available
Text: NTLMS4501N Advance Information Power MOSFET 17 A, 30 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic
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NTLMS4501N
r14525
NTLMS4501N/D
4392 mosfet
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ntlms4504n
Abstract: No abstract text available
Text: NTLMS4504N Advance Information Power MOSFET 28 A, 24 V N–Channel SO–8 Leadless The SO–8LL Leadless package uses the power QFN package technology. It’s footprint matches that of the standard SO–8 single die device. This Leadless SO–8 package provides low parasitic
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NTLMS4504N
r14525
NTLMS4504N/D
ntlms4504n
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PA40SO1-OT
Abstract: XXSO1-OT test socket 32 pin Enplas Enplas OTS 36 32 pin test socket footprint dip 40 Enplas 14 pin footprint dip 16 Enplas 28 pin
Text: PAxxSO1-OT Data Sheet xx pin SO Socket/xx pin DIP 0.6" plug Supported Device/Footprints Adapter Dimensions Using this adapter, the 32 and 40 pin SO EPROM packages can be programmed on DIP programmers. Device Device 32 pin 40 pin Mfgr Many " Package SO " Footprint
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PA40SO1-OT
OTS-40-1
40SD-01
32SO-01
40SO-01
PA40SO1
XXSO1-OT
test socket 32 pin
Enplas
Enplas OTS 36
32 pin test socket
footprint dip 40
Enplas 14 pin
footprint dip 16
Enplas 28 pin
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wave footprint so14
Abstract: MLC745 SOT163-1 SO-16 SOT109-1 footprint so 14 SOT136-1 sot109 SOJ40 SOT109-2
Text: SO & SOJ FOOTPRINT WAFE SOLDERING Philips Semiconductors enlarged solder land handbook, full pagewidth solder lands C 0.3 1.20 B solder resist A occupied area F board direction 0.60 1.27(N−2)x) MLC745 G Wave soldering PACKAGE NAME FOOTPRINT DIMENSIONS (mm)
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MLC745
SOJ40
OT96-1
OT176-1
OT108-1
OT109-1
OT109-2
OT109-3
OT162-1
OT163-1
wave footprint so14
MLC745
SOT163-1
SO-16
SOT109-1
footprint so 14
SOT136-1
sot109
SOT109-2
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4108N
Abstract: NTMFS4108N NTMFS4108NT1G NTMFS4108NT3G
Text: NTMFS4108N Power MOSFET 30 V, 35 A, Single N-Channel, SO-8 Flat Lead Package http://onsemi.com Features •ăThermally and Electrically Enhanced Packaging Compatible with Standard SO-8 Package Footprint •ăNew Package Provides Capability of Inspection and Probe After
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NTMFS4108N
NTMFS4108N/D
4108N
NTMFS4108N
NTMFS4108NT1G
NTMFS4108NT3G
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Untitled
Abstract: No abstract text available
Text: PA14-08-1-1603-6 Data Sheet 14 pin SO socket/8 pin DIP 0.6" plug Supported Device/Footprints Adapter Parts & Part Numbers This adapter allows programming of several SO devices in their DIP footprint. A partial list is: The following chart shows the various socket and board part
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PA14-08-1-1603-6
NM93C56/
X24C16
PA14-08-1-1603-6
SD-03
OTS-14
PA14-08-1-1603-6Data
14SD038D
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Untitled
Abstract: No abstract text available
Text: IRF7521D1 Description TM The new Micro8 package, with half the footprint area of the standard SO-8, provides the smallest footprint available in an SOIC outline. This makes the Micro8TM an ideal device for applications where printed circuit board space is at a premium.
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IRF7521D1
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4108N
Abstract: NTMFS4108N NTMFS4108NT1G NTMFS4108NT3G
Text: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After
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NTMFS4108N
NTMFS4108N/D
4108N
NTMFS4108N
NTMFS4108NT1G
NTMFS4108NT3G
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488AA
Abstract: 4108N
Text: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After
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NTMFS4108N
NTMFS4108N/D
488AA
4108N
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4108N
Abstract: No abstract text available
Text: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After
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NTMFS4108N
NTMFS4108N/D
4108N
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Untitled
Abstract: No abstract text available
Text: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After
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NTMFS4108N
NTMFS4108N/D
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SO8F
Abstract: 4108N SO8FL
Text: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After
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NTMFS4108N
NTMFS4108N/D
SO8F
4108N
SO8FL
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Untitled
Abstract: No abstract text available
Text: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After
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NTMFS4108N
NTMFS4108N/D
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Untitled
Abstract: No abstract text available
Text: NTMFS4108N Power MOSFET 30 V, 35 A, Single N−Channel, SO−8 Flat Lead Package http://onsemi.com Features • Thermally and Electrically Enhanced Packaging Compatible with • • • • Standard SO−8 Package Footprint New Package Provides Capability of Inspection and Probe After
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NTMFS4108N
NTMFS4108N/D
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Untitled
Abstract: No abstract text available
Text: PA20-08-5-2808-3 6 Data Sheet 20 Pin SO socket/8 Pin DIP 0.3” or 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, several Xilinx EEPROM's in their 20 pin SO package can be programmed in their 8 pin DIP footprint. This adapter is general purpose, and is known to work for the
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PA20-08-5-2808-3
XC1701
XC17512L
20SO8-5
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Untitled
Abstract: No abstract text available
Text: PA20-08-2-2808-3 6 Data Sheet 20 Pin SO socket/8 Pin DIP 0.3” or 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, several Atmel EEPROM's in their 20 pin SO package can be programmed in their 8 pin DIP footprint. This adapter is general purpose, and is known to work for the
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PA20-08-2-2808-3
AT17C65
AT17C128
AT17C256
20SO8-2
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4C03N
Abstract: No abstract text available
Text: NVMFS4C03N Power MOSFET 30 V, 2.1 mW, 143 A, Single N−Channel Logic Level, SO−8FL Features • • • • • • http://onsemi.com Small Footprint 5x6 mm for Compact Design Low RDS(on) to Minimize Conduction Losses Low QG and Capacitance to Minimize Driver Losses
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NVMFS4C03N
NVMFS4C03NWF
NVMFS4C03N/D
4C03N
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858P
Abstract: F63TNR FDR858P SOIC-16
Text: February 1999 FDR858P Single P-Channel, Logic Level, PowerTrenchTM MOSFET General Description Features The SuperSOT-8 family of P-Channel Logic Level MOSFETs have been designed to provide a low profile, small footprint alternative to industry standard SO-8 little
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FDR858P
OT-23
858P
F63TNR
FDR858P
SOIC-16
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858P
Abstract: P-Channel Logic Level PowerTrenchTM MOSFET FDR858P SOIC-16 Single P-Channel, Logic Level, PowerTrench MOSFET
Text: February 1999 FDR858P Single P-Channel, Logic Level, PowerTrenchTM MOSFET General Description Features The SuperSOT-8 family of P-Channel Logic Level MOSFETs have been designed to provide a low profile, small footprint alternative to industry standard SO-8 little
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FDR858P
OT-23
858P
P-Channel Logic Level PowerTrenchTM MOSFET
FDR858P
SOIC-16
Single P-Channel, Logic Level, PowerTrench MOSFET
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Untitled
Abstract: No abstract text available
Text: February 1999 FDR858P Single P-Channel, Logic Level, PowerTrenchTM MOSFET General Description Features The SuperSOT-8 family of P-Channel Logic Level MOSFETs have been designed to provide a low profile, small footprint alternative to industry standard SO-8 little
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FDR858P
028ications
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BAV301
Abstract: BAV302 BAV303 sot23 footprint
Text: BAV301 - BAV303 SURFACE MOUNT SWITCHING DIODE L IT E M Z I y POWER SEMICONDUCTOR Features Fast Switching Speed Surface Mount Package Ideally Suited for Automatic Insertion For General Purpose Switching Applications High Conductance Fits on SO D -323 / SO T-23 Footprint
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OCR Scan
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BAV301
BAV303
OD-323
OT-23
MIL-STD-202,
BAV302
BAV303
DS30013
BAV301-BAV303
sot23 footprint
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MMSZ4688
Abstract: No abstract text available
Text: MMSZ4688 F A IR C H IL D S E M IC O N D U C T O R 5% TOLERANCE tm G eneral Description: Features: H alf watt, General purpose, Medium Current Surface Mount Zener in the SO D -123 package. The SO D-123 package has the same footprint as the glass m ini-melf LL-34 package &
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MMSZ4688
OD-123
LL-34)
MMSZ4688
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leadframe Cu C194
Abstract: No abstract text available
Text: PD - 9.1412G International IGR Rectifier IRF7422D2 FETKY MOSFET and Schottky Diode • • • • Co-packaged HEXFET Power MOSFET and Schottky Diode Ideal For Buck Regulator Applications Generation 5 Technology SO-8 Footprint VDSS = -20V Rds oh = 0.09Q
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OCR Scan
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1412G
IRF7422D2
C-198
leadframe Cu C194
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