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    SOT109 Search Results

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    SOT109 Price and Stock

    Nexperia 74HC595D,118

    Counter Shift Registers SOT109-1 COUNTER SHIFT REG
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC595D,118 Reel 3,060,000 2,500
    • 1 -
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    • 10000 $0.087
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    Nexperia 74HC4051D,653

    Multiplexer Switch ICs MULTIPLEXER SWITCH ICS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC4051D,653 Reel 1,572,500 2,500
    • 1 -
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    • 1000 -
    • 10000 $0.108
    		Buy Now

    Nexperia 74HC4052D,653

    Multiplexer Switch ICs MULTIPLEXER SWITCH ICS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC4052D,653 Reel 312,500 2,500
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.114
    		Buy Now

    Nexperia HEF4053BT,653

    Multiplexer Switch ICs SOIC-16 MULTIPLEXER SWITCH IC
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI HEF4053BT,653 Reel 87,500 2,500
    • 1 -
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    • 1000 -
    • 10000 $0.129
    		Buy Now

    Nexperia 74HC165D,653

    Counter Shift Registers SOT109-1 COUNTER SHIFT REG
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC165D,653 Reel 77,500 2,500
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.087
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    Find more SOT109 price and stock on Findchips.com

    SOT109 Datasheets (17)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT1090-1 NXP Semiconductors Plastic ball grid array package; 426 balls Original PDF
    SOT109-1 Philips Semiconductors Package outline Original PDF
    SOT1091-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 49 balls Original PDF
    SOT109-1_118 NXP Semiconductors SO16; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF
    SOT109-2 NXP Semiconductors Plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height Original PDF
    SOT1092-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT1092-2 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT1092-3 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 36 terminals Original PDF
    SOT109-3 NXP Semiconductors Plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm Original PDF
    SOT1093-1 NXP Semiconductors TQFP80: plastic thin quad flat package; 80 leads; body 14 x 14 x 1.1 mm Original PDF
    SOT1094-1 NXP Semiconductors Plastic ball grid array package; 376 balls Original PDF
    SOT1095-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 624 balls; heatsink Original PDF
    SOT1096-1 NXP Semiconductors Plastic ball grid array package; 452 balls Original PDF
    SOT1097-1 NXP Semiconductors Plastic low profile ball grid array package; 228 balls Original PDF
    SOT1097-2 NXP Semiconductors Plastic low profile ball grid array package; 228 balls Original PDF
    SOT1098-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 268 balls Original PDF
    SOT1099-1 NXP Semiconductors Plastic low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm Original PDF

    SOT109 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: 16 SO SOT109-1 SO16; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 4 — 24 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal


    Original     		PDF OT109-1 001aak603 OT109-1

    HVQFN36

    Abstract: No abstract text available
    Text: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads 36 terminals; body 6 x 6 x 0.85 mm SOT1092-1 B D D1 A terminal 1 index area E1 E A A4 A1 c detail X e1 e 10 18 C C A B C v w b y y1 C L 19 9 e e2 Eh 1 terminal 1 index area


    Original     		PDF HVQFN36: OT1092-1 MO-220 sot1092-1 HVQFN36

    HVQFN36

    Abstract: No abstract text available
    Text: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm A B D SOT1092-2 terminal 1 index area E A A1 c detail X e1 e 10 18 C C A B C v w b y1 C y L 19 9 e e2 Eh 1 27 terminal 1 index area


    Original     		PDF HVQFN36: OT1092-2 sot1092-2 HVQFN36

    MS-012AC

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm D E SOT109-3 A X c y HE v M A Z 16 9 A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF OT109-3 MS-012AC MS-012AC

    HVQFN36

    Abstract: No abstract text available
    Text: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm A B D SOT1092-3 terminal 1 index area E A A1 c detail X e1 e 10 18 C C A B C v w b y1 C y L 19 9 e e2 Eh 1 27 terminal 1 index area


    Original     		PDF HVQFN36: OT1092-3 MO-220 sot1092-2 HVQFN36

    Untitled

    Abstract: No abstract text available
    Text: Package outline LBGA228: plastic low profile ball grid array package; 228 balls SOT1097-1 A B D ball A1 index area E A2 A A1 detail X e1 1/2 e e ∅v ∅w b T R P N M L K J H G F E D C B A ball A1 index area e2 1/2 e 1 2 3 4 5 6 7 8 9 11 13 15 10 12 14 16


    Original     		PDF LBGA228: OT1097-1 sot1097-1

    BGA452

    Abstract: No abstract text available
    Text: Package outline BGA452: plastic ball grid array package; 452 balls SOT1096-1 B D A D1 ball A1 index area E1 E A A2 A1 detail X C e1 e AF AD AB Y V T P M K H F D B 1/2 e ∅v ∅w b C A B C y y1 C AE AC AA e W U R e2 N L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25


    Original     		PDF BGA452: OT1096-1 sot1096-1 MS-034 BGA452

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF OT109-1 076E07 MS-012

    MS-012AC

    Abstract: sot109
    Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm D E SOT109-3 A X c y HE v M A Z 16 9 A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF OT109-3 MS-012AC MS-012AC sot109

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA426: plastic ball grid array package; 426 balls SOT1090-1 B D A D1 ball A1 index area E1 E A A2 A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A M M C C A B C y y1 C e e2 1/2 e shape 1 3 5 7 9 11 13 15 17 19 21


    Original     		PDF BGA426: OT1090-1 MS-034

    Untitled

    Abstract: No abstract text available
    Text: Package outline HBGA624: plastic thermal enhanced ball grid array package; 624 balls; heatsink SOT1095-1 B D D1 A ball A1 index area j E1 E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D


    Original     		PDF HBGA624: OT1095-1 sot1095-1

    Untitled

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height D E SOT109-2 A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF OT109-2 076E07 MS-012

    SOT109-1_118

    Abstract: SOT109 nxp Tape and Reel Information SOT109-1
    Text: SOT109-1 Standard product orientation 12NC ending 118 Rev. 01 — 30 June 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT109-1 118 330 x 16.40


    Original     		PDF OT109-1 OT109-1 30-june- SOT109-1_118 SOT109 nxp Tape and Reel Information SOT109-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height D E SOT109-2 A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF OT109-2 076E07 MS-012

    Untitled

    Abstract: No abstract text available
    Text: Package outline LQFP256: plastic low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm SOT1099-1 c y X 192 193 A ZE 129 128 e w bp E HE A A2 A3 A1 θ Lp detail X 256 65 1 64 ZD w bp e HD A v B 10 20 mm scale Dimensions Unit max nom min v B D mm


    Original     		PDF LQFP256: OT1099-1 136E31 MS-026 sot1099-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA268: plastic low profile fine-pitch ball grid array package; 268 balls A B D SOT1098-1 ball A1 index area E A2 A A1 detail X e1 e Y V P M H F D B ∅v ∅w b R y y1 C e N L e2 J 1/2 e G E C 1 2 3 4 5 6 7 9 11 13 15 17 19 8 10 12 14 16 18 20


    Original     		PDF LFBGA268: OT1098-1 sot1098-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF OT109-1 OT109-1 076E07 MS-012

    970522

    Abstract: SOT109-1
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF OT109-1 OT109-1 076E07S MS-012AC 970522 SOT109-1

    sot109

    Abstract: SOT109-2
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height D E SOT109-2 A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF OT109-2 OT109-2 sot109 SOT109-2

    076E07

    Abstract: No abstract text available
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF OT109-1 076E07 MS-012 076E07

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA376: plastic ball grid array package; 376 balls SOT1094-1 B D A D1 ball A1 index area E1 E A A2 A1 detail X C e1 e AF AD AB Y V T P M K H F D B 1/2 e ∅v ∅w b C A B C y y1 C AE AC AA e W U R e2 N L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25


    Original     		PDF BGA376: OT1094-1 sot1094-1 MS-034

    Untitled

    Abstract: No abstract text available
    Text: Package outline SO16: plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm D E SOT109-3 A X c y HE v M A Z 16 9 A2 A A 3 A1 pin 1 index θ Lp 1 L 8 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		PDF OT109-3 MS-012AC

    Untitled

    Abstract: No abstract text available
    Text: Package outline TQFP80: plastic thin quad flat package; 80 leads; 14 x 14 x 1.1 mm SOT1093-1 c y X 60 A 41 40 61 ZE e E HE A A2 A3 A1 w θ bp detail X pin 1 index L 21 80 1 20 bp D e w ZD A v B 2.5 5 mm scale Dimensions Unit max nom min v B HD mm Lp A 1.2


    Original     		PDF TQFP80: OT1093-1 136E19 MS-026 sot1093-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA49: plastic thin fine-pitch ball grid array package; 49 balls A B D SOT1091-1 ball A1 index area A2 E A A1 detail X e1 e ∅v ∅w b M M C C A B C y y1 C G F e E e2 D C B A ball A1 index area 1 2 3 4 5 6 7 X 2.5 5 mm scale DIMENSIONS mm are the original dimensions


    Original     		PDF TFBGA49: OT1091-1