FF17 Search Results

FF1738

Abstract: PK224 xilinx 1738 ball Xilinx
Contextual Info: 1738 Ball Flip-Chip BGA FF1738 Package PK224 (v1.1) October 11, 2010 X-Ref Target - Figure 1 2007–2010 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other

Contextual Info: PK458 v1.1 September 28, 2012 100% Material Declaration Data Sheet FF1759 Virtex-6 Average Weight: 21.0121 g Substance Description Component Silicon Die (FPGA) Doped silicon CAS Number or Description 7440-21-3 Percentage of Component 100.00 Solder Bump Use in Product

FF1759

Abstract: XC6VLX240T FFG1759 PK385 MS-034-AAV-1 AP 4100 AA V1.3 K/AP 4100 AA V1.3
Contextual Info: 1759 Ball Flip-Chip BGA FF1759/FFG1759 Package PK385 (v1.1) November 12, 2010 X-Ref Target - Figure 1 BOTTOM VIEW TOP VIEW 0.20 4X B D1 D A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR AT AU AV AW AY BA BB bbb A PIN 1 I.D.

FF1704

Contextual Info: R FF1704: Plastic Flip-Chip BGA Package PK066 v1.0 October 30, 2002 2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

PK473

Contextual Info: PK473 v1.1 September 28, 2012 100% Material Declaration Data Sheet FF1760 Virtex-6 Average Weight: 21.0187 g Component Silicon Die (FPGA) Substance Description Doped silicon CAS Number or Description 7440-21-3 Percentage of Component 100.00 Solder Bump Use in Product

ff1760

Abstract: 1760-BALL
Contextual Info: R Flip-Chip BGA FF1760 Package PK079 (v1.1) April 13, 2006 1760-BALL FLIP-CHIP BGA (FF1760) 2004, 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

Phico D - 0

Abstract: nec upd 1511 Phico D 0 phico d-0 94 PHICO phico d-0 Phico DO - 0 TQ00
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT ¿tPD78370 A , 78372(A) 16 BIT SINGLE-CHIP MICROCOMPUTER The /iPD78372(A) contains a high-speed, high-performance 16-bit CPU and offers powerful arithmetic operation functions. An A/D converter and a real-time pulse unit, which provide the real-time control required in motor control,

UG365

Abstract: UG-361 XC6VLX240T UG365 XC6VLX240T-1FFG1156 DSP48E1 VIRTEX-6 UG362 write operation using ram in fpga xc6vlx240t VIRTEX-6 UG373 frequency detection using FPGA
Contextual Info: → 11 Virtex-6 Family Overview DS150 v2.4 January 19, 2012 Product Specification General Description The Virtex -6 family provides the newest, most advanced features in the FPGA market. Virtex-6 FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on

32176 Group PWM CODE

Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

Contextual Info: User’s Manual 78K0/KC1 8-Bit Single-Chip Microcontrollers µPD780111 µPD780112 µPD780113 µPD780114 µPD78F0114 µPD780111 A µPD780112(A) µPD780113(A) µPD780114(A) µPD78F0114(A) Document No. U16227EJ3V0UD00 (3rd edition) Date Published February 2005 N CP(K)

camera motors

Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD78363A,78365A,78366A,78368A 16/8-BIT SINGLE-CHIP MICROCONTROLLERS DESCRIPTION µPD78366A is provided with a high-speed, high-performance CPU and powerful operation functions. Unlike the existing µPD78328, µPD78366A is also provided with a high-resolution PWM signal output function which

DSP48E1

Abstract: FPGA Virtex 6 LXT virtex 6 XC6VSX475T XC6VLX240T-1FFG1156 "Binary Multipliers" UG-361 virtex+6 UG366 1000BASE-X DS150
Contextual Info: 11 Virtex-6 Family Overview DS150 v2.1 November 6, 2009 Advance Product Specification General Description The Virtex -6 family provides the newest, most advanced features in the FPGA market. Virtex-6 FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on

Contextual Info: Freescale Semiconductor Application Note Document Number:AN4503 Rev. 1, 11/2012 Power Management for Kinetis and ColdFire+ MCUs When and how to use low-power modes by: Philip Drake Contents 1 Introduction 1

XQ5VLX110

Abstract: XQ5VLX330T SX95T DS714 XQ5VFX130T ROCKETIO VIRTEX-5 LX110 UG190 UG191 UG195
Contextual Info: 74 Virtex-5Q FPGA Data Sheet: DC and Switching Characteristics DS714 v2.0 December 17, 2009 Product Specification Virtex-5Q FPGA Electrical Characteristics Virtex -5Q FPGAs are available in -2 and -1 speed grades, with -2 having the highest performance. Virtex-5Q FPGA

XC5VLX50T-1FFG665C

Abstract: ff1156 VIRTEX-5 DDR2 controller FFG1156 VIRTEX-5 DDR PHY Virtex-5 Ethernet development Virtex-5 LXT Ethernet DSP48E SRL16 XC5VLX220
Contextual Info: R DS100 v5.0 February 6, 2009 Virtex-5 Family Overview Product Specification General Description The Virtex -5 family provides the newest most powerful features in the FPGA market. Using the second generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the Virtex-5 family contains five distinct platforms (sub-families), the most choice

UG366

Abstract: LX760
Contextual Info: Virtex-6 FPGA Data Sheet: DC and Switching Characteristics DS152 v3.5 May 17, 2013 Product Specification Virtex-6 FPGA Electrical Characteristics Virtex -6 FPGAs are available in -3, -2, -1, and -1L speed grades, with -3 having the highest performance. Virtex-6 FPGA

BLVDS-25

Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000
Contextual Info: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)

qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

11b3 DIODE

Abstract: diagrams hitachi ecu RTD 1185 DATA SHEET M32R RTD rtd ic 1117 3.3 analog devices 118a ECU 206 FD31 hitachi ecu datasheet
Contextual Info: To all our customers Regarding the change of names mentioned in the document, such as Mitsubishi Electric and Mitsubishi XX, to Renesas Technology Corp. The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

78F9177

Abstract: uPD78F9177A UPD78F9177AGB-8ES pd78f9177 78F9177A PD789166 uPD789166Y uPD789167 uPD789167Y uPD789176
Contextual Info: User’s Manual µPD789167, 789177, 789167Y, 789177Y Subseries 8-Bit Single-Chip Microcontrollers µPD789166 µPD789167 µPD789176 µPD789177 µPD78F9177 µPD78F9177A µPD789166 A µPD789167(A) µPD789176(A) µPD789177(A) µPD78F9177A(A) µPD789166Y µPD789166(A1)

Split System Air Conditioner three phase wiring d

Abstract: uPD78352 uPD78328 uPD78356 uPD78361A uPD78362A uPD78P364A uPD78366A 78k3 Split System Air Conditioner voltage
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

UPD78312

Abstract: 78324 UPD78312 assembler PD78310 assembler 78310 washing machine programmer PD78312 uPD78322 uPD78323 uPD78324
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

952s05

Abstract: FF68H TCL32 78P054 uPD78052 uPD78052Y uPD78054 TMC-25 FF40H TCL05
Contextual Info: お客様各位 カタログ等資料中の旧社名の扱いについて 2010 年 4 月 1 日を以って NEC エレクトロニクス株式会社及び株式会社ルネサステクノロジ が合併し両社の全ての事業が当社に承継されております。従いまして、本資料中には旧社

AM9513

Abstract: BCD DIVISION e purse AM9513CC AM9513DM AM9513 counter bft 5f g1
Contextual Info: A m 9 5 1 3 y m System T im ing C o n tro lle r ^ Advanced M icro Devices H g a w 'W A dvanced MOS/LSI I DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION • Five independent 16-bit counters The Am9513 System Timing Controller is an LSI circuit designed to service many types of courting, sequencing and timing appli­