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Royal Electronic Factory (Thailand) Co Ltd MF0W8FF1692B00 Metal Film Resistors - Through Hole 125 mW (1/8 W) 1% 16.9K
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Mouser Electronics	MF0W8FF1692B00					1 - 10 - 100 - 1000 $0.011 10000 $0.008	Get Quote
Royal Electronic Factory (Thailand) Co Ltd MF0W8FF1690B00 Metal Film Resistors - Through Hole 125 mW (1/8 W) 1% 169R
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Mouser Electronics	MF0W8FF1690B00					1 - 10 - 100 - 1000 $0.013 10000 $0.008	Get Quote
Royal Electronic Factory (Thailand) Co Ltd MF0W4FF1691A10 Metal Film Resistors - Through Hole 250 mW (1/4 W) 1% 1.69K
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Mouser Electronics	MF0W4FF1691A10					1 - 10 - 100 - 1000 $0.017 10000 $0.01	Get Quote
Royal Electronic Factory (Thailand) Co Ltd MF0W4FF1692A10 Metal Film Resistors - Through Hole 250 mW (1/4 W) 1% 16.9K
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	MF0W4FF1692A10					1 - 10 - 100 - 1000 $0.017 10000 $0.01	Get Quote
Royal Electronic Factory (Thailand) Co Ltd MF0W8FF1693B00 Metal Film Resistors - Through Hole 125 mW (1/8 W) 1% 169K
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Mouser Electronics	MF0W8FF1693B00					1 - 10 - 100 - 1000 $0.013 10000 $0.008	Get Quote

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FF169 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
PK065 Abstract: No abstract text available Text: R FF1696: Plastic Flip-Chip BGA Package PK065 v1.0 October 30, 2002 2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.	Original	FF1696: PK065 PK065	PDF
BLVDS-25 Abstract: LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000 Text: Xilinx Virtex-II Series FPGAs and RocketPHY Physical Layer Transceivers Transceiver Blocks 992 88 120 200 264 432 528 624 720 912 1104 1108 Chip Scale Packages CS – wire-bond chip-scale BGA (0.8 mm ball spacing) 144 8 88 92 FF896 92 8 FF1152 BGA Packages (BG) – wire-bond standard BGA (1.27 mm ball spacing)	Original	FF896 FF1152 FF11486 10Gbps BLVDS-25 LVDSEXT-25 4564 RAM XC2VP70 FF1704 pinout XC2V1000 Pin-out XC2V1500 XC2V2000 XC2V3000 XC2V6000 XC2V8000	PDF
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga	PDF
Untitled Abstract: No abstract text available Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded	Original	DS083-1 18-bit FF1148) FF1517) FF1696) DS083-4	PDF
Untitled Abstract: No abstract text available Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.3 November 20, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded	Original	DS083-1 18-bit DS083-4	PDF
QF32 Abstract: FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176 Text: TQFP VQFP TQ176 TQ160 TQ144 TQ100 22.0 x 22.0 mm 0.5 mm 26.0 x 26.0 mm (0.5 mm) 26.0 x 26.0 mm (0.5 mm) VQ64 12.0 x 12.0 mm (0.8 mm) 12.0 x 12.0 mm (0.5 mm) 9/18/07 16.0 x 16.0 mm (0.5 mm) VQ100 VQ44 MPM_1498_pmatrices_Q307_r1.qxd 22 16.0 x 16.0 mm (0.5 mm)	Original	TQ176 TQ160 TQ144 TQ100 VQ100 HQ/PQ208 HQ304 HQ/PQ240 HQ/PQ160 PQ100 QF32 FG320 FF668 BF957 FF1513 CP132 PQ100 FF1148 TQ144 TQ176	PDF
AB38R Abstract: tag l9 225 400 XC2VP20 XC2VP50 Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.0 June 13, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-performance Platform FPGA solution including - Up to twenty-four Rocket I/O™ embedded multi-gigabit transceiver blocks (based on	Original	DS083-1 18-bit and255-7778 DS083-4 AB38R tag l9 225 400 XC2VP20 XC2VP50	PDF
xc2vp1257 Abstract: 2VP125 XC2VP70 FF1704 FG456 2vp12 XC2VP50 Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.2 September 27, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four Rocket I/O™ embedded	Original	DS083-1 18-bit XC2VP30, FF1152 DS083-4 xc2vp1257 2VP125 XC2VP70 FF1704 FG456 2vp12 XC2VP50	PDF
vhdl code for uart communication Abstract: XC2VP50 Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded	Original	DS083-1 18-bit FG676 XC2VP20, XC2VP30, XC2VP40. FF1517 vhdl code for uart communication XC2VP50	PDF
vhdl code for uart communication Abstract: XC2VP50 XC2VP70 FF1704 pinout Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded	Original	DS083-1 18-bit DS083-4 vhdl code for uart communication XC2VP50 XC2VP70 FF1704 pinout	PDF
ra1613 Abstract: FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27 Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations	Original	210MHz PCI33, PCI66, ra1613 FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27	PDF
Untitled Abstract: No abstract text available Text: Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.0 June 13, 2002 Advance Product Specification Summary of Virtex-II Pro Features • • High-performance Platform FPGA solution including - Up to twenty-four Rocket I/O™ embedded multi-gigabit transceiver blocks (based on	Original	DS083-1 18-bit	PDF
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G	PDF
cmos 556 timer Abstract: powerpc 405 system ace compactflash solution for virtex 4 verilog code for 10 gb ethernet Virtex-II Pro XC2VP40 XC2VP100 digital clock vhdl code FF672 multi channel UART controller using VHDL 16 bit Array multiplier code in VERILOG Text: ` 8 Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v3.1.1 March 9, 2004 Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty RocketIO™ embedded multi-gigabit	Original	DS083-1 18-bit cmos 556 timer powerpc 405 system ace compactflash solution for virtex 4 verilog code for 10 gb ethernet Virtex-II Pro XC2VP40 XC2VP100 digital clock vhdl code FF672 multi channel UART controller using VHDL 16 bit Array multiplier code in VERILOG	PDF

xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance	PDF
bt 1696 Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are	Original		PDF
apple ipad schematic drawing Abstract: xpower inverter 3000 plus apple ipad 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic 8051 code assembler for data encryption standard XC2VP2-FG256 vhdl code for FFT 32 point Rayovac 357 apple ipad battery charge controller Text: Virtex-II Pro and Virtex-II Pro X FPGA User Guide UG012 v4.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG012 apple ipad schematic drawing xpower inverter 3000 plus apple ipad 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic 8051 code assembler for data encryption standard XC2VP2-FG256 vhdl code for FFT 32 point Rayovac 357 apple ipad battery charge controller	PDF
XC2VP70 FF1704 pinout Abstract: XC2VP20-FF896 FG25 vhdl code for uart communication vhdl code for 8-bit calculator XC2VP50 Text: ` Virtex-II Pro Platform FPGAs: Introduction and Overview R DS083-1 v2.4.1 March 24, 2003 Advance Product Specification Summary of Virtex-II Pro Features • • High-Performance Platform FPGA Solution, Including - Up to twenty-four RocketIO™ embedded	Original	DS083-1 18-bit DS083-4 XC2VP70 FF1704 pinout XC2VP20-FF896 FG25 vhdl code for uart communication vhdl code for 8-bit calculator XC2VP50	PDF
verilog hdl code for uart Abstract: XC2VP70 FF1704 pinout XC2VP50 Text: Virtex-II Pro Platform FPGAs: Complete Data Sheet R DS083 March 9, 2004 Product Specification This document includes all four modules of the Virtex-II Pro Platform FPGA data sheet. Module 1: Introduction and Overview Module 3: DC and Switching Characteristics	Original	DS083 DS083-1 DS083-3 Des05/19/03 DS083-4 verilog hdl code for uart XC2VP70 FF1704 pinout XC2VP50	PDF
Virtex-II Pro xc2vp70ff1517 Abstract: XC2VP70 FF1704 pinout RXRECCLK Text: Virtex-II Pro Platform FPGAs: Complete Data Sheet R DS083 April 22, 2004 Product Specification This document includes all four modules of the Virtex-II Pro Platform FPGA data sheet. Module 1: Introduction and Overview Module 3: DC and Switching Characteristics	Original	DS083 DS083-1 DS083-3 Des05/19/03 DS083-4 Virtex-II Pro xc2vp70ff1517 XC2VP70 FF1704 pinout RXRECCLK	PDF
Virtex-II Pro xc2vp50ff1152 Abstract: XC2VP50 250v ACE 69 XC2VP30 IOL29 ultra fine pitch BGA DS083 FF1148 FF672 FG676 Text: Virtex-II Pro Platform FPGAs: Complete Data Sheet R DS083 February 19, 2004 Product Specification This document includes all four modules of the Virtex-II Pro Platform FPGA data sheet. Module 1: Introduction and Overview Module 3: DC and Switching Characteristics	Original	DS083 DS083-1 DS083-3 DS083-4 Virtex-II Pro xc2vp50ff1152 XC2VP50 250v ACE 69 XC2VP30 IOL29 ultra fine pitch BGA FF1148 FF672 FG676	PDF
XC3S1000-FT256 Abstract: XC3S1000-FG456 XC2VP30-FF896 XILINX/SPARTAN-3 XC3S200 XC2V3000-BG728 XC2VP4-FG456 XC3S200FT256 XC2V1000-FG456 XC2V3000-FG676 XC2VP20 fg676 Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15µm structured ASIC • Platform for high-performance 1.5V/1.2V ASICs and FPGA-to-ASIC conversions • NRE and production cost savings • Significant time-to-market advantages	Original	210MHz 500MHz 332kbits 18kbit 330MHz XC3S1000-FT256 XC3S1000-FG456 XC2VP30-FF896 XILINX/SPARTAN-3 XC3S200 XC2V3000-BG728 XC2VP4-FG456 XC3S200FT256 XC2V1000-FG456 XC2V3000-FG676 XC2VP20 fg676	PDF
Untitled Abstract: No abstract text available Text: Virtex-II Pro Platform FPGAs: Complete Data Sheet R DS083 September 10, 2003 Advance Product Specification This document includes all four modules of the Virtex-II Pro Platform FPGA data sheet. Module 1: Introduction and Overview Module 3: DC and Switching Characteristics	Original	DS083 DS083-1 DS083-3 DS083-4	PDF
RSN 310 R37 Abstract: Virtex-5 LX50 Virtex-5 FPGA Packaging and Pinout Specification VIRTEX-5 LX110T UG195 ff676 VIRTEX-5 LX110 Virtex 5 LX50T TRANSISTOR SMD MARKING CODE W25 FX70T Text: Virtex-5 FPGA Packaging and Pinout Specification UG195 v4.6 May 5, 2009 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG195 RSN 310 R37 Virtex-5 LX50 Virtex-5 FPGA Packaging and Pinout Specification VIRTEX-5 LX110T UG195 ff676 VIRTEX-5 LX110 Virtex 5 LX50T TRANSISTOR SMD MARKING CODE W25 FX70T	PDF

FF169 Search Results

FF169 Price and Stock

Royal Electronic Factory (Thailand) Co Ltd MF0W8FF1692B00

Royal Electronic Factory (Thailand) Co Ltd MF0W8FF1690B00

Royal Electronic Factory (Thailand) Co Ltd MF0W4FF1691A10

Royal Electronic Factory (Thailand) Co Ltd MF0W4FF1692A10

Royal Electronic Factory (Thailand) Co Ltd MF0W8FF1693B00

FF169 Datasheets Context Search

PK065

BLVDS-25

qfn 3x3 tray dimension

Untitled

Untitled

QF32

AB38R

xc2vp1257

vhdl code for uart communication

vhdl code for uart communication

ra1613

Untitled

xilinx topside marking

cmos 556 timer

xilinx part marking

bt 1696

apple ipad schematic drawing

XC2VP70 FF1704 pinout

verilog hdl code for uart

Virtex-II Pro xc2vp70ff1517

Virtex-II Pro xc2vp50ff1152

XC3S1000-FT256

Untitled

RSN 310 R37