FCBG Search Results

Contextual Info: Version 0.9 2008 Features ƒ PEX 8616 General Features o 16-lane, 4-port PCIe Gen2 switch - Integrated 5.0 GT/s SerDes o 19 x 19mm2, 324-pin FCBGA package o Typical Power: 2.2 Watts ƒ PEX 8616 Key Features o Standards Compliant - PCI Express Base Specification, r2.0

1.9 Interrupts

Abstract: PEX8612-AA50BCG
Contextual Info: Version 0.85 2007 Features ƒ PEX 8612 General Features o 12-lane, 3-port PCIe Gen2 switch - Integrated 5.0 GT/s SerDes o 19 x 19mm2, 324-pin FCBGA package o Typical Power: 2.0 Watts ƒ PEX 8612 Key Features o Standards Compliant - PCI Express Base Specification, r2.0

8616

Contextual Info: Version 0.85 2007 Features ƒ PEX 8616 General Features o 16-lane, 4-port PCIe Gen2 switch - Integrated 5.0 GT/s SerDes o 19 x 19mm2, 324-pin FCBGA package o Typical Power: 2.1 Watts ƒ PEX 8616 Key Features o Standards Compliant - PCI Express Base Specification, r2.0

Contextual Info: PEX 8680, PCI Express Gen 2 Switch, 80 Lanes, 20 Ports Features ƒ PEX 8680 General Features o 80-lane, 20-port PCIe Gen2 switch - Integrated 5.0 GT/s SerDes o 35 x 35mm2, 1156-ball FCBGA package o Typical Power: 9.0 Watts ƒ The ExpressLaneTM PEX 8680 device offers Multi-Host PCI Express

PEX8612-AA50BCF

Contextual Info: Version 0.9 2008 Features ƒ PEX 8612 General Features o 12-lane, 3-port PCIe Gen2 switch - Integrated 5.0 GT/s SerDes o 19 x 19mm2, 324-pin FCBGA package o Typical Power: 2.0 Watts ƒ PEX 8612 Key Features o Standards Compliant - PCI Express Base Specification, r2.0

CML ECL termination

Abstract: MC100EP16 MC100EP16F MC100EP16VS MC100EP16VT MC100LVEP16 MC10EP16 MC10EP16T MC10LVEP16 NBSG16
Contextual Info: SGD508/D Jan-2002 Rev 0 1 to 12 GHz Differential Receiver/Drivers Bandwidth GHz Gain Input Termination (50Ω) Open Input Default State (D, D) Input Level Output Level Output Enable LOW, HIGH ECL, CMOS, CML, LVDS RSECL(3) No 1 FCBGA 16 Yes(1) LOW, HIGH ECL, CMOS,

DOORBELL WITH SECURITY FEATURE

Abstract: PEX8612 pcie gen 2 payload PEX8612-BB50BC-F "network interface cards"
Contextual Info: Version 1.0 2009 Features ƒ PEX 8612 Vitals o 12-lane, 3-port PCIe Gen2 switch - Integrated 5.0 GT/s SerDes o 19 x 19mm2, 324-pin FCBGA package o Typical Power: 1.6 Watts ƒ PEX 8612 PEX 8612 Key Features o Standards Compliant - PCI Express Base Specification, r2.0

PEX8647

Abstract: PEX8647-BB50BC PEX8647-BB PEX8647-SIL-PB-1
Contextual Info: Version 1.0 2009 PEX 8647 Features ƒ PEX 8647 Vitals - 48-lane, 3-port PCIe Gen2 switch Integrated 5.0 GT/s SerDes o 27 x 27mm2, 676-pin FCBGA package o Typical Power: 2.8 Watts ƒ PEX 8647 Key Features o Standards Compliant - PCI Express Base Specification, r2.0

S/241618-020

Contextual Info: R Mobile Intel Celeron® Processor 0.13 µ in Micro-FCBGA and Micro-FCPGA Packages at 1.33 GHz, 1.20 GHz, 1.13 GHz, 1.06 GHz, 1.00 GHz; Low Voltage 733 MHz, 650 MHz; and Ultra Low Voltage 733 MHz, 700 MHz, 667 MHz, and 650 MHz Datasheet September 2002

ni usb 6212

Abstract: SS-00259-1 C2060 C2055 C2068 quanta C2096 R2067 915GM SW1010CPT
Contextual Info: 1 2 3 4 5 478 PIN micro FC-PGA 14, 15, 15w , 17w inch XGA, SXGA+ A LVDS LCD P7 P3,4 400/533 MHz A LVDS Alviso DVI M24/M26 UNBUFFERED DDRII SODIMM DDRII 400/533 P10 915GM/PM R/G/B CRT P9 R/G/B UNBUFFERED DDRII SODIMM DDRII 400/533 1257 PIN (micro FCBGA) PCIE 16Lanes

sc413

Abstract: BC163 quanta GND194 g7001 G71M-U AK-34 DDR3 Infineon quanta computer Quanta AT8
Contextual Info: 5 4 3 2 CH-A NVIDIA PCI-E x16 D G71M G71M-U CH-B FCBGA 1148pin TV CH-C C CRT MXM CONNECTOR 1 VRAM GDDR3 8Mx32 16Mx32 D VRAM GDDR3 8Mx32 16Mx32 VRAM C GDDR3 8Mx32 16Mx32 LVDS CH-D VRAM GDDR3 8Mx32 16Mx32 2.5V B B 3.3V A VIN VCORE VRM VIN 1.8V VRM VCORE A 1.8V

MAX8770

Abstract: ICS954310 motherboard samsung ba41 MDB41 PC87541 QUANTA C3229 C3198 PC87541 sil3512 quanta
Contextual Info: 1 2 3 4 5 CPU Yonah/Merom 478 PIN micro FC-PGA 1 RJ9 Block Diagram P3,4 14.318MHz FSB 667 MHz(166X4) A LVDS LCD A LVDS P7 CLOCK GEN DDRII 400/533/667 Calistoga DVI M56 UNBUFFERED DDRII SODIMM CRT P11 P2 P12 945GM/PM R/G/B ICS954310 R/G/B 1466 PIN (micro FCBGA)

ene kb3310qf c1

Abstract: kb3310qf c1 ene kb3310qf a0 ene kb3310qf b0 MB39A129 ene kb3310 KB3310 kb3310qf ene kb3310qf RTM875T-606
Contextual Info: 5 4 3 2 1 2008.06.01 D C Mariana Block Diagram VTERM +0.9V C Stage VTT(+1.05V) +1.5VSUS CPU VCORE VID[0:6] XDP Diamondville +1.5V IMVP 6 +1.8VSUS FCBGA8 437 +1.8V +/- CPU_CLK VCORE:+1.196 ~ +0.748 VCCP:+1.05V Thermal Clock Gengerator +2.5V VCCA:+1.8V or +1.5V

RFU20

Abstract: G72M sc413 BLM18PG181SN1D nvidia g72m 7SH02 nvidia MXM MXM CONNECTOR G72M-V quanta computer
Contextual Info: 5 4 D 3 2 CH-A NVIDIA PCI-E x16 CH-B FCBGA 820pin MXM CONNECTOR D VRAM GDDR3 8Mx32 16Mx32 Page8 Channel C is available on G73M only CRT C VRAM GDDR3 8Mx32 16Mx32 Page7 G72M G73M TV 1 C LVDS Page3 ~ 6 2.5V B B 3.3V Page2 VIN VCORE VRM VCORE 1.8V VRM 1.8V Page9

AC adapter 19V

Abstract: r305 finger print module CONN60_ITP-XDP MOSFET BA8 SMSC1021 quanta cn137 max8724 ICS CK410M max8736
Contextual Info: 5 4 3 2 1 OT1 BLOCK DIAGRAM CPU CORE P37 CPU Thermal Sensor Intel ULV Peutium-M / ULV Celeron-M D MAX6657 ULV Yonah / ULV Celeron +1.05V/+1.5V_A P36 DC/DC 3V & 5V 479 Pins Micro-FCBGA DISCHARGE/+2.5V P32 D ICS CK410-M XDP P5,6 CONN60_ITP-XDPP5 HyperThansport I/O BUS

PEX8648

Abstract: PEX8648-BB50 PEX8648-BB50BC PEX8648-BB50BCF PEX8648-BB50BC F PCIe Endpoint plx pex pex8648-bb PEX8648-BB50B
Contextual Info: Version 0.96 2008 Features ƒ PEX 8648 General Features o 48-lane, 12-port PCIe Gen2 switch - Integrated 5.0 GT/s SerDes o 27 x 27mm2, 676-pin FCBGA package o Typical Power: 3.7 Watts ƒ PEX 8648 Key Features o Standards Compliant - PCI Express Base Specification, r2.0

PEX8632-BB50BC

Abstract: PEX8632-BB50 PEX8632 pcie Gen2 payload PEX8632-BB50BCF PEX8632BB50BCF PEX8632-BB50B pex8632bb50bc
Contextual Info: Version 0.96 2008 Features ƒ PEX 8632 General Features o 32-lane, 12-port PCIe Gen2 switch - Integrated 5.0 GT/s SerDes o 27 x 27mm2, 676-pin FCBGA package o Typical Power: 2.6 Watts ƒ PEX 8632 Key Features o Standards Compliant - PCI Express Base Specification, r2.0

AN-2075

Contextual Info: Finisar Product Specification Quadwire 40 Gb/s Parallel Active Optical Cable FCBG410QB1Cxx PRODUCT FEATURES • Four-channel full-duplex active optical cable  Electrical interface only  Multirate capability: 1.06Gb/s to 10.5Gb/s per channel  Complies with QSFP MSA highdensity form factor

tray datasheet bga

Abstract: tray bga fcbga tray jedec NEC 710
Contextual Info: TRAY CONTAINER UNIT : mm 3x8=24 33.25 A' 35.50 33.25 135°C MAX 32.45 BGA 33×33A 35.50 NEC 71.0 135.9 PPE A 33.25 248.5 315.0 322.6 SECTION A-A' 4.52 7.62 (6.35) 33.25 Applied Package Quantity (pcs) 955-pin • Plastic BGA (FCBGA)(33×33) 24 MAX. BGA 33 × 33A

PEX8632

Abstract: pcie Gen2 payload
Contextual Info: Version 0.8 2007 Features ƒ PEX 8632 General Features o 32-lane, 12-port PCIe Gen2 switch - Integrated 5.0 GT/s SerDes o 27 x 27mm2, 676-pin FCBGA package o Typical Power: < 5.5 Watts ƒ PEX 8632 Key Features o Standards Compliant - PCI Express Base Specification, r2.0

PEX8648

Abstract: PCIe Endpoint
Contextual Info: Version 0.8 2007 Features ƒ PEX 8648 General Features o 48-lane, 12-port PCIe Gen2 switch - Integrated 5.0 GT/s SerDes o 27 x 27mm2, 676-pin FCBGA package o Typical Power: < 7.0 Watts ƒ PEX 8648 Key Features o Standards Compliant - PCI Express Base Specification, r2.0

Intel Mobile Celeron Processor BGA

Abstract: CK-408 CK-Titan Clock Synthesizer mmc-1 celeron mmc-1 pentium
Contextual Info: R Mobile Intel Celeron® Processor 0.13 µ in Micro-FCBGA and Micro-FCPGA Packages at 1.33 GHz, 1.20 GHz, 1.13 GHz, 1.06 GHz, 1.00 GHz; Low Voltage 733 MHz, 650 MHz; and Ultra Low Voltage 667 MHz and 650 MHz Datasheet June 2002 Order Number: 298517-003

U8439-1

Abstract: AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 DCL4 X23-7772
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1006-03 DATE: 23-Jul-2010 Product Affected: MEANS OF DISTINGUISHING CHANGED DEVICES: 35.0mm x 35.0mm x 3.42mm FCBGA-1156 (RoHS & Standard)

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL

Abstract: "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL"
Contextual Info: Package Information file:///D|/nec_intranet/package/index.htm Package Information Package Type Package List by NEC Code Explanation of Package and Packing Semiconductor Device Mounting Technology Manual Chip Size Package (CSP) BGA Family Flip Chip BGA (FCBGA)