FBGA13 Search Results

FBGA 152

Abstract: JEDEC tray standard 13 fBGA package tray JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA
Contextual Info: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC A' 13.40 16.15 12.15 13.40 16.00 11.95 FBGA13×13ESP 135°C MAX. 135.9 PPE A 290.7 315.0 322.6 SECTION A – A' 13.40 (5.95) (5.62) 7.62 13.00 Applied Package 144-pin Plastic FBGA (13×13) 160-pin Plastic FBGA (13×13)

JEDEC tray standard 13

Abstract: JEDEC tray standard
Contextual Info: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC A' 13.40 16.15 12.15 13.40 16.00 11.95 FBGA13×13ESP 135°C MAX. 135.9 PPE A 290.7 315.0 322.6 SECTION A – A' 13.40 (5.82) (5.62) 7.62 12.70 Applied Package 261-pin Plastic FLGA (12.7×12.7) Quantity (pcs) 152 MAX.

SSD-A-H7391-2

Abstract: FBGA 152 JEDEC TRAY DIMENSIONS FBGA
Contextual Info: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC 135°C MAX. A' 16.15 13.40 16.00 FBGA13×13ESP 13.40 12.15 290.7 315.0 322.6 Section A – A' 13.40 (5.62) (5.82) 12.70 7.62 11.95 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA 13×13 ESP 381-pin Plastic FBGA (12.7×12.7)

13x13

Abstract: nec 13A JEDEC tray standard SSD-A-H7551-1 FBGA13x13A JEDEC TRAY 10 X 10 TRAY DIMENSIONS JEDEC TRAY DIMENSIONS
Contextual Info: TRAY CONTAINER UNIT : mm 8x19=152 135.9 112.0 PPE A A 11.95 13.50 16.00 135°CMAX NEC FBGA13×13A 16.15 13.50 290.7 315.0 322.6 12.15 <SECTION A-A> 13.5±0.05 (6.03) 7.62 5.62 13.00 Applied Package Quantity(pcs) 144-pin Plastic FBGA(13x13) Tray Material

JEDEC tray standard 13

Contextual Info: UNIT : mm 7x18=126 JAPAN 112.5 A' 135°C MAX. 18.75 FBGA13×13×1.46 11.70 13.15 17.25 10.88 13.15 293.25 315.0 322.6 SECTION A – A' 13.15 6.32 6.35 7.62 135.9 NEC A Applied Package 144-pin Plastic FBGA ( 13) Quantity (pcs) MAX. 126 Tray Material Heat Proof Temp.

Contextual Info: 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 EM47EM3288SBA Revision History Revision 0.1 May. 2012 -First release. Revision 0.2 (Feb. 2013) -Update ZQ pins description. May. 2012 1/38 www.eorex.com 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 EM47EM3288SBA 8Gb (32Mx8Bank×32) Double DATA RATE 3 Stack SDRAM

RTS5158

Abstract: northbridge G41 se u10i layout GM965 28K1 IC NS0013 sla5t bga676 rtl8010 C1087
Contextual Info: A B C D E X'TAL 14.318MHz Merom Processor System Power Rail Management Dual-Core CLOCK GEN ICS9LPR358AGLFT uFCPGA 478 2 3,4 FSB (667/800 MHz) FSB 4 GM965/PM965 ATI M74M USB 1 LVDS ＊V ＊VS HIGH HIGH ON ON ON ON S3 (Suspend to RAM) LOW HIGH HIGH HIGH ON

Contextual Info: AFE5804 SBOS442C – JUNE 2008 – REVISED OCTOBER 2011 www.ti.com FULLY-INTEGRATED, 8-CHANNEL ANALOG FRONT-END FOR ULTRASOUND 0.89nV/√Hz, 12-Bit, 40MSPS, 101mW/Channel Check for Samples: AFE5804 FEATURES DESCRIPTION • The AFE5804 is a complete analog front-end device

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O

EM47EM3288SBA

Contextual Info: EM47EM3288SBA Revision History Revision 0.1 May. 2012 -First release. Revision 0.2 (Feb. 2013) -Update ZQ pins description. Revision 0.3 (Apr. 2014) -Update tFAW. Apr. 2014 1/39 www.eorex.com EM47EM3288SBA 8Gb (32Mx8Bank×32) Double DATA RATE 3 Stack SDRAM

128M-BIT

Abstract: MCP market sram 128m image distribution 128-MBIT
Contextual Info: New products MB84VZ128A Stacked MCP Mounted with 128M-bit x16 Page Mode NOR-type Dual Operation Flash Memories (2 chips), 16M-bit (×16) Mobile FCRAMTM, and 4M-bit (×16) SRAM MB84VZ128A This is an MCP with a 256M-bit ROM and 20M-bit RAM. The combined density, 276M-bit, is the world's largest density for mobile purposes.

EM47EM3288MBA

Contextual Info: EM47EM3288MBA 8Gb 32Mx8Bank×32 Double DATA RATE 3 Stack SDRAM Features Description • VDD/VDDQ = 1.35V -0.065/+0.1V. • Backward compatible to VDD = VDDQ = 1.5V ±0.075V.Supports DDR3L devices to be backward compatible in 1.5V applications. • Fully differential clock inputs (CK, /CK) operation.

EM47FM3288SBB

Contextual Info: EM47FM3288SBB 16Gb 64Mx8Bank×32 Double DATA RATE 3 Stack SDRAM Features Description • JEDEC Standard VDD/VDDQ = 1.5V±0.075V. • All inputs and outputs are compatible with SSTL_15 interface. • Fully differential clock inputs (CK, /CK) operation. • Eight Banks

H2JTDG8UD2MBR

Abstract: H26M42003GMR H26M31003GMR H26M52002EQR H26M64002DQR H26M78003BFR H26M3100 H26M52002CKR H26M21001FPR H26M* hynix
Contextual Info: Page 1 Product Tech Density Block Size Stack Vcc/ Org Package Availability HY27US08281A 9xnm class 128Mb 16KB SDP 3.3v/ X8 TSOP Now HY27US08561A 9xnm class 256Mb 16KB SDP 3.3v/ X8 TSOP/ FBGA Now H27U518S2C 5xnm class 512Mb 16KB SDP 3.3v/ X8 TSOP/ LGA Now H27U1G8F2B

C1470 LM

Abstract: se u10i layout RTS5158 bga676 zd801 RTL8101E-GR PM965 hy5rs123235b W651DI R1287
Contextual Info: A B C D E X'TAL 14.318MHz Merom Processor System Power Rail Management Dual-Core CLOCK GEN ICS9LPR358AGLFT uFCPGA 478 2 3,4 FSB (667/800 MHz) FSB 4 PM965 ATI M74M USB 1 LVDS ＊V ＊VS HIGH HIGH ON ON ON ON S3 (Suspend to RAM) LOW HIGH HIGH HIGH ON ON OFF