vr7pu
Abstract: VR7PU567258GBD SODIMM DDR3 Mechanical Dimensions CB-172 VR7PU287258FBC VR7PU567258GBZ vr7pu287 VR7PU567258FBA VR7PU567258FBC 1066F
Text: DDR3 72bit Unbuffered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module
|
Original
|
72bit
128MX72
128Mx8
vr7pu
VR7PU567258GBD
SODIMM DDR3 Mechanical Dimensions
CB-172
VR7PU287258FBC
VR7PU567258GBZ
vr7pu287
VR7PU567258FBA
VR7PU567258FBC
1066F
|
PDF
|
SODIMM DDR3 Mechanical Dimensions
Abstract: VR7PA127258GBD DDR3 SODIMM SPD JEDEC VR7PA567258GBZ viking connector 12 pin
Text: DDR3 72bit Registered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module
|
Original
|
72bit
128MX72
128Mx8
SODIMM DDR3 Mechanical Dimensions
VR7PA127258GBD
DDR3 SODIMM SPD JEDEC
VR7PA567258GBZ
viking connector 12 pin
|
PDF
|
daewon tray
Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA
|
Original
|
AN-071-5
Hand-0444
daewon tray
Daewon T0809050
daewon tray 1F1-1717-AXX
strapack s-669
DAEWON tray 48
DAEWON JEDEC TRAY
DAEWON FBGA
KS-88085
1F1-1717-AXX
tray bga
|
PDF
|
160-FBGA-1212
Abstract: 160FBGA-1
Text: 160-FBGA-1212 SAMSUNG SEMICONDUCTOR, INC.
|
Original
|
160-FBGA-1212
160-FBGA-1212
160FBGA-1
|
PDF
|
MT41K256M32
Abstract: MT41K256M3 8Gb DDR3 SDRAM twindie MT41K256M16
Text: 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D – 136-ball FBGA
|
Original
|
MT41K256M32
MT41K256M16
MT41K256M32.
136-ball
DDR3L-1600)
DDR3L-1333)
DDR3L-1066)
09005aef84ad0652
MT41K256M32
MT41K256M3
8Gb DDR3 SDRAM twindie
|
PDF
|
H5TQ2G63FFR-RDC
Abstract: H5TQ4G63MFRPBC H5TC8G83AMR-PBA HMT351U7EFR8C-PB H5TQ2G63DFR-PBC
Text: Page 1 DDR3 SDRAM Solder- Dow n VDD DENSI TY ORG. SPEED PART NUMBER PKG. FEATURE AVAI L. 1.5V 2Gb 256Mx8 DDR3 1866 H5TQ2G83EFR-RDC FBGA 78ball 8Bank, 1.5V, CL13,13-13-13 Now DDR3 1600 H5TQ2G83CFR-PBC FBGA(78ball) 8Bank, 1.5V, CL11,11-11-11 Now H5TQ2G83EFR-PBC
|
Original
|
256Mx8
H5TQ2G83EFR-RDC
78ball)
H5TQ2G83CFR-PBC
H5TQ2G83EFR-PBC
H5TQ2G83CFR-H9C
H5TQ2G83EFR-H9C
H5TQ2G63FFR-RDC
H5TQ4G63MFRPBC
H5TC8G83AMR-PBA
HMT351U7EFR8C-PB
H5TQ2G63DFR-PBC
|
PDF
|
FBGA 12x12 TRAY
Abstract: nec 1230 JEDEC TRAY DIMENSIONS FBGA
Text: TRAY CONTAINER UNIT : mm 8x20=160 135°C MAX. 16.40 A' 12.30 114.8 FBGA12×12B 10.55 12.30 15.50 294.5 10.25 315.0 322.6 SECTION A – A' (6.35) (6.29) 12.30 12.00 7.62 135.9 PPE A Applied Package 209-pin Plastic FBGA (12×12) Quantity (pcs) 160 MAX. FBGA 12×12B
|
Original
|
FBGA12
209-pin
SSD-A-H7722-1
FBGA 12x12 TRAY
nec 1230
JEDEC TRAY DIMENSIONS FBGA
|
PDF
|
FBGA 152
Abstract: JEDEC tray standard 13 fBGA package tray JEDEC FBGA JEDEC TRAY DIMENSIONS FBGA
Text: TRAY CONTAINER UNIT : mm 8x19=152 112.0 NEC A' 13.40 16.15 12.15 13.40 16.00 11.95 FBGA13×13ESP 135°C MAX. 135.9 PPE A 290.7 315.0 322.6 SECTION A – A' 13.40 (5.95) (5.62) 7.62 13.00 Applied Package 144-pin Plastic FBGA (13×13) 160-pin Plastic FBGA (13×13)
|
Original
|
FBGA13
13ESP
144-pin
160-pin
161-pin
180-pin
197-pin
212-pin
225-pin
249-pin
FBGA 152
JEDEC tray standard 13
fBGA package tray
JEDEC FBGA
JEDEC TRAY DIMENSIONS FBGA
|
PDF
|
JEDEC FBGA
Abstract: fBGA package tray 12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray FBGA 12x12 ESP TRAY FBGA 12x12 TRAY FBGA 160 FBGA-12 fBGA 12 package tray
Text: TRAY CONTAINER UNIT : mm 8x20=160 NEC 114.8 12.30 7 135°C MAX. A' 12.30 15.50 10.25 294.5 315.0 322.6 Section A – A' (6.29) 12.30 12.00 (6.35) 7.62 16.40 FBGA12×12ESP-1 10.55 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA 12×12 ESP-1 121-pin Plastic FBGA (12×12)
|
Original
|
FBGA12
12ESP-1
121-pin
144-pin
160-pin
180-pin
204-pin
209-pin
337-pin
397-pin
JEDEC FBGA
fBGA package tray 12
JEDEC TRAY DIMENSIONS FBGA
fBGA package tray
FBGA 12x12 ESP TRAY
FBGA 12x12 TRAY
FBGA 160
FBGA-12
fBGA 12 package tray
|
PDF
|
JEDEC FBGA
Abstract: FBGA-12 JEDEC TRAY DIMENSIONS FBGA fBGA package tray
Text: TRAY CONTAINER UNIT : mm 8x20=160 NEC 114.8 135.9 PPE 12.30 7 A' 135°C MAX. 16.40 10.55 FBGA12×12ESP-1 A 12.30 15.50 294.5 10.25 315.0 322.6 SECTION A – A' (6.29) (6.35) 7.62 12.30 12.00 Applied Package Quantity (pcs) FBGA 12×12ESP-1 Tray 121-pin Plastic FBGA (12×12)
|
Original
|
FBGA12
12ESP-1
121-pin
144-pin
160-pin
180-pin
209-pin
337-pin
397-pin
JEDEC FBGA
FBGA-12
JEDEC TRAY DIMENSIONS FBGA
fBGA package tray
|
PDF
|
FBGA
Abstract: FBGA121 FBGA-12
Text: HEAT PROOF 7 12.2 10.55 16.40 A' 8x20=160 A 135°C MAX. NEC PPE 114.8 FBGA12×12×1.26 15.50 10.25 12.2 294.5 315.0 322.6 SECTION A-A' 6.32 (6.35) 12.2 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 121-pin Plastic FBGA ( 12) MAX. 160 Material 148-pin Plastic FBGA ( 12)
|
Original
|
FBGA12
121-pin
148-pin
FBGA
FBGA121
FBGA-12
|
PDF
|
MTFC4G
Abstract: MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI
Text: 4GB, 8GB, 16GB, 32GB: e•MMC Features e·MMC Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI, MTFC16GKQDI, MTFC32GKQDH Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant)
|
Original
|
MTFC16GKQDI,
MTFC32GKQDH
153-ball
169-ball
41-compliant
84-A441)
09005aef838eabba
j534q567r
MTFC4G
MTFC16G
micron emmc
MTFC32G
micron eMMC 100 ball BGA
MTfc8g
emmc csd
MTFC4
micron emmc 4.4
MTFC16GKQDI
|
PDF
|
m312l
Abstract: No abstract text available
Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.1 November. 2004 Revision 1.1 November 2004 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM
|
Original
|
512MB,
DDR400
60FBGA)
184pin
512Mb
125mil/1
200mil
m312l
|
PDF
|
H5TQ2G63BFR-H9C
Abstract: H5TQ1G83BFR-H9C H26M42001EFR H5RS1H23MFR h27u1g8f2b H27U1G8F2 H27UBG8T2A H27UBG8T H5MS2G22MFR-J3M H26M54001BKR
Text: Rev 0.0 Q2’2010 Databook C omputing Memory DDR3 SDRAM : Component VDD DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL. 1.5V 1Gb 256Mx4 DDR3 1333 H5TQ1G43BFR-H9C FBGA 78ball 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43TFR-H9C FBGA(78ball) 8Bank, 1.5V, CL9,9-9-9
|
Original
|
256Mx4
H5TQ1G43BFR-H9C
78ball)
H5TQ1G43TFR-H9C
H5TQ1G43BFR-G7C
H5TQ1G43TFR-G7C
H5TQ1G83BFR-H9C
H5TQ2G63BFR-H9C
H5TQ1G83BFR-H9C
H26M42001EFR
H5RS1H23MFR
h27u1g8f2b
H27U1G8F2
H27UBG8T2A
H27UBG8T
H5MS2G22MFR-J3M
H26M54001BKR
|
PDF
|
|
|
M312L2920BG0-CCC
Abstract: M312L5720BG0-CCC M312L6523BG0-CCC M312L2920BG0 DDR400 M312L2923BG0-CCC
Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.0 November. 2003 Revision 1.0 November 2003 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM
|
Original
|
512MB,
DDR400
60FBGA)
184pin
512Mb
125mil/1
200mil
M312L2920BG0-CCC
M312L5720BG0-CCC
M312L6523BG0-CCC
M312L2920BG0
M312L2923BG0-CCC
|
PDF
|
Untitled
Abstract: No abstract text available
Text: DATA SHEET 2G bits DDR2 Mobile RAM PoP 12mm x 12mm, 168-ball FBGA EDB2432BCPE Specifications Features • Density: 2G bits • Organization — 8M words × 32 bits × 8 banks • Data rate: 800Mbps (max.) • Package: 168-ball FBGA — Package size: 12.0mm × 12.0mm
|
Original
|
168-ball
EDB2432BCPE
800Mbps
M01E1007
E1881E20
|
PDF
|
MT41K256M32
Abstract: MT41K 256M32 MT41K256M16 MT41K256M32SGB-125M MT41K256M3 MT41K256M MT41K256 MT41K256M16 SPD FBGA DDR3 x32
Text: Preliminary‡ 8Gb: x32 TwinDie DDR3Lm SDRAM Description TwinDie 1.35V DDR3Lm SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (10mm x 14mm x 1.2mm) Rev. E
|
Original
|
MT41K256M32
MT41K256M16
MT41K256M32.
SAC305
09005aef84ab372c
MT41K256M32
MT41K
256M32
MT41K256M32SGB-125M
MT41K256M3
MT41K256M
MT41K256
MT41K256M16 SPD
FBGA DDR3 x32
|
PDF
|
MT41K512M16
Abstract: 96 ball fbga thermal resistance micron MT41K256M16 DDR3L 63 ball fbga thermal resistance micron micron marking code information marking micron MT41K256M16 DDR3 impedance 1m x16 SDRAM MICRON
Text: 8Gb: x16 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K512M16 – 32 Meg x 16 x 8 Banks Description Options Marking • Configuration – 32 Meg x 16 x 8 banks x 2 ranks • FBGA package Pb-free – 96-ball FBGA (10mm x 14mm x 1.2mm)
|
Original
|
MT41K512M16
MT41K256M16
MT41K512M16.
96-ballw
09005aef84ccb467
MT41K512M16
96 ball fbga thermal resistance micron
MT41K256M16
DDR3L
63 ball fbga thermal resistance micron
micron marking code information
marking micron MT41K256M16
DDR3 impedance
1m x16 SDRAM MICRON
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a
|
Original
|
184pin
512Mb
184-pin
128Mb
HYMD512G726BF
157max
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb C ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb C ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb C ver. based Registered DIMM series provide a
|
Original
|
184pin
512Mb
184-pin
128Mb
HYMD512G726CFP4N
157max
|
PDF
|
hynix module suffix
Abstract: DDR333 DDR400 DDR400B HYMD512G726BF4N DQSO d431
Text: 184pin Registered DDR SDRAM DIMMs based on 512Mb B ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 512Mb B ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 512Mb B ver. based Registered DIMM series provide a
|
Original
|
184pin
512Mb
184-pin
157max
hynix module suffix
DDR333
DDR400
DDR400B
HYMD512G726BF4N
DQSO
d431
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 512Mb: x16 Mobile LPDDR2 SDRAM S4 Features Mobile LPDDR2 SDRAM MT42L32M16D1 Features Options Marking • VDD2: 1.2V • Configuration – 8 Meg x 16 x 4 banks • Device type – LPDDR2-S4, 1 die in package • FBGA “green” package – 121-ball FBGA 6.5mm x 8mm
|
Original
|
512Mb:
MT42L32M16D1
09005aef8467caf2
|
PDF
|
Untitled
Abstract: No abstract text available
Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet − production data Features FBGA FBGA • ■ Core: ARM 32-bit Cortex -M3 CPU 120 MHz
|
Original
|
STM32F205xx
STM32F207xx
32-bit
150DMIPs,
Flash/128
|
PDF
|
DDR266
Abstract: DDR266B DDR333 DDR400 DDR400B HYMD512M646D
Text: 200pin DDR SDRAM SO-DIMMs based on 512Mb D ver. FBGA This Hynix unbuffered Small Outline, Dual In-Line Memory Module (DIMM) series consists of 512Mb D ver. DDR SDRAMs in 60 ball FBGA packages on a 200pin glass-epoxy substrate. This Hynix 512Mb D ver. based unbuffered
|
Original
|
200pin
512Mb
200-pin
DDR400,
DDR333
HYMD512M646D
DDR266
DDR266B
DDR400
DDR400B
|
PDF
|