Untitled
Abstract: No abstract text available
Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging
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FDZ7064N
FDZ7064N
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Untitled
Abstract: No abstract text available
Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a
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FDZ206P
FDZ206P
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F63TNR
Abstract: FDZ6966 F942B
Text: FC-36A 5 x 5.5 mm MOSFET BGA with 36 balls Tape and Reel Data FC-36A MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-36A MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled
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FC-36A
330cm
F63TNR
FDZ6966
F942B
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AT 30B
Abstract: F63TNR FC-30B FDZ6966 D9942
Text: FC-30B 4 x 3.5 mm MOSFET BGA with 30 balls Tape and Reel Data FC-30B MOSFET BGA Packaging Configuration: Figure 1.0 Moisture Sensitive Sticker Packaging Description: Antistatic Cover Tape FC-30B MOSFET BGA parts are shipped in tape. The carrier tape is made from a dissipative carbon filled
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FC-30B
330cm
AT 30B
F63TNR
FDZ6966
D9942
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AT 30B
Abstract: FC-30B 942b F942B
Text: FC-30B 3.5 x 4 mm MOSFET BGA Tape and Reel Dimensions FC-30B MOSFET BGA Packaging Configuration: Figure 1 F63TNR Label Packaging Description: FC-30B MOSFET BGA parts are shipped in tape. The carrier tape if made from a dissipative carbon filled polycarbonate resin. The cover tape is a multilayer film
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FC-30B
F63TNR
330cm
AT 30B
942b
F942B
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